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DATA SHEET

374724B60024G

Boyd Laconia LLC

Heat Sink Passive BGA/FPGA Pin Array Adhesive Aluminum 15.3A°C/W Black Anodized

RoHS Compliant

Packaging

Accessories

Certificate of Compliance Guarantee

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Products found: 0

Supplier:

Boyd Laconia LLC

Part No:

374724B60024G

Alias/AKA:

306220

RoHS:

Yes

HTS:

8542900000

COO:

ECCN:

EAR99

Supplier Standard Pack This information is provided for customers who prefer to buy in multiples of the Manufacturer’s Standard Package quantity. Minimum Order Quantities and Required Order Multiples are presented with our price and availability information.

This information is provided for customers who prefer to buy in multiples of the Manufacturer’s Standard Package quantity. Minimum Order Quantities and Required Order Multiples are presented with our price and availability information.

168

Device Cooled:

BGA6707,FPGA6707

Attachment Method:

Solder Anchor6706

Dimension:

35 x 35 x 186714mm

Thermal Resistance:

15.36717°C/W

Finish:

Black Anodized6710

Heat Sink Passive BGA/FPGA Pin Array Adhesive Aluminum 15.3A°C/W Black Anodized

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374724B60024G

IN STOCK: 1,412

Can Ship immediately

BONDED Quantity:

Manufacturer Stock:

On Order:

Stock lot only:

Minimum Order Quantity:

MOQ for out of Stock Qty:

Multiple:

Factory Lead-Time

6 Weeks

This product is no longer being manufactured but there may be alternatives. We can help you, Contact Us.

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Min quantity should be greater than or equal () in order to activate the custom price. Otherwise you will get the normal price.

Price (USD)

Quantity

Unit Price

Ext. Price

$4.17

$41.70

$3.39

$169.50

168

$3.24

$544.32

336

$3.15

$1,058.40

504

$2.97

$1,496.88

1,008

$2.83

$2,852.64

2,520

$2.61

$6,577.20

5,040 +

$2.58

$13,003.20

Suppliers Standard Package

Please Note: Tariffs may apply for U.S. shipments

Product Guides

Datasheet

ECCO Electronic Connector- Authorized Distributor of Electronic Components

374724B60024G

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Standard Packaging