593202B03500G
Boyd Laconia LLCThe 593202B03500G is a staggered fin, board-level heat sink designed for cooling TO-220 and TO-220-single gauge semiconductor devices. .. see full description
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Supplier:
Boyd Laconia LLC
Part No:
593202B03500G
Alias/AKA:
042686
RoHS:
Yes
HTS:
8473309000
COO:
CN
ECCN:
EAR99
Supplier Standard Pack
800
Package Type:
Bulk
Device Cooled:
TO-220
Attachment Method:
N/A
Dimension:
35.05 x 12.2 x 50.8mm
Thermal Resistance:
10.4 °C/W
Finish:
Black Anodized
The 593202B03500G is a board-level heat sink from the Space Saving 5932 series, engineered for thermal management of TO-220 and TO-220-single gauge devices. Constructed from aluminum with a black anodize finish for durability and performance, it measures 35.05 mm in width, 12.20 mm in length, and 50.80 mm in height. This component features a staggered fin design for efficient heat dissipation and is intended for vertical mounting. It is ideal for applications requiring effective cooling of power components in space-constrained board-level environments and requires a separate mounting kit for device attachment.
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593202B03500G
IN STOCK:
835
Ships today, if you order in
On Order:
8,000
can ship 5/29/26
MOQ for In Stock Qty:
5
MOQ for out of Stock Qty:
400
Factory Lead-Time
8 Weeks
Price (USD)
Quantity
Unit Price
Ext. Price
5
$2.776
$13.880
100
$0.708
$70.800
250
$0.694
$173.500
400
$0.667
$266.800
800
$0.649
$519.200
1,200
$0.646
$775.200
1,600
+
$0.642
$1,027.200
Please Note:
Tariffs may apply for U.S. shipments
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