The ATS-61310K-C1-R0 is a 31.00 x 31.00 x 14.50 mm fanSINK™ designed for effective thermal management of BGA devices. It features X-Cut straightFIN fins that provide omnidirectional airflow for optimal performance regardless of PCB layout. The unit includes a pre-assembled Chomerics T412 thermal interface material and utilizes the proven maxiGRIP™ attachment system, which avoids the need for PCB through-holes. With a thermal resistance of 2.10 °C/W in unducted flow at 1.0 m/s and compliance with Telecordia and MIL-STD-810 shock and vibration standards, this heat sink is ideal for high-reliability applications.