MCP6547T-I/MS by microchip technology
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DATA SHEET

MCP6547T-I/MS

Microchip Technology

Comparator Dual R-R I/O 5.5V Automotive 8-Pin MSOP T/R .. see full description

RoHS Compliant
REEL Packaging
Accessories
Accessories
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Products found: 0
Supplier:
Microchip Technology
Part No:
MCP6547T-I/MS
RoHS:
Yes
HTS:
8542330001
COO:
TH
ECCN:
EAR99
Supplier's Standard Package The item count, length, weight, or volume contained in the supplier’s original packaging for efficient storage, handling, and distribution.
2500
Package Type:
REEL
Maximum Power Dissipation:
N/A
Manufacturer Type:
General Purpose Comparator
Family:
MCP6547
Maximum Operating Supply Voltage:
5.5 V
Maximum Input Bias Current:
0.000001(Typ)@5.5V uA
Maximum Dual Supply Voltage:
N/R
Maximum Propagation Delay Time:
8000 ns
Dimension:
3 x 3 x 0.85 mm
Maximum Input Offset Voltage:
7@5.5V mV
The MCP6547T-I/MS is a dual voltage comparator that is specifically designed for automotive applications. It features a rail-to-rail input/output capability and operates at a maximum voltage of 5.5V. This comparator is housed in an 8-pin MSOP package and is supplied in tape and reel packaging. With its automotive-grade reliability and compact form factor, the MCP6547T-I/MS is an excellent choice for a wide range of automotive electronic systems.
Search Keywords:
MCP6547TIMS
IN STOCK: 2,500
Can Ship immediately
Minimum Order Quantity:
500
Factory Lead-Time
24 Weeks
Price (USD)
Quantity
Unit Price
Ext. Price
500
$0.5136
$256.8000
1,000
$0.5098
$509.8000
2,500
$0.4585
$1,146.2500
5,000
$0.4574
$2,287.0000
7,500
$0.4562
$3,421.5000
10,000
$0.4551
$4,551.0000
15,000
$0.4539
$6,808.5000
25,000 +
$0.4528
$11,320.0000
Supplier's Standard Package
Product Guides
PDF Datasheet
Product Changes
PDF PCN - 13-Jul-2011 - Microchip Has Released A New Devicedoc For The Listed Mcp651/1S/2/3/4/5/9 Data Sheet Of Devices In O
PDF PCN - 08-Nov-2010 - Microchip is announcing the qualification of listed 8L MSOP package products with SG-8300GM mold com
PDF PCN - 26-Jan-2009 - Microchip Technology is changing the shipping materials from moisture barrier bag to static shielded
PDF PCN - 24-Jan-2008 - Change in Inner Box Label Format MTAI to include additional Bar Code for total quantity of parts shi
PDF PCN - 30-Jan-2006 - Product Change Notice
PDF PCN - 05-Aug-2010 - Microchip is announcing the implementation of shipping label and package change for the listed produ
PDF PCN - 31-Aug-2008 - QUALIFICATION OF G700K MOLD COMPOUND FOR 8L AND 10L MSOP (3X3 MM) PACKAGES AT ATP ASSEMBLY
PDF PCN - 13-Jul-2011 - Data Sheet-Mcp651/1S/2/3/4/5/9 Data Sheet Data Sheet Document Revision
PDF PCN - 09-Jul-2010 - QUALIFICATION OF SPECIFIC DEVICE FAMILIES IN THE 8LMSOP PACKAGE AT MMS TEST SITE
PDF PCN - 01-Jan-2005 - CHANGE FROM SNPB (TIN/LEAD) PLATING TO MATTE TIN (SN) PLATING ON THE DEVICE LEADS
PDF PCN - 21-Oct-2008 - Microchip is changing the Format and adding quantity barcode to the standard die/wafer inner box lab
PDF PCN - 25-Jun-2010 - Microchip is announcing the qualification of larger paddle in 8L MSOP package with G600F mold compou
PDF PCN - 09-Feb-2012 - Microchip Has Released A New Devicedoc For The Listed Mcp6546/6R/6U/7/8/9 Datasheet Of Devices.
PDF PCN - 08-Mar-2007 - Product Change Notice
PDF PCN - 10-Nov-2010 - Microchip is announcing the amended of its previous notice CYER-05LNSD835 which announces the implem
PDF PCN - 09-Feb-2012 - Microchip Has Released A New Devicedoc For The Mcp6546/6R/6U/7/8/9 Datasheet Of Devices
PDF PCN - 01-Feb-2011 - QUALIFICATION OF 8L MSOP PACKAGE WITH SG-8300GM MOLD COMPOUND AT MTAI ASSEMBLY SITE.
PDF PCN - 24-Aug-2011 - Microchip is announcing the qualification of 8L, 14L, 16L, 20L PDIP, & 28L SPDIP with CRM-1064L die
PDF PCN - 30-Apr-2007 - QUALIFICATION OF NITTO GE800 MOLD COMPOUND FOR PDIP AND SPDIP PACKAGES ASSEMBLED AT MTAI
PDF PCN - 09-Nov-2011 - Microchip is announcing the qualification of 8L, 14L, 16L, 20L PDIP, & 28L SPDIP with CRM-1064L die
PDF PCN - 11-Mar-2009 - Microchip is qualifying the Molding Compound and Epoxy in 8L MSOP & 10L MSOP Package with G600 moldi
PDF PCN - 30-Jul-2010 - QUALIFICATION OF LARGER PADDLE IN 8L MSOP PACKAGE WITH G600F MOLD COMPOUND AT MMS (ATES) ASSEMBLY
PDF PCN - 27-May-2010 - Microchip is announcing the qualification of listed device families in the 8LMSOP package at MMS tes
PDF PCN - 20-May-2010 - QUALIFICATION OF LARGER PADDLE IN 8L MSOP PACKAGE WITH G600F MOLD COMPOUND AT MMS (ATES) ASSEMBLY
PDF PCN - 22-Jan-2004 - Product Change Notice
PDF PCN - 31-Aug-2008 - QUALIFICATION OF G700K MOLD COMPOUND FOR 8L AND 10L MSOP (3X3 MM) PACKAGES AT ATP ASSEMBLY
PDF PCN - 30-Jul-2010 - QUALIFICATION OF 8L, 14L, & 16L PDIP AT GTK (GRTK) ASSEMBLY SITE.
PDF PCN - 01-Sep-2004 - ADD MICROCHIP THAILAND AS A QUALIFIED PROBE MANUFACTURING SITE
PDF PCN - 05-Aug-2008 - Microchip is qualifying G700K old compound for 8L and 10L MSOP (3X3 MM) packaged at ATP assembly to
PDF PCN - 25-Sep-2007 - Change in shipping box dimensions and lables at MTAI for all Microchip catalog parts Packed in reels
PDF PCN - 12-Mar-2010 - Microchip is announcing the qualification of larger paddle in 8L MSOP package with G600F mold compou
PDF PCN - 15-Feb-2011 - Microchip is announcing the change in package and implementation of new shipping labels for all list
PDF PCN - 23-Sep-2010 - Microchip is announcing the qualification of listed 8L MSOP package products with SG-8300GM mold com
PDF PCN - 20-Mar-2009 - QUALIFICATION OF 8L & 10L MSOP WITH 8200T EPOXY AND G600 MOLD COMPOUND AT UTL ASSEMBLY
PDF PCN - 09-Jun-2008 - Microchip is changing the material i.e mold compound from MP8000 to G700K for 8L and 10L MSOP packag
PDF PCN - 31-Dec-2011 - QUALIFICATION OF 8L MSOP PACKAGE WITH SG-8300GM MOLD COMPOUND AT MTAI ASSEMBLY SITE.

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