577202B04000G
Boyd Laconia LLCThe 577202B04000G is an aluminum, channel-style board level heat sink designed for cooling TO-220 and TO-220-single gauge semiconductor devices. .. see full description
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Products found: 0
Supplier:
Boyd Laconia LLC
Part No:
577202B04000G
Alias/AKA:
041840
RoHS:
Yes
HTS:
8473309000
COO:
CN
ECCN:
EAR99
Supplier Standard Pack
1
Package Type:
Bulk
Device Cooled:
TO-2206707
Attachment Method:
Screw6706
Dimension:
13.21 x 19.05 x 12.76714mm
Thermal Resistance:
24.46717°C/W
Finish:
Black Anodized6710
The 577202B04000G is a channel board level heat sink intended for the thermal management of TO-220 and TO-220-single gauge devices. Constructed from aluminum with a black anodize finish, this heat sink has a length of 12.7 mm, a width of 13.21 mm, and a height of 19.05 mm. It requires a mounting kit for device attachment and offers versatile integration. Its design supports both horizontal and vertical mounting orientations, making it suitable for various board-level cooling applications where efficient heat dissipation is critical.
Search Keywords:
577202B04000G
IN STOCK:
128
Can Ship immediately
On Order:
15,000
can ship 5/22/26
MOQ for In Stock Qty:
10
MOQ for out of Stock Qty:
1250
Factory Lead-Time
9 Weeks
Price (USD)
Quantity
Unit Price
Ext. Price
10
$0.84
$8.40
250
$0.82
$205.00
500
$0.79
$395.00
1,250
$0.77
$962.50
2,500
$0.74
$1,850.00
3,750
$0.72
$2,700.00
5,000
+
$0.70
$3,500.00
Please Note:
Tariffs may apply for U.S. shipments
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