6030B-TTG
Boyd Laconia LLCHeat Sink Passive TO-220 Vertical Thru-Hole Copper 12.5A°C/W Tin .. see full description
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Products found: 0
Supplier:
Boyd Laconia LLC
Part No:
6030B-TTG
Alias/AKA:
042603
RoHS:
Yes
HTS:
8473305100
COO:
CN
ECCN:
EAR99
Supplier Standard Pack
1000
Package Type:
Bulk
Device Cooled:
TO-2206707
Attachment Method:
Solder Tab6706
Dimension:
25.4 x 12.7 x 29.976714mm
Thermal Resistance:
12.56717°C/W
Finish:
Tin6710
The AAVID THERMALLOY 6030B-TTG is a passive heat sink designed to efficiently dissipate heat from TO-220 semiconductor devices. It features a vertical thru-hole mounting configuration, making it easy to install on circuit boards. Made of high-quality copper, this heat sink offers excellent thermal conductivity and corrosion resistance. With a thermal resistance of 12.5°C/W, it effectively keeps the temperature of the TO-220 device low, preventing overheating. The heat sink is coated with a layer of tin for added durability and protection. Whether in industrial or electronic applications, the AAVID THERMALLOY 6030B-TTG ensures optimal thermal management and prolongs the lifespan of the components.
Search Keywords:
6030BTTG
IN STOCK:
2,862
Can Ship immediately
Minimum Order Quantity:
10
Factory Lead-Time
6 Weeks
Price (USD)
Quantity
Unit Price
Ext. Price
10
$4.254
$42.540
50
$3.868
$193.400
100
$3.694
$369.400
250
$3.493
$873.250
500
$3.350
$1,675.000
1,000
$3.228
$3,228.000
3,000
$3.220
$9,660.000
5,000
+
$3.212
$16,060.000
Please Note:
Tariffs may apply for U.S. shipments
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