The 6396BG is a high-power extruded heat sink designed for effective heat dissipation from electronic components. It features large radial fins and is specifically intended for use with TO-220 and TO-218 packages. This heat sink has a thermal resistance of 5.60 °C/W, based on a 75°C temperature rise in natural convection. Finished with black anodize to enhance radiative cooling, it is ideal for applications requiring reliable thermal performance to maintain component longevity and stability.