530614B00000G by boyd laconia llc
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DATA SHEET

530614B00000G

Boyd Laconia LLC

The 530614B00000G is an aluminum, channel-style board-level heat sink designed for cooling TO-220 and TO-220-single gauge semiconductor devices. .. see full description

RoHS Compliant
Bulk Packaging
Accessories
Accessories
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Supplier:
Boyd Laconia LLC
Part No:
530614B00000G
Alias/AKA:
001725
RoHS:
Yes
HTS:
8473309000
COO:
CN
ECCN:
EAR99
Supplier's Standard Package The item count, length, weight, or volume contained in the supplier’s original packaging for efficient storage, handling, and distribution.
2000
Package Type:
Bulk
Device Cooled:
TO-220
Attachment Method:
Screw
Dimension:
25.4 x 29.97 x 12.7 mm
Thermal Resistance:
16.7 °C/W
Finish:
Black Anodized
The 530614B00000G is a board-level channel heat sink intended for the thermal management of TO-220 and TO-220-single gauge packaged devices. Constructed from aluminum with a black anodize finish, this heat sink has a height of 29.97 mm, a width of 25.40 mm, and a length of 12.70 mm. It can be mounted either horizontally or vertically, offering design flexibility. Based on performance data, it provides a thermal resistance of approximately 10 °C/Watt under natural convection. This RoHS compliant component is ideal for applications requiring efficient heat dissipation from power transistors and voltage regulators in a compact footprint.
Search Keywords:
530614B00000G
IN STOCK: 2,026
Can Ship immediately
Minimum Order Quantity:
10
Factory Lead-Time
6 Weeks
Price (USD)
Quantity
Unit Price
Ext. Price
10
$3.03
$30.30
50
$2.68
$134.00
250
$2.43
$607.50
500
$2.32
$1,160.00
2,000
$2.19
$4,380.00
4,000 +
$2.18
$8,720.00