104549-1 is a fine pitch surface-mount stacking connector designed for parallel board-to-board applications with 10 positions and 0.050 inch (1.27 mm) center spacing. The connector features a double-row vertical configuration with a glass-filled black thermoplastic housing rated 54V-0, and phosphor bronze contacts plated with 0.0076 inch gold in the mating area and 0.0038 inch tin-lead on the solder tail, with complete nickel underplating of 0.0127 inch. Key dimensions include an overall length of 0.380 inches (9.65 mm), width of 0.200 inches (5.08 mm), and a contact hole diameter of 0.042 inches (1.07 mm) typical. This connector is ideal for compact electronic assemblies requiring reliable board-to-board interconnection in space-constrained applications such as telecommunications, computing, and industrial equipment.