PIC12C671-04/P by microchip technology
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DATA SHEET

PIC12C671-04/P

Microchip Technology

MCU 8-bit PIC RISC 1.75KB EPROM 3.3V/5V 8-Pin PDIP Tube .. see full description

RoHS Compliant
TUBE Packaging
Accessories
Accessories
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Product Attribute
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Supplier:
Microchip Technology
Part No:
PIC12C671-04/P
RoHS:
Yes
HTS:
8542310015
COO:
TH
ECCN:
EAR99
Supplier's Standard Package The item count, length, weight, or volume contained in the supplier’s original packaging for efficient storage, handling, and distribution.
60
Package Type:
TUBE
Number of Programmable I/Os:
5
ADC Resolution:
8 bit
Program Memory Type:
EPROM
Operating Temperature:
0 to 70 °C
RAM Size:
128 B
Program Memory Size:
1.75 KB
The MICROCHIP TECH. part PIC12C671-04/P is a high-performance 8-bit microcontroller unit (MCU) with a PIC RISC architecture. It features a 1.75KB EPROM memory and operates at voltages of both 3.3V and 5V. This MCU comes in an 8-pin PDIP package and is delivered in a tube for easy handling and storage. It is ideal for applications requiring compact and efficient control and offers advanced features for embedded systems.
Search Keywords:
PIC12C67104P
IN STOCK: 480
Ships today, if you order in
Minimum Order Quantity:
60
Multiple:
60
Factory Lead-Time
7 Weeks
Price (USD)
Quantity
Unit Price
Ext. Price
60
$2.56
$153.60
120
$2.54
$304.80
300
$2.52
$756.00
540
$2.51
$1,355.40
1,020
$2.50
$2,550.00
2,520
$2.49
$6,274.80
5,040
$2.48
$12,499.20
7,500 +
$2.47
$18,525.00
Supplier's Standard Package
Product Changes
PDF PCN - 15-Feb-2011 - Microchip is announcing the change in package and implementation of new shipping labels for all list
PDF PCN - 15-Oct-2008 - QUALIFICATION OF E500 MOLD COMPOUND AND 84-1LMISR4 DIE ATTACH EPOXY FOR 8L PDIP PACKAGE AT MMS
PDF PCN - 02-Dec-2009 - AMEND SHIPPING LABELS FOR CERAMIC PRODUCTS WITH SNAGCU AND AU LEAD/TERMINATION FINISH
PDF PCN - 24-Feb-2008 - CHANGE IN INNER BOX LABEL FORMAT TO INCLUDE ADDITIONAL BAR CODE
PDF PCN - 31-Oct-2007 - QUALIFICATION OF GE800 MOLD COMPOUND IN ASSORTED PDIP/SPDIP PACKAGES AT ALPH
PDF PCN - 25-Sep-2007 - Change in shipping box dimensions and lables at MTAI for all Microchip catalog parts Packed in reels
PDF PCN - 26-Jan-2011 - Microchip is announcing qualification of CRM-1064L die attach in 28L SPDIP (.300) & 8/18L PDIP (.300
PDF PCN - 28-Feb-2011 - QUALIFICATION OF CRM-1064L DIE ATTACH IN 28L SPDIP (.300) & 8/18L PDIP (.300) PACKAGES
PDF PCN - 07-Oct-2005 - Product Change Notice
PDF PCN - 19-Sep-2008 - Microchip is qualifying E500 Mold Compound and 84-1LMISR4 Die Attach Epoxy for 8L PDIP Package at MM
PDF PCN - 01-Sep-2005 - QUALIFICATION OF 8L DFN-S WITH G770HCD MOLD COMPOUND AND 8200T DIE ATTACH EPOXY
PDF PCN - 19-May-2008 - ADDING NEW ASSEMBLY SITE
PDF PCN - 01-Jan-2006 - 8L SOIJ 208'' PACKAGE QUALIFICATION AT NEW ASSEMBLY PLANT NSE2 (NS ELECTRONICS, BANGKOK)
PDF PCN - 22-Jan-2004 - QUALIFY UNISEM FOR ASSEMBLY OF 8L PDIP PACKAGES
PDF PCN - 10-Sep-2009 - CHANGE INNER BOX AND OUTER CARTON FOR ALL PACKAGES PACKED IN TUBES AT MTAI ASSEMBLY SITE
PDF PCN - 31-May-2007 - QUALIFICATION OF SAC305 ALLOY SOLDER DIPPING FOR CERDIPS AT MMT
PDF PCN - 31-Dec-2006 - Addition Of An Assembly Site
PDF PCN - 15-Sep-2008 - Microchip is changing the bill of material by changing the mold compound to G600C and Die Attach Epo
PDF PCN - 23-Jul-2009 - Microchip is changing the inner box and outer carton for all packages packed in tubes at MTAI assemb
PDF PCN - 24-Jan-2008 - Change in Inner Box Label Format MTAI to include additional Bar Code for total quantity of parts shi
PDF PCN - 11-Nov-2004 - Product Change Notice
PDF PCN - 31-May-2008 - QUALIFICATION OF G600 MOLD COMPOUND FOR 8L PDIP PACKAGE AT UNIS
PDF PCN - 26-Jan-2009 - Microchip Technology is changing the shipping materials from moisture barrier bag to static shielded
PDF PCN - 26-Jan-2011 - Microchip is announcing the qualification of CRM-1064L die attach in 28L SPDIP (.300) & 8/18L PDIP (
PDF PCN - 02-Nov-2007 - Microchip is qualifying G600 mold compound in PDIP packages at CEI and NSEB.
PDF PCN - 05-Aug-2010 - Microchip is announcing the implementation of shipping label and package change for the listed produ
PDF PCN - 30-Jan-2011 - QUALIFICATION OF CRM-1064L DIE ATTACH IN 28L SPDIP (.300) & 8/18L PDIP (.300) PACKAGES
PDF PCN - 08-Nov-2010 - Microchip is announcing the qualification of the CRM-1064L die attach in 28L SPDIP (.300) & 8/18L PD
PDF PCN - 08-Oct-2007 - Qualification of GE800 mold compound in assorted PDIP/SPDIP packages at ALPH.
PDF PCN - 19-Apr-2010 - Microchip is announcing the qualification of 8L, 14L, & 16L PDIP at GTK (GRTK) assembly site for the
PDF PCN - 26-Oct-2007 - LABEL SIZE CHANGE FROM ALUMINUM BAGS & INNER BOXES 17X4 CM2 TO 14X4 CM2
PDF PCN - 24-Jun-2008 - Microchip is qualifying a new assembly site of 8L PDIP .300" package Linear Devices, Mixed Signal De
PDF PCN - 31-Oct-2008 - QUALIFICATION OF G600C MOLD COMPOUND AND 8361J DIE ATTACH EPOXY AT ANAP ASSEMBLY
PDF PCN - 21-Oct-2008 - Microchip is changing the Format and adding quantity barcode to the standard die/wafer inner box lab
PDF PCN - 15-Oct-2008 - QUALIFICATION OF E500 MOLD COMPOUND AND 84-1LMISR4 DIE ATTACH EPOXY FOR 8L PDIP AT MMS ASSEMBLY
PDF PCN - 28-Aug-2008 - Microchip is qualifying the G600C Mold Compound and 8361 J Die attach Epoxy for 8L, 14L, and 16L PDI
PDF PCN - 02-Dec-2009 - AMEND SHIPPING LABELS FOR CERAMIC PRODUCTS WITH SNPB LEAD/TERMINATION FINISH
PDF PCN - 31-May-2008 - QUALIFICATION OF G600 MOLD COMPOUND FOR 8L PDIP PACKAGE AT UNIS
PDF PCN - 05-Nov-2010 - QUALIFICATION OF 8L, 14L, & 16L PDIP AT GTK (GRTK) ASSEMBLY SITE.
PDF PCN - 18-Oct-2013 - QUALIFICATION OF SELECTED PRODUCTS WITH PALLADIUM COATED COPPER (PDCU) BOND WIRE AT MTAI
PDF PCN - 08-Oct-2010 - Microchip is announcing the quallification of 8L, 14L, & 16L PDIP at GTK (GRTK) assembly site for th
PDF PCN - 07-May-2008 - Microchip is qualifying the G600 mold compound for 8L PDIP package at UNIS in order to improve manuf
PDF PCN - 30-Jul-2010 - QUALIFICATION OF 8L, 14L, & 16L PDIP AT GTK (GRTK) ASSEMBLY SITE.
PDF PCN - 31-Oct-2008 - QUALIFICATION OF G600C MOLD COMPOUND
PDF PCN - 17-Jun-2008 - Microchip is announcing the qualification of G600 mold compound for 8L PDIP package at units for the
PDF PCN - 22-Jan-2004 - Product Change Notice
PDF PCN - 18-Oct-2013 - QUALIFICATION OF SELECTED PRODUCTS AVAILABLE IN THE 28L SPDIP, 18L PDIP, AND 8L PDIP PACKAGES
PDF PCN - 18-Oct-2013 - QUALIFICATION OF SELECTED PRODUCTS AVAILABLE IN THE 28L SPDIP, 18L PDIP, AND 8L PDIP PACKAGES
PDF PCN - 01-Jan-2006 - QUALIFICATION OF 8L PDIP PACKAGE AT NEW ASSEMBLY SITE NSE2
PDF PCN - 06-Mar-2006 - Product Change Notice
PDF PCN - 11-Jan-2010 - AMEND SHIPPING LABELS FOR CERAMIC PRODUCTS WITH SNAGCU AND AU LEAD/TERMINATION FINISH
PDF PCN - 15-Jul-2002 - Inchesadding 8L And 14L Windowed Cerdip (0.300Inches)
PDF PCN - 10-Nov-2010 - Microchip is announcing the amended of its previous notice CYER-05LNSD835 which announces the implem

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