PIC18F1320-I/SS by microchip technology
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DATA SHEET

PIC18F1320-I/SS

Microchip Technology

MCU 8-bit PIC RISC 8KB Flash 5V 20-Pin SSOP Tube .. see full description

RoHS Compliant
TUBE Packaging
Accessories
Accessories
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Product Attribute
Attribute Value Select Attribute
Products found: 0
Supplier:
Microchip Technology
Part No:
PIC18F1320-I/SS
RoHS:
Yes
HTS:
8542310015
COO:
TH
ECCN:
EAR99
Supplier's Standard Package The item count, length, weight, or volume contained in the supplier’s original packaging for efficient storage, handling, and distribution.
67
Package Type:
TUBE
ADC Resolution:
10 bit
RAM Size:
256 B
Operating Temperature:
-40 to 85 °C
Program Memory Size:
8 KB
Program Memory Type:
Flash
Number of Programmable I/Os:
16
The PIC18F1320-I/SS is a powerful 8-bit microcontroller from Microchip Technology. It is built on the RISC architecture and features a high-performance PIC core, making it ideal for a wide range of applications. With its 8KB flash memory, this microcontroller offers ample storage space for your programs and data.The PIC18F1320-I/SS operates at a voltage of 5V, allowing for stable and reliable performance. Its 20-pin SSOP package ensures easy integration into your designs while saving precious board space. This microcontroller also supports a variety of communication interfaces, including UART, SPI, and I2C, allowing seamless connectivity to other devices.Whether you are working on an industrial control system, embedded device, or IoT application, the PIC18F1320-I/SS provides the processing power and versatility you need. Trust Microchip Technology for a reliable and efficient microcontroller solution.
Search Keywords:
PIC18F1320ISS
IN STOCK: 0
On Order:
201   can ship 11/23/26 
Minimum Order Quantity:
5
Factory Lead-Time
15 Weeks
Price (USD)
Quantity
Unit Price
Ext. Price
5
$4.38
$21.90
67
$3.89
$260.63
134
$3.86
$517.24
268
$3.84
$1,029.12
536
$3.83
$2,052.88
1,005
$3.82
$3,839.10
2,546
$3.81
$9,700.26
5,025 +
$3.80
$19,095.00
Supplier's Standard Package
Product Guides
PDF Datasheet
Product Changes
PDF PCN - 21-Oct-2008 - Microchip is changing the Format and adding quantity barcode to the standard die/wafer inner box lab
PDF PCN - 28-Aug-2009 - MPLAB C for PIC18 MCU's v3.33 has been released to the web and is available for download.This releas
PDF PCN - 16-Mar-2001 - MICROCHIP IS OPENING A NEW FAB LOCATED IN GRESHAM, OREGON
PDF PCN - 01-Jan-2006 - 18L Soic 300'' Package Qualification At New Assembly Plant Nse2 (Ns Electronics, Bangkok)
PDF PCN - 19-May-2009 - MPLAB C COMPILER FOR PIC18 MCUS V3.31 RELEASED
PDF PCN - 07-Oct-2005 - Product Change Notice
PDF PCN - 31-Mar-2008 - QUALIFICATION OF CRM1706DJ DIE ATTACH EPOXY AND G770HCD MOLD COMPOUND
PDF PCN - 04-Jan-2011 - QUALIFICATION OF 20 & 28L SSOP PACKAGES WITH SG-8300GM MOLD COMPOUND AT MTAI ASSEMBLY SITE
PDF PCN - 06-Mar-2006 - Product Change Notice
PDF PCN - 05-Mar-2010 - MPLAB C FOR PIC28 V3.35 RELEASED
PDF PCN - 10-Nov-2010 - Microchip is announcing the amended of its previous notice CYER-05LNSD835 which announces the implem
PDF PCN - 26-Oct-2007 - LABEL SIZE CHANGE FROM ALUMINUM BAGS & INNER BOXES 17X4 CM2 TO 14X4 CM2
PDF PCN - 01-Jan-2005 - CHANGE FROM SNPB (TIN/LEAD) PLATING TO MATTE TIN (SN) PLATING ON THE DEVICE LEADS
PDF PCN - 20-Jan-2012 - Microchip is announcing the qualification of 18L PDIP at ALPH (MMT) for the listed products in order
PDF PCN - 01-Jan-2006 - 20L Ssop 207'' Package Qualification At New Assembly Plant Nse2 (Ns Electronics, Bangkok)
PDF PCN - 31-Oct-2007 - QUALIFICATION OF GE800 MOLD COMPOUND IN ASSORTED PDIP/SPDIP PACKAGES AT ALPH
PDF PCN - 24-Feb-2008 - CHANGE IN INNER BOX LABEL FORMAT TO INCLUDE ADDITIONAL BAR CODE
PDF PCN - 19-May-2009 - Microchip is releasing the MPLAB C Compiler for PIC18 MCUs v3.31 which will provide new part support
PDF PCN - 23-Sep-2010 - Microchip is announcing the qualification of listed 28L SSOP package products with SG-8300GM mold co
PDF PCN - 15-Feb-2011 - Microchip is announcing the change in package and implementation of new shipping labels for all list
PDF PCN - 03-Nov-2011 - Microchip is announcing the qualification of 18 & 28L SOIC package with SG-8300GM mold compound at M
PDF PCN - 22-Sep-2011 - Microchip is announcing the qualification of 18L PDIP at ALPH (MMT) assembly site for the listed pro
PDF PCN - 07-Apr-2011 - Microchip is announcing the qualification of the listed 20 & 28L SSOP packages products with SG-8300
PDF PCN - 30-Jun-2011 - QUALIFICATION OF 20 & 28L SSOP PACKAGES WITH SG-8300GM MOLD COMPOUND AT MTAI ASSEMBLY SITE
PDF PCN - 05-Aug-2010 - Microchip is announcing the implementation of shipping label and package change for the listed produ
PDF PCN - 30-Jul-2010 - QUALIFICATION OF DIFFERENT PADDLE SIZES IN 18L & 28L SOIC PACKAGES AT MMS (ATES).
PDF PCN - 11-Nov-2004 - Product Change Notice
PDF PCN - 12-Mar-2003 - FIRMWARE CHANGE
PDF PCN - 24-Jan-2008 - Change in Inner Box Label Format MTAI to include additional Bar Code for total quantity of parts shi
PDF PCN - 09-Mar-2010 - ERRATA-TIMER1 MODULE DATA SHEET ERRATA
PDF PCN - 14-Jul-2009 - MPLAB C COMPILER FOR PIC18 MCU'S VERSION 3.32 IS RELEASED
PDF PCN - 26-Jan-2009 - Microchip Technology is changing the shipping materials from moisture barrier bag to static shielded

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