MCP23S18-E/MJ by microchip technology
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DATA SHEET

MCP23S18-E/MJ

Microchip Technology

16-Bit I/O Expander - SPI Interface - 10MHz - 5.5V - Automotive - 24-Pin QFN - Tube .. see full description

RoHS Compliant
TUBE Packaging
Accessories
Accessories
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Product Attribute
Attribute Value Select Attribute
Products found: 0
Supplier:
Microchip Technology
Part No:
MCP23S18-E/MJ
RoHS:
Yes
HTS:
8542390090
COO:
TH
ECCN:
EAR99
Supplier's Standard Package The item count, length, weight, or volume contained in the supplier’s original packaging for efficient storage, handling, and distribution.
91
Package Type:
TUBE
Interface Speed:
10000 kHz
Interface Type:
SPI
Interrupt Output:
Yes
Manual Reset:
Yes
Maximum Operating Supply Voltage:
5.5 V
Dimension:
4 x 4 x 0.83 mm
I2C Bus Interface Mode:
N/R
Family:
MCP23S18
The MCP23S18-E/MJ is a 16-bit I/O expander that utilizes a SPI interface, making it ideal for applications requiring additional I/O pins. This automotive-grade device supports a 10MHz clock frequency and operates within a voltage range of 5.5V. With its 24-pin QFN package and tube packaging, it offers convenient integration and storage. Expand your connectivity options with the MCP23S18-E/MJ and optimize your automotive electronics design.
Search Keywords:
MCP23S18EMJ
  Different packaging options available.  See Alternatives
IN STOCK: 200
Can Ship immediately
On Order:
910   can ship 11/23/26 
Minimum Order Quantity:
91
Multiple:
91
Factory Lead-Time
19 Weeks
Price (USD)
Quantity
Unit Price
Ext. Price
91
$1.62
$147.42
182
$1.61
$293.02
273
$1.60
$436.80
546
$1.59
$868.14
1,001
$1.58
$1,581.58
2,548
$1.57
$4,000.36
5,005
$1.56
$7,807.80
7,553 +
$1.55
$11,707.15
Supplier's Standard Package
Product Guides
PDF Datasheet
Product Changes
PDF PCN - 11-Jul-2017 - IMPLEMENT MARKING CHANGES FOR VIRTUALLY ALL ATMEL PRODUCTS
PDF PCN - 08-Aug-2013 - Microchip is implementing a convention change to the sales order (SO) number for the listed products
PDF PCN - 18-Aug-2017 - QUALIFICATION OF CUPDAU BOND WIRE AND A194-FH LEAD FRAME MATERIAL FOR SELECTED PRODUCTS
PDF PCN - 29-Jan-2014 - Microchip is expanding its test facilities to Microchip Thailand (MMT) for all commercial products i
PDF PCN - 20-Jul-2015 - QUALIFICATION OF G700LTD MOLD COMPOUND AND 8600 DIE ATTACH IN VARIOUS QFN PACKAGES
PDF PCN - 31-Oct-2014 - QUALIFICATION OF G700LTD MOLD COMPOUND AND 8600 DIE ATTACH IN VARIOUS QFN PACKAGES
PDF PCN - 21-Sep-2015 - INTEGRATION OF THE MICREL PCN SYSTEM WITH THE MICROCHIP PCN SYSTEM
PDF PCN - 08-Aug-2013 - IMPLEMENT A CONVENTION CHANGE TO THE SALES ORDER (SO) NUMBER
PDF PCN - 21-Sep-2015 - INTEGRATION OF THE MICREL PCN SYSTEM WITH THE MICROCHIP PCN SYSTEM
PDF PCN - 31-Aug-2017 - FINAL NOTICE QUALIFICATION OF CUPDAU BOND WIRE AND A194-FH LEAD FRAME MATERIAL FOR SELECTED PRODUCTS
PDF PCN - 31-Aug-2017 - FINAL NOTICE QUALIFICATION OF CUPDAU BOND WIRE AND A194-FH LEAD FRAME MATERIAL FOR SELECTED PRODUCTS
PDF PCN - 04-May-2015 - QUALIFICATION OF G700LTD MOLD COMPOUND AND 8600 DIE ATTACH IN VARIOUS QFN PACKAGES
PDF PCN - 20-Mar-2014 - IMPLEMENT LABEL AND PACKING CHANGES FOR SMSC PRODUCTS
PDF PCN - 15-Feb-2011 - Microchip is announcing the change in package and implementation of new shipping labels for all list
PDF PCN - 18-Aug-2017 - QUALIFICATION OF CUPDAU BOND WIRE AND A194-FH LEAD FRAME MATERIAL FOR SELECTED PRODUCTS
PDF PCN - 02-Nov-2016 - QUALIFICATION OF CUPDAU BOND WIRE AND A194-FH LEAD FRAME MATERIAL FOR SELECTED PRODUCTS
PDF PCN - 02-Nov-2016 - QUALIFICATION OF CUPDAU BOND WIRE AND A194-FH LEAD FRAME MATERIAL FOR SELECTED PRODUCTS
PDF PCN - 23-Sep-2015 - CCB 1727 FINAL NOTICE: IMPLEMENT LABEL AND PACKING CHANGES FOR MICROCHIP PRODUCTS
PDF PCN - 03-Nov-2011 - Microchip is announcing the qualification of 18 & 28L SOIC package with SG-8300GM mold compound at M
PDF PCN - 11-Jul-2017 - IMPLEMENT MARKING CHANGES FOR VIRTUALLY ALL ATMEL PRODUCTS
PDF PCN - 23-Sep-2015 - CCB 1727 FINAL NOTICE IMPLEMENT LABEL AND PACKING CHANGES FOR MICROCHIP PRODUCTS
PDF PCN - 05-Feb-2014 - IMPLEMENT LABEL AND PACKING CHANGES FOR SMSC PRODUCTS
PDF PCN - 10-Oct-2016 - IMPLEMENT PACKING CHANGES WITHOUT INNER BOX FOR MSL 1 MICROCHIP PRODUCTS SHIPPED FROM ALL LOCATIONS
PDF PCN - 04-May-2015 - QUALIFICATION OF G700LTD MOLD COMPOUND AND 8600 DIE ATTACH IN VARIOUS QFN PACKAGES
PDF PCN - 05-Aug-2010 - Microchip is announcing the implementation of shipping label and package change for the listed produ
PDF PCN - 04-Feb-2021 - CUSTOMERS TO IMMEDIATELY PLACE THEIR 12-MONTH NON-CANCELLABLE NON-RESCHEDULABLE BACKLOG ON MICROCHIP
PDF PCN - 10-Oct-2016 - IMPLEMENT PACKING CHANGES WITHOUT INNER BOX FOR MSL 1 MICROCHIP PRODUCTS SHIPPED FROM ALL LOCATIONS
PDF PCN - 10-Nov-2010 - Microchip is announcing the amended of its previous notice CYER-05LNSD835 which announces the implem
PDF Product Change Notification

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