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PIC24FJ256GB106-I/PT by microchip technology
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产品说明书

PIC24FJ256GB106-I/PT

Microchip Technology

MCU 16-bit - PIC24 Family PIC24FJ GB Series Microcontrollers - 256KB Flash - 2.5V/3.3V - 64-Pin. .. 查看完整描述

符合 RoHS
TRAY 包装
附件
附件
This product is backed by Ecco Electronics' Certificate of Compliance Guarantee. Rest assured you will receive the Manufacturer's Certificate of Compliance with your order. 合规证书保证
此产品可能需要额外文件。发货可能会延迟 1-2 天。
产品属性
属性值 选择属性
找到的产品: 0
供应商:
Microchip Technology
部件编号:
PIC24FJ256GB106-I/PT
RoHS:
Yes
HTS:
8542310020
COO:
TH
ECCN:
3A991.a.2
供应商标准包装 此信息提供给偏好按制造商标准包装数量的倍数购买的客户。最小订购数量和要求的订购倍数会与我们的价格和库存信息一起显示。
160
封装类型:
TRAY
工作温度:
-40 to 85 °C
程序存储器类型:
Flash
可编程I/O数量:
52
ADC分辨率:
10 bit
程序存储器容量:
256 KB
RAM容量:
16 KB
The PIC24FJ256GB106-I/PT is a 16bit, general purpose flash microcontroller in 64 pin TQFP package. The device has five 16bit timers, 16 channel 10bit A/D converter, three analogue comparators with programmable input/output configuration, hardware real time clock/calendar (RTCC) and charge time measurement unit (CTMU).
搜索关键词:
PIC24FJ256GB106IPT
  提供不同的包装选项。  查看替代品
有存货: 606
可立即发货
已订购:
1,440   可以发货 10/12/26 
最小订购数量:
5
工厂交货期
25 周
价格 (USD)
数量
单价
总价
5
$7.58
$37.90
25
$6.72
$168.00
50
$6.34
$317.00
160
$5.98
$956.80
320
$5.95
$1,904.00
640
$5.94
$3,801.60
1,120
$5.92
$6,630.40
2,560 +
$5.91
$15,129.60
供应商标准包装
产品更改
PDF PCN - 06-Nov-2009 - QUALIFICATION OF TQFP PACKAGE WITH SG-8300ECM MOLD COMPOUND AT MTAI ASSEMBLY SITE.
PDF PCN - 11-Nov-2011 - QUALIFICATION OF YGAN/Z/H/Q/R/S/U/W/Y, UCAA, UFAC, UFAD UGAA,UGAF MASKS WITHOUT POLYIMIDE PROCESS
PDF PCN - 10-Nov-2011 - Microchip is announcing the qualification of YGAN, YGAZ, YGAH, YGAQ, YGAR, YGAS, YGAU, YGAW, YGAY, U
PDF PCN - 11-Oct-2013 - Microchip is announcing the qualification of masks UDAAx, UFACx, UGABx and YGAYx at an additional wa
PDF PCN - 11-Oct-2013 - Microchip is announcing the qualification of MTAI assembly site with palladium coated copper (PdCu)
PDF PCN - 15-Nov-2013 - QUALIFICATION OF SELECTED PRODUCTS AVAILABLE IN THE 64L TQFP PACKAGE WITH PALLADIUM COATED COPPER
PDF PCN - 22-May-2015 - QUALIFICATION OF A NEW 13 INCH PLASTIC REEL WITH SMALLER WINDOW FOR SELECTED PACKAGES AT MTAI, MMT
PDF PCN - 01-Nov-2015 - INTEGRATION OF THE MICREL PCN SYSTEM WITH THE MICROCHIP PCN SYSTEM
PDF PCN - 01-Nov-2016 - IMPLEMENT PACKING CHANGES WITHOUT INNER BOX FOR MSL 1 MICROCHIP PRODUCTS SHIPPED FROM ALL LOCATIONS
PDF PCN - 01-Sep-2009 - MPLAB C FOR PIC24/DSPIC V3.20 RELEASED
PDF PCN - 13-Jul-2011 - ERRATA-PIC24FJ256GB110 FAMILY SILICON/DATA SHEET ERRATA
PDF PCN - 28-Nov-2011 - ERRATA-PIC24FJ256GB110 FAMILY SILICON/DATA SHEET ERRATA DOCUMENT REVISION
PDF PCN - 23-Oct-2009 - Microchip is announcing the final qualification of the TQFP package with SG-8300ECM mold compound at
PDF PCN - 03-Jan-2014 - QUALIFICATION OF MASKS UDAAX, UFACX, UGABX & YGAYX AT AN ADDITIONAL WAFER FABRICATION SITE
PDF PCN - 10-Mar-2011 - Microchip is announcing the qualification of YGANx, YGAYx, YGAWx, YGAUx, YGASx, YGARx, and YGAQx mas
PDF PCN - 22-Jul-2009 - Microchip is qualifying the TQFP package with SG-8300ECM mold compound at MTAI assembly site in orde
PDF PCN - 01-Nov-2016 - IMPLEMENT PACKING CHANGES WITHOUT INNER BOX FOR MSL 1 MICROCHIP PRODUCTS SHIPPED FROM ALL LOCATIONS
PDF PCN - 19-Nov-2015 - CCB 1727 FINAL NOTICE IMPLEMENT LABEL AND PACKING CHANGES FOR MICROCHIP PRODUCTS
PDF PCN - 04-Feb-2021 - CUSTOMERS TO IMMEDIATELY PLACE THEIR 12-MONTH NON-CANCELLABLE NON-RESCHEDULABLE BACKLOG ON MICROCHIP
PDF PCN - 03-Mar-2009 - MPLAB C COMPILER DSPIC DSCS V3.12 HAS BEEN RELEASED TO THE WEB
PDF PCN - 14-Jan-2011 - QUALIFICATION OF YGANX, YGAYX, YGAWX, YGAUX, YGASX, YGARX, AND YGAQX MASKS AT ADDITIONAL WAFER SITE
PDF PCN - 14-Jul-2011 - ERRATA-PIC24FJ256GA110 FAMILY SILICON/DATA SHEET ERRATA
PDF PCN - 04-Mar-2011 - Microchip is announcing the qualification of YGAN, YGAZ, YGAH, YGAQ, YGAR, YGAS, YGAU, YGAW, YGAY, U
PDF PCN - 09-Feb-2022 - PIC24FJ256GB110 FAMILY SILICON/DATA SHEET ERRATA DOCUMENT REVISION
PDF PCN - 01-Jun-2011 - QUALIFICATION OF YGAN/Z/H/Q/R/S/U/W/Y, UCAA, UFAC, AND UFAD MASKS WITHOUT POLYIMIDE PROCESS
PDF PCN - 05-Aug-2010 - Microchip is announcing the implementation of shipping label and package change for the listed produ
PDF PCN - 01-Aug-2014 - QUALIFICATION OF C194 LEAD-FRAME IN 64L AND 44L TQFP (10X10) PACKAGES AT ANAP (ATP) ASSEMBLY SITE
PDF PCN - 23-Oct-2009 - QUALIFICATION OF TQFP PACKAGE WITH SG-8300ECM MOLD COMPOUND AT MTAI ASSEMBLY SITE
PDF PCN - 19-Feb-2010 - ERRATA - PIC24FJ256GB110 FAMILY REV. A3 SILICON ERRATA
PDF PCN - 14-Jan-2011 - QUALIFICATION OF YGANX, YGAYX, YGAWX,YGAUX, YGASX, YGARX,YGAQX MASKS AT AN ADDITIONAL WAFER
PDF PCN - 15-Feb-2011 - Microchip is announcing the change in package and implementation of new shipping labels for all list
PDF PCN - 29-Jan-2014 - Microchip is expanding its test facilities to Microchip Thailand (MMT) for all commercial products i
PDF PCN - 22-Jan-2013 - ERRATA-PIC24FJ256GB110 FAMILY SILICON/DATA SHEET ERRATA
PDF PCN - 22-May-2015 - QUALIFICATION OF A NEW 13 INCH PLASTIC REEL WITH SMALLER WINDOW FOR SELECTED PACKAGES
PDF PCN - 17-Dec-2009 - MICROCHIP HAS RELEASED A NEW DEVICEDOC
PDF PCN - 10-Nov-2010 - Microchip is announcing the amended of its previous notice CYER-05LNSD835 which announces the implem
PDF PCN - 02-Jun-2011 - Microchip is announcing the qualification of 64L QFN (9x9) packages with EFTEC-64T leadframe at NSEB
PDF PCN - 08-Aug-2013 - Microchip is implementing a convention change to the sales order (SO) number for the listed products
PDF PCN - 03-Jan-2014 - QUALIFICATION OF MASKS UDAAX, UFACX, UGABX & YGAYX AT AN ADDITIONAL WAFER FABRICATION SITE
PDF PCN - 02-Sep-2011 - MPLAB C FOR PIC24 AND DSPIC V3.30 RELEASED.
PDF PCN - 11-Nov-2011 - QUALIFICATION OF YGAN/Z/H/Q/R/S/U/W/Y, UCAA, UFAC, AND UFAD MASKS WITHOUT POLYIMIDE PROCESS
PDF PCN - 02-Aug-2012 - Microchip is announcing the qualification of YGANx, YGAYx, YGAWx, YGAUx, YGASx, YGARx, and YGAQx mas
PDF PCN - 01-Sep-2014 - QUALIFICATION OF C194 LEAD-FRAME IN 64L AND 44L TQFP (10X10) PACKAGES AT ANAP (ATP) ASSEMBLY SITE
PDF PCN - 01-Sep-2014 - QUALIFICATION OF C194 LEAD-FRAME IN 64L AND 44L TQFP (10X10) PACKAGES AT ANAP (ATP) ASSEMBLY SITE
PDF PCN - 20-May-2015 - QUALIFICATION OF A NEW 13 INCH PLASTIC REEL WITH SMALLER WINDOW FOR SELECTED PACKAGES
PDF PCN - 27-Apr-2018 - QUALIFICATION OF CUPDAU BOND WIRE IN SELECTED PRODUCTS AVAILABLE IN 64L AND AND 44L TQFP PACKAGE
PDF PCN - 01-Sep-2017 - IMPLEMENT MARKING CHANGES FOR VIRTUALLY ALL ATMEL PRODUCTS
PDF PCN - 15-Nov-2013 - QUALIFICATION OF SELECTED PRODUCTS AVAILABLE IN THE 64L TQFP PACKAGE WITH PALLADIUM COATED COPPER
PDF PCN - 19-Nov-2015 - CCB 1727 FINAL NOTICE: IMPLEMENT LABEL AND PACKING CHANGES FOR MICROCHIP PRODUCTS
PDF PCN - 15-Sep-2010 - MICROCHIP HAS RELEASED A NEW DEVICEDOC FOR THE PIC24FJ256GB110
PDF PCN - 27-Sep-2011 - Microchip is announcing the qualification of YGAN, YGAZ, YGAH, YGAQ, YGAR, YGAS, YGAU, YGAW, YGAY, U
PDF PCN - 11-Oct-2013 - IMPLEMENT A CONVENTION CHANGE TO THE SALES ORDER (SO) NUMBER
PDF PCN - 01-Nov-2015 - INTEGRATION OF THE MICREL PCN SYSTEM WITH THE MICROCHIP PCN SYSTEM
PDF PCN - 01-Sep-2017 - IMPLEMENT MARKING CHANGES FOR VIRTUALLY ALL ATMEL PRODUCTS
PDF Product Change Notification

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