593202B03500G
Boyd Laconia LLCThe 593202B03500G is a staggered fin, board-level heat sink designed for cooling TO-220 and TO-220-single gauge semiconductor devices. .. see full description
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Products found: 0
Supplier:
Boyd Laconia LLC
Part No:
593202B03500G
Alias/AKA:
042686
RoHS:
Yes
HTS:
8473309000
COO:
CN
ECCN:
EAR99
Supplier Standard Pack
800
Package Type:
Bulk
Device Cooled:
TO-220
Attachment Method:
N/A
Dimension:
35.05 x 12.2 x 50.8mm
Thermal Resistance:
10.4 °C/W
Finish:
Black Anodized
The 593202B03500G is a board-level heat sink from the Space Saving 5932 series, engineered for thermal management of TO-220 and TO-220-single gauge devices. Constructed from aluminum with a black anodize finish for durability and performance, it measures 35.05 mm in width, 12.20 mm in length, and 50.80 mm in height. This component features a staggered fin design for efficient heat dissipation and is intended for vertical mounting. It is ideal for applications requiring effective cooling of power components in space-constrained board-level environments and requires a separate mounting kit for device attachment.
Search Keywords:
593202B03500G
IN STOCK:
8,045
Can Ship immediately
MOQ for In Stock Qty:
5
MOQ for out of Stock Qty:
400
Factory Lead-Time
6 Weeks
Price (USD)
Quantity
Unit Price
Ext. Price
5
$3.89
$19.45
100
$1.16
$116.00
250
$1.14
$285.00
400
$1.11
$444.00
800
$1.10
$880.00
1,200
$1.09
$1,308.00
1,600
+
$1.08
$1,728.00
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