374024B00035G
Boyd Laconia LLCHeat Sink Passive BGA Pin Array Adhesive Aluminum 40°C/W Black Anodized .. see full description
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Products found: 0
Supplier:
Boyd Laconia LLC
Part No:
374024B00035G
Alias/AKA:
306233
RoHS:
Yes
HTS:
8542900000
COO:
CN
ECCN:
EAR99
Supplier Standard Pack
480
Package Type:
Bulk
Device Cooled:
BGA
Attachment Method:
Tape
Dimension:
23 x 23 x 10 mm
Thermal Resistance:
40 °C/W
Finish:
Black Anodized
The AAVID THERMALLOY part 374024B00035G is a passive heat sink specifically designed for BGA pin arrays. This heat sink is made of adhesive aluminum with a black anodized finish, making it not only effective in heat dissipation but also visually appealing. With a thermal resistance of 40°C/W, it efficiently dissipates heat from electronic components, preventing overheating and ensuring optimal performance. This heat sink is easy to install and can be used in various electronic applications that require effective thermal management.
Search Keywords:
374024B00035G
IN STOCK:
925
Ships today, if you order in
Minimum Order Quantity:
25
Factory Lead-Time
6 Weeks
Price (USD)
Quantity
Unit Price
Ext. Price
25
$1.77
$44.25
100
$1.59
$159.00
480
$1.48
$710.40
960
$1.43
$1,372.80
1,440
$1.40
$2,016.00
2,880
$1.28
$3,686.40
5,280
+
$1.27
$6,705.60
Please Note:
Tariffs may apply for U.S. shipments
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