The 513202B02500G is a dual radial, board-level heat sink from the Extruded 5000 series, specifically designed for the thermal management of TO-220 packaged devices. Constructed from aluminum with a black anodize finish for durability and thermal performance, this heat sink measures 50.80 mm in height and 34.92 mm in width. It features solderable pins for secure board attachment and can be mounted in either a horizontal or vertical orientation. This component is ideal for applications requiring efficient heat dissipation from power components on a printed circuit board, ensuring device reliability and performance.