MDM96519-559 is a microminiature connector from ITT Cannon's MDM series, designed for high-density interconnect applications in harsh environments. The connector features microsocket contacts with 0.050" (1.27 mm) contact spacing in a 0.100" x 0.100" (2.54 mm x 2.54 mm) grid pattern with 0.050" (1.27 mm) offset. It includes an interfacial seal and jackscrew/jackpost bushing hardware for secure mating. These connectors are commonly used in aerospace, defense, instrumentation, and medical applications where reliable, compact interconnect solutions are required.