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MCP1703T-5002E/MB by microchip technology
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DATA SHEET

MCP1703T-5002E/MB

Microchip Technology

Fixed LDO Voltage Regulator - 2.7V to 16V - 330mV Dropout - 5Vout - 250mAout - SOT-89 - 4-Pin(3+Tab). .. see full description

RoHS Compliant
REEL Packaging
Accessories
Accessories
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Supplier:
Microchip Technology
Part No:
MCP1703T-5002E/MB
RoHS:
Yes
HTS:
8542390090
COO:
TW
ECCN:
EAR99
Supplier Standard Pack This information is provided for customers who prefer to buy in multiples of the Manufacturer’s Standard Package quantity. Minimum Order Quantities and Required Order Multiples are presented with our price and availability information.
1000
Package Type:
REEL
Junction to Ambient:
153.3(Typ) °C/W
Dimension:
4.6(Max) x 2.6(Max) x 1.6(Max) mm
Maximum Dropout Voltage @ Current:
0.65@250mA V
Junction to Case:
100(Typ) °C/W
Accuracy:
±2 %
Function:
LDO
Family:
MCP1703
Line Regulation:
0.1(Typ) %/V
Load Regulation:
1(Typ) %
The MCP1703T-5002E/MB is a CMOS low dropout Voltage Regulator that can deliver up to 250mA of current while consuming only 2µA of quiescent current (typical). The input operating range is specified from 2.7 to 16V, making it an ideal choice for two to six primary cell battery-powered applications, 9V alkaline and one or two cell Li-ion-powered applications. It is capable of delivering 250mA with only 625mV (typical) of input to output voltage differential (VOUT = 2.8V). The output voltage tolerance of the MCP1703 is typically ±0.4% at +25°C and ±3% maximum over the operating junction temperature range of -40 to 125°C. Line regulation is ±0.1% typical at +25°C. Output voltages for the MCP1703 range from 1.2 to 5.5V. The LDO output is stable when using only 1µF of output capacitance. Ceramic, tantalum or aluminium electrolytic capacitors can all be used for input and output.
Search Keywords:
MCP1703T5002EMB
IN STOCK: 2,000
Can Ship immediately
On Order:
2,000   can ship 7/27/26 
Minimum Order Quantity:
500
Factory Lead-Time
10 Weeks
Price (USD)
Quantity
Unit Price
Ext. Price
500
$0.620
$310.000
1,000
$0.549
$549.000
3,000
$0.546
$1,638.000
5,000
$0.545
$2,725.000
8,000
$0.544
$4,352.000
10,000
$0.542
$5,420.000
15,000
$0.541
$8,115.000
25,000 +
$0.540
$13,500.000
Suppliers Standard Package
Product Guides
PDF Datasheet
Product Changes
PDF PCN - 20-Nov-2010 - Microchip Has Released A New Devicedoc For The Listed Mcp1703 Data Sheet Of Devices.
PDF PCN - 30-Sep-2011 - Qualification Of 3L Sot-89 With Full Ag Platting On The Lead-Frame At Hana Assembly Site.
PDF PCN - 16-Sep-2009 - Microchip Has Released A New Device Document For The Mcp1703 Datasheet Of Devices.
PDF PCN - 20-Nov-2010 - Microchip Has Released A New Devicedoc For The Mcp1703 Data Sheet Of Devices.
PDF PCN - 27-Oct-2011 - Microchip is announcing the qualification of 3L SOT-23A at LPI assembly site for the listed products
PDF PCN - 11-Apr-2012 - Microchip is announcing the qualification of LPI assembly site for the listed 3L SOT-89 package with
PDF PCN - 22-Sep-2011 - Microchip is announcing the qualification of 3L SOT-89 with full Ag platting on the paddle at HANA a
PDF PCN - 10-Nov-2010 - Microchip is announcing the amended of its previous notice CYER-05LNSD835 which announces the implem
PDF PCN - 21-Oct-2008 - Microchip is changing the Format and adding quantity barcode to the standard die/wafer inner box lab
PDF PCN - 15-Nov-2011 - Qualification Of 3L Sot-89 At Lpi Assembly Site
PDF PCN - 31-Oct-2012 - Microchip is announcing the qualification of 3L SOT-223 with conductive die attach at LPI assembly s
PDF PCN - 04-Mar-2011 - Data Sheet-Mcp1703 Data Sheet
PDF PCN - 14-Jul-2011 - Microchip is announcing the qualification of 3L SOT-89 with Ag platting on the entire lead-frame at
PDF PCN - 15-Dec-2011 - Microchip is announcing the qualification of 3L and 5L SOT-223 at LPI assembly site for the listed p
PDF PCN - 24-Jan-2008 - Change in Inner Box Label Format MTAI to include additional Bar Code for total quantity of parts shi
PDF PCN - 11-Apr-2012 - Microchip is announcing the qualification of LPI assembly site for the listed 3L SOT-23A package wit
PDF PCN - 30-Aug-2012 - Qualification Of 3L Sot-89 Package With Selective Ag Plating On The Lead-Frame At Lpi Assembly Site
PDF PCN - 05-Aug-2010 - Microchip is announcing the implementation of shipping label and package change for the listed produ
PDF PCN - 26-Jan-2009 - Microchip Technology is changing the shipping materials from moisture barrier bag to static shielded
PDF PCN - 30-Sep-2011 - Qualification Of 3L Sot-89 With Full Ag Platting On The Paddle At Hana Assembly Site
PDF PCN - 30-Jun-2012 - Qualification Of 3L Sot-89 Package With Selective Ag Plating On The Lead-Frame At Lpi Assembly Site
PDF PCN - 27-Oct-2011 - Microchip is announcing the qualification of 3L SOT-89 at LPI assembly site for the listed products
PDF PCN - 19-May-2011 - Microchip is announcing the qualification of 8L DFN (2x3) packages with EFTEC-64T leadframe at NSEB
PDF PCN - 04-Mar-2011 - Microchip Has Released A New Devicedoc For The Mcp1703 Data Sheet Of Devices.
PDF PCN - 25-Sep-2007 - Change in shipping box dimensions and lables at MTAI for all Microchip catalog parts Packed in reels
PDF PCN - 15-Feb-2011 - Microchip is announcing the change in package and implementation of new shipping labels for all list
PDF PCN - 27-Jul-2011 - Microchip is announcing the qualification of 3L SOT-89 with full Ag platting on the paddle at HANA a
PDF PCN - 23-Jan-2024 - Manufacturing Change
PDF Product Change Notification

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