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Amphenol Industrial High-Power Interconnects for AI Data Center Infrastructure
Power the future of AI with Amphenol Industrial’s high-performance interconnect solutions. From high-current power distribution to board-level connectivity, these rugged, scalable products support the demanding power, efficiency, and reliability needs of modern data centers and AI compute systems.
- Built for AI Power Demands: High-current interconnect solutions support the growing power requirements of AI servers, GPU clusters, and hyperscale data centers.
- High-Density Power Distribution: Compact designs like RADSOK® Board|Power and SURLOK Plus enable efficient power delivery in space-constrained server and rack architectures.
- Proven Contact Technology: RADSOK® technology ensures low insertion force, high conductivity, and superior reliability for mission-critical AI workloads.
- Scalable System Architecture: Product families including UPC, AMPHE-PD, and AMPHE-PRB support modular power distribution from board-level to rack-level systems.
- Efficiency & Thermal Performance: Optimized designs reduce resistance and heat generation, improving overall system efficiency and uptime in high-load environments.
- Rugged & Reliable Connectivity: Amphenol Industrial solutions deliver durability, secure connections, and long lifecycle performance for always-on data center operations.
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