24LC128T-I/SN by microchip technology

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24LC128T-I/SN

Microchip Technology

EEPROM - Serial-I²C - 128Kb (16K x 8) - 2.5V/3.3V/5V - 8-Pin SOIC - Tape&Reel .. see full description

RoHS Compliant

REEL Packaging

Accessories

Certificate of Compliance Guarantee

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Supplier:

Microchip Technology

Part No:

24LC128T-I/SN

RoHS:

Yes

HTS:

8542320051

COO:

CN

ECCN:

EAR99

Supplier Standard Pack This information is provided for customers who prefer to buy in multiples of the Manufacturer’s Standard Package quantity. Minimum Order Quantities and Required Order Multiples are presented with our price and availability information.

This information is provided for customers who prefer to buy in multiples of the Manufacturer’s Standard Package quantity. Minimum Order Quantities and Required Order Multiples are presented with our price and availability information.

3300

Package Type:

REEL

Data Retention:

200(Min) Year

The 24LC128T-I/SN is a 128kB I²C CMOS serial Electrically Erasable Programmable Read-Only Memory (EEPROM) capable of operation across a broad voltage range 1.7 to 5.5V. It has been developed for advanced, low-power applications such as personal communications or data acquisition. This device also has a page write capability of up to 64 bytes of data. This device is capable of both random and sequential reads up to the 128K boundary. Functional address lines allow up to eight devices on the same bus, for up to 1Mb address space.

Product Highlights:

Potential Applications:

Search Keywords:

24LC128TISN

IN STOCK: 4,290

Can Ship immediately

BONDED Quantity:

0

Manufacturer Stock:

0

On Order:

Stock lot only:

Minimum Order Quantity:

500

MOQ for out of Stock Qty:

Multiple:

1

Factory Lead-Time

5 Weeks

This product is no longer being manufactured but there may be alternatives. We can help you, Contact Us.

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Min quantity should be greater than or equal () in order to activate the custom price. Otherwise you will get the normal price.

Price (USD)

Quantity

Unit Price

Ext. Price

500

$0.746

$373.000

1,000

$0.731

$731.000

3,300

$0.717

$2,366.100

6,600

$0.715

$4,719.000

9,900

$0.710

$7,029.000

13,200

$0.708

$9,345.600

16,500

$0.707

$11,665.500

26,400 +

$0.705

$18,612.000

Supplier's Standard Package

Product Guides

Product Changes

PCN - 16-Nov-2021 - DATA SHEET - 24AA128/24LC128/24FC128 128-KBIT I2C SERIAL EEPROM DATA SHEET

PCN - 24-Aug-2015 - QUALIFICATION OF LPI ASSEMBLY SITE AS AN ADDITIONAL SITE FOR SELECTED PRODUCTS IN 8L SOIC PACKAGE

PCN - 12-Apr-2017 - QUALIFICATION OF CUPDAU BOND WIRE IN SELECTED PRODUCTS

PCN - 04-Feb-2021 - CUSTOMERS TO IMMEDIATELY PLACE THEIR 12-MONTH NON-CANCELLABLE NON-RESCHEDULABLE BACKLOG ON MICROCHIP

PCN - 08-Apr-2015 - QUALIFICATION OF GTK ASSEMBLY SITE AS AN ADDITIONAL SITE FOR SELECTED PRODUCTS IN 8L SOIC PACKAGE

PCN - 13-Jul-2006 - QUALIFICATION OF 8L TSSOP AT VGT

PCN - 01-Feb-2018 - QUALIFICATION OF CUPDAU BOND WIRE IN SELECTED PRODUCTS

PCN - 24-Nov-2015 - QUALIFICATION OF 220K (0.18 MICRON) PROCESS TECHNOLOGY FOR SELECTED PRODUCTS

PCN - 18-Aug-2014 - QUALIFICATION OF PALLADIUM COATED COPPER (PDCU) BOND WIRE FOR SELECTED PRODUCTS WAFER TECHNOLOGIES

PCN - 22-Mar-2021 - QUALIFICATION OF A NEW LEAD FRAME DESIGN FOR SELECTED PRODUCTS AVAILABLE IN 8L SOIC PACKAGE

PCN - 20-May-2015 - QUALIFICATION OF A NEW 13 INCH PLASTIC REEL WITH SMALLER WINDOW FOR SELECTED PACKAGES AT MTAI, MMT

PCN - 05-Aug-2010 - Microchip is announcing the implementation of shipping label and package change for the listed produ

PCN - 30-Nov-2011 - Microchip is announcing the qualification of 8L SOIC with SG-8300GM mold compound at ALPH (MMT) asse

PCN - 07-Apr-2022 - MANUFACTURING CHANGE

PCN - 22-Jun-2015 - QUALIFICATION OF GTK ASSEMBLY SITE AS AN ADDITIONAL SITE FOR SELECTED PRODUCTS IN 8L SOIC PACKAGE

PCN - 12-Jul-2010 - Microchip is announcing the conversion of listed 24LC128, 24FC128 and 24AA128 EEPROMs product famili

PCN - 26-Jan-2009 - Microchip Technology is changing the shipping materials from moisture barrier bag to static shielded

PCN - 25-Sep-2007 - LABEL SIZE CHANGE FROM ALUMINUM BAGS & INNER BOXES 17X4 CM2 TO 14X4 CM2

PCN - 08-Apr-2015 - QUALIFICATION OF GTK ASSEMBLY SITE AS AN ADDITIONAL SITE FOR SELECTED PRODUCTS

PCN - 06-Mar-2006 -

PCN - 10-Oct-2016 - IMPLEMENT PACKING CHANGES WITHOUT INNER BOX FOR MSL 1 MICROCHIP PRODUCTS SHIPPED FROM ALL LOCATIONS

PCN - 06-Mar-2006 - QUALIFICATION OF NEW PLATING SITE FOR SNPB & MATTE TIN PLATING

PCN - 07-Oct-2005 - 8L SOIJ 208'' PACKAGE QUALIFICATION AT NEW ASSEMBLY PLANT NSE2 (NS ELECTRONICS, BANGKOK)

PCN - 07-May-2015 - QUALIFICATION OF A NEW 13 INCH PLASTIC REEL WITH SMALLER WINDOW FOR SELECTED PACKAGES AT MTAI, MMT

PCN - 24-Jan-2008 - Change in Inner Box Label Format MTAI to include additional Bar Code for total quantity of parts shi

PCN - 21-Oct-2008 - Microchip is changing the Format and adding quantity barcode to the standard die/wafer inner box lab

PCN - 10-Oct-2016 - IMPLEMENT PACKING CHANGES WITHOUT INNER BOX FOR MSL 1 MICROCHIP PRODUCTS SHIPPED FROM ALL LOCATIONS

PCN - 23-Sep-2010 - QUALIFICATION OF 8 & 14L SOIC PACKAGES WITH SG-8300GM MOLD COMPOUND AT MTAI ASSEMBLY SITE

PCN - 07-May-2015 - QUALIFICATION OF A NEW 13 INCH PLASTIC REEL WITH SMALLER WINDOW FOR SELECTED PACKAGES

PCN - 21-Sep-2015 - INTEGRATION OF THE MICREL PCN SYSTEM WITH THE MICROCHIP PCN SYSTEM

PCN - 08-Oct-2007 - QUALIFICATION OF GE800 MOLD COMPOUND IN ASSORTED PDIP/SPDIP PACKAGES AT ALPH

PCN - 22-Sep-2011 - QUALIFICATION OF 8L SOIC WITH SG-8300GM MC AT ALPH (MMT) ASSEMBLY SITE

PCN - 23-Apr-2001 -

PCN - 11-Nov-2004 -

PCN - 08-Apr-2015 - QUALIFICATION OF LPI ASSEMBLY SITE AS AN ADDITIONAL SITE FOR SELECTED PRODUCTS IN 8L SOIC PACKAGE

PCN - 15-Feb-2011 - Microchip is announcing the change in package and implementation of new shipping labels for all list

PCN - 28-Apr-2011 - Microchip is announcing the qualification of listed memory products in 8L SOIC, 8L SOIJ, 8L PDIP, 8L

PCN - 10-Nov-2010 - Microchip is announcing the amended of its previous notice CYER-05LNSD835 which announces the implem

PCN - 01-Feb-2018 - QUALIFICATION OF CUPDAU BOND WIRE IN SELECTED PRODUCTS

PCN - 30-Nov-2011 - QUALIFICATION OF 8L SOIC WITH SG-8300GM MC AT ALPH (MMT) ASSEMBLY SITE

PCN - 19-Apr-2010 - QUALIFICATION OF 8L, 14L, & 16L PDIP AT GTK (GRTK) ASSEMBLY SITE.

PCN - 16-Nov-2010 - CONVERSION OF 24LC128, 24FC128 AND 24AA128 PRODUCT FAMILIES TO 160K

PCN - 12-Apr-2017 - QUALIFICATION OF CUPDAU BOND WIRE IN SELECTED PRODUCTS

PCN - 12-Jul-2017 - QUALIFICATION OF CUPDAU BOND WIRE IN SELECTED PRODUCTS

PCN - 02-Nov-2007 - CHANGE IN BOM

PCN - 10-Sep-2019 - MICROCHIP HAS RELEASED A NEW PRODUCT DOCUMENTS FOR THE 24AA128/24LC128/24FC128 DATA SHEET OF DEVICES

PCN - 11-Nov-2004 - CHANGE FROM SNPB (TIN/LEAD) PLATING TO MATTE TIN (SN) PLATING ON THE DEVICE LEADS

PCN - 09-Feb-2021 - QUALIFICATION OF A NEW LEAD FRAME DESIGN FOR SELECTED PRODUCTS AVAILABLE IN 8L SOIC PACKAGE

PCN - 13-Jul-2006 - QUALIFICATION OF 14L TSSOP AT ATP

PCN - 30-Jan-2006 -

PCN - 13-Jan-2011 - Microchip is announcing the qualification of listed memory products in 8L SOIC, 8L SOIJ, 8L PDIP, 8L

PCN - 08-Aug-2013 - IMPLEMENT A CONVENTION CHANGE TO THE SALES ORDER (SO) NUMBER

PCN - 29-Jan-2015 - QUALIFICATION OF PALLADIUM COATED COPPER (PDCU) BOND WIRE FOR SELECTED PRODUCTS WAFER TECHNOLOGIES

PCN - 16-Feb-2022 - MANUFACTURING CHANGE

PCN - 08-Nov-2010 - Microchip is announcing the qualification of listed 8 & 14L SOIC package products with SG-8300GM mol

PCN - 29-Jan-2015 - QUALIFICATION OF PALLADIUM COATED COPPER (PDCU) BOND WIRE FOR SELECTED PRODUCTS WAFER TECHNOLOGIES

PCN - 11-Jul-2017 - IMPLEMENT MARKING CHANGES FOR VIRTUALLY ALL ATMEL PRODUCTS

PCN - 28-Apr-2011 - QUALIFICATION OF MEMORY PRODUCTS WITH PALLADIUM COATED COPPER (CUPD) WIRE AT MTAI ASSEMBLY SITE

PCN - 14-Sep-2005 - QUALIFICATION OF 8L SOIC AT NEW ASSEMBLY SITE VIGILANT,THAILAND

PCN - 20-May-2015 - QUALIFICATION OF A NEW 13 INCH PLASTIC REEL WITH SMALLER WINDOW FOR SELECTED PACKAGES

PCN - 25-Sep-2007 - Change in shipping box dimensions and lables at MTAI for all Microchip catalog parts Packed in reels

PCN - 22-Jan-2004 - QUALIFY MTAI ASSEMBLY FOR LARGE PADDLES (82X94 MILS AND 84X105.6 MILS)

PCN - 12-Jul-2010 - CONVERSION OF 24LC128, 24FC128 AND 24AA128 PRODUCT FAMILIES TO 160K

PCN - 22-Jun-2015 - QUALIFICATION OF GTK ASSEMBLY SITE AS AN ADDITIONAL SITE FOR SELECTED PRODUCTS IN 8L SOIC PACKAGE

PCN - 21-Jun-2016 - QUALIFICATION OF G600V MOLDING COMPOUND FOR PRODUCTS AVAILABLE IN 8L SOIC CHIP AT MTAI ASSEMBLY SITE

PCN - 06-Nov-2003 -

PCN - 17-Jan-2006 - QUALIFICATION OF 8L TSSOP PACKAGE WITH HALOGENFREE MATERIALS AT UNISEM

PCN - 02-Oct-2016 - QUALIFICATION OF G600V MOLDING COMPOUND FOR PRODUCTS AVAILABLE IN 8L SOIC CHIP AT MTAI ASSEMBLY SITE

PCN - 12-Jul-2017 - QUALIFICATION OF CUPDAU BOND WIRE IN SELECTED PRODUCTS

PCN - 21-Sep-2015 - INTEGRATION OF THE MICREL PCN SYSTEM WITH THE MICROCHIP PCN SYSTEM

PCN - 22-Jan-2004 -

PCN - 08-Apr-2015 - QUALIFICATION OF LPI ASSEMBLY SITE AS AN ADDITIONAL SITE FOR SELECTED PRODUCTS IN 8L SOIC PACKAGE

PCN - 20-Mar-2017 - QUALIFICATION OF CUPDAU BOND WIRE IN SELECTED PRODUCTS

PCN - 30-Jun-2010 - Microchip has released a new DeviceDoc for the 24AA128/24LC128/24FC128 data sheet of devices.

PCN - 23-Sep-2015 - CCB 1727 FINAL NOTICE: IMPLEMENT LABEL AND PACKING CHANGES FOR MICROCHIP PRODUCTS

PCN - 02-Oct-2016 - QUALIFICATION OF G600V MOLDING COMPOUND FOR PRODUCTS AVAILABLE IN 8L SOIC CHIP AT MTAI ASSEMBLY SITE

PCN - 26-May-2005 -

PCN - 24-Aug-2011 - Microchip is announcing the qualification of 8L, 14L, 16L, 20L PDIP, & 28L SPDIP with CRM-1064L die

PCN - 09-Nov-2011 - Microchip is announcing the qualification of 8L, 14L, 16L, 20L PDIP, & 28L SPDIP with CRM-1064L die

PCN - 23-Sep-2010 - Microchip is announcing the qualification of listed 8 & 14L SOIC package products with SG-8300GM mol

PCN - 16-Mar-2001 - MICROCHIP IS OPENING A NEW FAB LOCATED IN GRESHAM, OREGON

PCN - 24-Aug-2015 - QUALIFICATION OF LPI ASSEMBLY SITE AS AN ADDITIONAL SITE FOR SELECTED PRODUCTS IN 8L SOIC PACKAGE

PCN - 18-Aug-2014 - QUALIFICATION OF PALLADIUM COATED COPPER (PDCU) BOND WIRE FOR SELECTED PRODUCTS WAFER TECHNOLOGIES

PCN - 19-Feb-2018 - QUALIFICATION OF CUPDAU BOND WIRE IN SELECTED PRODUCTS

PCN - 22-Sep-2011 - Microchip is announcing the qualification of 8L SOIC with SG-8300GM MC at ALPH (MMT) assembly site f

PCN - 08-Nov-2010 - QUALIFICATION OF 8 & 14L SOIC PACKAGES WITH SG-8300GM MOLD COMPOUND AT MTAI ASSEMBLY SITE.

PCN - 11-Jul-2017 - IMPLEMENT MARKING CHANGES FOR VIRTUALLY ALL ATMEL PRODUCTS

PCN - 09-Feb-2021 - QUALIFICATION OF A NEW LEAD FRAME DESIGN FOR SELECTED PRODUCTS

PCN - 22-Jan-2004 -

PCN - 23-Sep-2015 - CCB 1727 FINAL NOTICE IMPLEMENT LABEL AND PACKING CHANGES FOR MICROCHIP PRODUCTS

PCN - 08-Aug-2013 - Microchip is implementing a convention change to the sales order (SO) number for the listed products

PCN - 02-Sep-2011 - Microchip is announcing the qualification of the listed memory products in 8L SOIC, 8L SOIJ, 8L PDIP

PCN - 24-Jan-2008 - CHANGE IN INNER BOX LABEL FORMAT TO INCLUDE ADDITIONAL BAR CODE

PCN - 01-Feb-2022 - CANCEL QUALIFICATION OF A NEW LEAD FRAME DESIGN FOR SELECTED PRODUCTS

PCN - 13-Jan-2011 - QUALIFICATION OF MEMORY PRODUCTS WITH PALLADIUM COATED COPPER (CUPD) WIRE AT MTAI ASSEMBLY SITE

PCN - 24-Nov-2015 - QUALIFICATION OF 220K (0.18 MICRON) PROCESS TECHNOLOGY FOR SELECTED PRODUCTS

PCN - 29-Jan-2014 - Microchip is expanding its test facilities to Microchip Thailand (MMT) for all commercial products i

Product Change Notification