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374624B00032G by boyd laconia llc
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DATA SHEET

374624B00032G

Boyd Laconia LLC

Heat Sink Passive BGA/FPGA Pin Array Adhesive Aluminum 23.4A°C/W Black Anodized

RoHS Compliant
Packaging
Accessories
Accessories
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Product Attribute
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Products found: 0
Supplier:
Boyd Laconia LLC
Part No:
374624B00032G
Alias/AKA:
043181
RoHS:
Yes
HTS:
8419505000
COO:
CN
ECCN:
EAR99
Supplier Standard Pack This information is provided for customers who prefer to buy in multiples of the Manufacturer’s Standard Package quantity. Minimum Order Quantities and Required Order Multiples are presented with our price and availability information.
510
Device Cooled:
BGA6707,FPGA6707
Attachment Method:
Tape6706
Dimension:
35 x 35 x 106714mm
Thermal Resistance:
23.46717°C/W
Finish:
Black Anodized6710
Heat Sink Passive BGA/FPGA Pin Array Adhesive Aluminum 23.4A°C/W Black Anodized
Search Keywords:
374624B00032G
IN STOCK: 769
Ships today, if you order in
Minimum Order Quantity:
10
Factory Lead-Time
6 Weeks
Price (USD)
Quantity
Unit Price
Ext. Price
10
$2.45
$24.50
50
$2.23
$111.50
250
$2.14
$535.00
510
$2.10
$1,071.00
1,020
$2.05
$2,091.00
2,550
$1.98
$5,049.00
5,100
$1.95
$9,945.00
7,650 +
$1.94
$14,841.00
Suppliers Standard Package
Please Note: Tariffs may apply for U.S. shipments
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