The 10-8118 is a Type 44 non-silicone heat sink compound designed to provide efficient thermal conductivity for cooling electronic components and heat sinks. Compounded with 100% synthetic base stocks, it features excellent heat transfer efficiency, thermal stability, and high flow rate with no separation, bleed, or migration typical of silicone-based greases, meeting MIL-C-47113 Type 2 specifications. The compound exhibits a white paste appearance with a consistency penetration of 260 (ASTM D-217), a specific gravity of 2.5, and thermal conductivity of 1.8 × 10?³ CAL/SEC/cm·°C. It maintains performance across an operating temperature range of -22°F to 390°F and demonstrates excellent dielectric properties with a dielectric strength of 420 volts/mil and volume resistivity of 2 × 10¹° Ohm-cm. The 10-8118 is ideal for applications requiring reliable thermal interface materials in power electronics, computing equipment, and industrial devices where superior heat dissipation and long-term stability are critical.