The G125-F1MS110-075-FS1 is a flexible PCB assembly featuring a single-layer polyimide substrate with dual connectors and 10 total contacts, designed for flexible interconnect applications requiring compact routing and dynamic bending. The assembly utilizes a 50 µm polyimide base with 35 µm copper cladding, 50 µm bonded coverlay, and locally rigidified FR4 areas at connector interfaces, with ENIG surface finish on exposed copper. Electrical performance includes a maximum current rating of 0.4 A per track, insulation resistance of 10 GO minimum at 500 V DC, and voltage proof of 600 V DC or AC peak. The flexible section has a nominal thickness of 0.185 mm with a minimum static bend radius of 1.85 mm and is suitable for dynamic operation above 3.70 mm bend radius. This assembly is ideal for applications requiring reliable signal and power distribution in space-constrained or flexing environments such as consumer electronics, medical devices, and industrial equipment.