375324B00035G
Boyd Laconia LLCHeat Sink Passive BGA/FPGA Extruded Adhesive Aluminum 71.4A°C/W Black Anodized .. see full description
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Products found: 0
Supplier:
Boyd Laconia LLC
Part No:
375324B00035G
Alias/AKA:
035731
RoHS:
Yes
HTS:
8542900000
COO:
CN
ECCN:
EAR99
Supplier Standard Pack
1
Package Type:
Bulk
Device Cooled:
BGA6707,FPGA6707
Attachment Method:
Tape6706
Dimension:
10.2 x 10.2 x 10.26714mm
Thermal Resistance:
71.46717°C/W
Finish:
Black Anodized6710
The AAVID THERMALLOY part 375324B00035G is a high-quality, passive heat sink designed to effectively dissipate heat from BGA and FPGA components. It features an extruded adhesive aluminum construction which ensures excellent thermal conductivity and durability. With a thermal resistance of 71.4°C/W, this heat sink efficiently prevents overheating and enables optimal performance of electronic devices. Its black anodized finish not only enhances aesthetics but also provides enhanced corrosion resistance. Invest in this reliable and efficient heat sink for improved thermal management and prolonged component lifespan.
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375324B00035G
IN STOCK:
3,316
Ships today, if you order in
MOQ for In Stock Qty:
5
MOQ for out of Stock Qty:
480
Factory Lead-Time
9 Weeks
Price (USD)
Quantity
Unit Price
Ext. Price
5
$7.401
$37.005
100
$4.615
$461.500
250
$4.365
$1,091.250
480
$4.175
$2,004.000
960
$4.067
$3,904.320
1,440
$3.988
$5,742.720
1,920
+
$3.960
$7,603.200
Please Note:
Tariffs may apply for U.S. shipments
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