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MCP23008-E/SS by microchip technology
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DATA SHEET

MCP23008-E/SS

Microchip Technology

I/O Expander - 8bit - 1.7 MHz - I2C - 1.8 to 5.5 V - SSOP 20-Pin. .. see full description

RoHS Compliant
TUBE Packaging
Accessories
Accessories
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Product Attribute
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Products found: 0
Supplier:
Microchip Technology
Part No:
MCP23008-E/SS
RoHS:
Yes
HTS:
8542390090
COO:
PH
ECCN:
EAR99
Supplier Standard Pack This information is provided for customers who prefer to buy in multiples of the Manufacturer’s Standard Package quantity. Minimum Order Quantities and Required Order Multiples are presented with our price and availability information.
67
Package Type:
TUBE
Dimension:
7.2 x 5.3 x 1.75 mm
Family:
MCP23008
I2C Bus Interface Mode:
Standard Mode,Fast Mode,Fast Mode Plus
Maximum Operating Supply Voltage:
5.5 V
Interface Type:
I²C
Interface Speed:
1700 kHz
Manual Reset:
Yes
Interrupt Output:
Yes
The MCP23008-E/SS is a 8-bit general purpose, parallel I/O Expansion for I²C bus applications. It consists of multiple 8-bit configuration registers for input, output and polarity selection. The system master can enable the I/Os as either inputs or outputs by writing the I/O configuration bits. The data for each input or output is kept in the corresponding input or output register. The polarity of the input port register can be inverted with the polarity inversion register. All registers can be read by the system master.
Search Keywords:
MCP23008ESS
  Different packaging options available.  See Alternatives
IN STOCK: 1,068
Can Ship immediately
Minimum Order Quantity:
67
Multiple:
67
Factory Lead-Time
7 Weeks
Price (USD)
Quantity
Unit Price
Ext. Price
67
$1.126
$75.442
268
$1.113
$298.284
536
$1.102
$590.672
1,005
$1.097
$1,102.485
2,546
$1.091
$2,777.686
5,025
$1.086
$5,457.150
7,504 +
$1.081
$8,111.824
Suppliers Standard Package
Product Guides
PDF Datasheet
Product Changes
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PDF PCN - 11-Oct-2013 - IMPLEMENT A CONVENTION CHANGE TO THE SALES ORDER (SO) NUMBER
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PDF PCN - 15-Oct-2015 - QUALIFICATION OF AG RING PLATED LEAD-FRAME AND G700LS MOLD COMPOUND FOR 20L SSOP PACKAGE
PDF PCN - 04-Jan-2011 - QUALIFICATION OF 20 & 28L SSOP PACKAGES WITH SG-8300GM MOLD COMPOUND AT MTAI ASSEMBLY SITE
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PDF PCN - 15-Oct-2015 - QUALIFICATION OF AG RING PLATED LEAD-FRAME AND G700LS MOLD COMPOUND FOR 20L SSOP PACKAGE
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PDF PCN - 22-May-2015 - QUALIFICATION OF A NEW 13 INCH PLASTIC REEL WITH SMALLER WINDOW FOR SELECTED PACKAGES AT MTAI, MMT
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PDF PCN - 03-Nov-2011 - Microchip is announcing the qualification of 18 & 28L SOIC package with SG-8300GM mold compound at M
PDF PCN - 08-Aug-2013 - Microchip is implementing a convention change to the sales order (SO) number for the listed products
PDF PCN - 22-May-2015 - QUALIFICATION OF A NEW 13 INCH PLASTIC REEL WITH SMALLER WINDOW FOR SELECTED PACKAGES
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PDF PCN - 22-Sep-2011 - Microchip is announcing the qualification of 18L PDIP at ALPH (MMT) assembly site for the listed pro
PDF PCN - 07-Apr-2011 - Microchip is announcing the qualification of the listed 20 & 28L SSOP packages products with SG-8300
PDF PCN - 09-Jan-2015 - QUALIFICATION OF PALLADIUM COATED COPPER (PDCU) BOND WIRE IN SELECTED PRODUCTS
PDF PCN - 23-Sep-2010 - Microchip is announcing the qualification of listed 28L SSOP package products with SG-8300GM mold co
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