531302B02500G is an extruded aluminum board level heat sink from the Extruded 5310 series, designed to cool TO-202 and TO-220 semiconductor devices. This dual radial heat sink features a black anodize finish and requires a mounting kit for device attachment. The heat sink has dimensions of 34.92 mm width, 12.70 mm length, and 63.50 mm height ("H" dimension), with a vertical mounting direction. Additional mounting dimensions include "X" Dim of 12.70 mm, "Y" Dim of 0.79 mm, and "Z" Dim of 2.67 mm. This RoHS compliant heat sink is ideal for board level thermal management applications requiring efficient heat dissipation from power transistors and voltage regulators.