590102B03600G
Boyd Laconia LLCHeat Sink Passive TO-220 Recessed Thru-Hole Aluminum 10A°C/W Black Anodized .. see full description
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Products found: 0
Supplier:
Boyd Laconia LLC
Part No:
590102B03600G
Alias/AKA:
043224
RoHS:
Yes
HTS:
7616995090
COO:
CN
ECCN:
EAR99
Supplier Standard Pack
240
Package Type:
Bulk
Device Cooled:
TO-2206707
Attachment Method:
Solder Tab6706
Dimension:
25.4 x 25.4 x 42.546714mm
Thermal Resistance:
106717°C/W
Finish:
Black Anodized6710
The 590102B03600G is a Channel 5901 board level heat sink engineered to cool TO-220 and TO-220-single gauge semiconductor devices. Constructed from aluminum with a black anodize finish, this heat sink features dimensions of 25.40 mm width, 25.40 mm length, and 42.54 mm height, with a vertical mounting direction for optimal thermal performance. The device requires a mounting kit for attachment and is RoHS compliant, making it suitable for environmentally conscious applications. This heat sink is ideal for power management and thermal regulation in compact board-level cooling applications where space efficiency and reliable heat dissipation are critical.
Search Keywords:
590102B03600G
IN STOCK:
0
MOQ for out of Stock Qty:
540
Factory Lead-Time
6 Weeks
Price (USD)
Quantity
Unit Price
Ext. Price
540
$1.42
$766.80
1,080
$1.35
$1,458.00
1,620
$1.28
$2,073.60
2,160
+
$1.22
$2,635.20
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