PIC24FJ256GB106-I/PT by microchip technology
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DATA SHEET

PIC24FJ256GB106-I/PT

Microchip Technology

MCU 16-bit - PIC24 Family PIC24FJ GB Series Microcontrollers - 256KB Flash - 2.5V/3.3V - 64-Pin. .. see full description

RoHS Compliant
TRAY Packaging
Accessories
Accessories
This product is backed by Ecco Electronics' Certificate of Compliance Guarantee. Rest assured you will receive the Manufacturer's Certificate of Compliance with your order. Certificate of Compliance Guarantee
This product may require extra documentation. Shipping may be delayed 1-2 days.
Product Attribute
Attribute Value Select Attribute
Products found: 0
Supplier:
Microchip Technology
Part No:
PIC24FJ256GB106-I/PT
RoHS:
Yes
HTS:
8542310020
COO:
TH
ECCN:
3A991.a.2
Supplier's Standard Package The item count, length, weight, or volume contained in the supplier’s original packaging for efficient storage, handling, and distribution.
160
Package Type:
TRAY
Operating Temperature:
-40 to 85 °C
Program Memory Type:
Flash
Number of Programmable I/Os:
52
ADC Resolution:
10 bit
Program Memory Size:
256 KB
RAM Size:
16 KB
The PIC24FJ256GB106-I/PT is a 16bit, general purpose flash microcontroller in 64 pin TQFP package. The device has five 16bit timers, 16 channel 10bit A/D converter, three analogue comparators with programmable input/output configuration, hardware real time clock/calendar (RTCC) and charge time measurement unit (CTMU).
Search Keywords:
PIC24FJ256GB106IPT
  Different packaging options available.  See Alternatives
IN STOCK: 1,221
Ships today, if you order in
On Order:
480   can ship 12/4/26 
Minimum Order Quantity:
5
Factory Lead-Time
38 Weeks
Price (USD)
Quantity
Unit Price
Ext. Price
5
$7.58
$37.90
25
$6.72
$168.00
50
$6.34
$317.00
160
$5.98
$956.80
320
$5.95
$1,904.00
640
$5.94
$3,801.60
1,120
$5.92
$6,630.40
2,560 +
$5.91
$15,129.60
Supplier's Standard Package
Product Changes
PDF PCN - 06-Nov-2009 - QUALIFICATION OF TQFP PACKAGE WITH SG-8300ECM MOLD COMPOUND AT MTAI ASSEMBLY SITE.
PDF PCN - 11-Nov-2011 - QUALIFICATION OF YGAN/Z/H/Q/R/S/U/W/Y, UCAA, UFAC, UFAD UGAA,UGAF MASKS WITHOUT POLYIMIDE PROCESS
PDF PCN - 10-Nov-2011 - Microchip is announcing the qualification of YGAN, YGAZ, YGAH, YGAQ, YGAR, YGAS, YGAU, YGAW, YGAY, U
PDF PCN - 11-Oct-2013 - Microchip is announcing the qualification of masks UDAAx, UFACx, UGABx and YGAYx at an additional wa
PDF PCN - 11-Oct-2013 - Microchip is announcing the qualification of MTAI assembly site with palladium coated copper (PdCu)
PDF PCN - 15-Nov-2013 - QUALIFICATION OF SELECTED PRODUCTS AVAILABLE IN THE 64L TQFP PACKAGE WITH PALLADIUM COATED COPPER
PDF PCN - 22-May-2015 - QUALIFICATION OF A NEW 13 INCH PLASTIC REEL WITH SMALLER WINDOW FOR SELECTED PACKAGES AT MTAI, MMT
PDF PCN - 01-Nov-2015 - INTEGRATION OF THE MICREL PCN SYSTEM WITH THE MICROCHIP PCN SYSTEM
PDF PCN - 01-Nov-2016 - IMPLEMENT PACKING CHANGES WITHOUT INNER BOX FOR MSL 1 MICROCHIP PRODUCTS SHIPPED FROM ALL LOCATIONS
PDF PCN - 01-Sep-2009 - MPLAB C FOR PIC24/DSPIC V3.20 RELEASED
PDF PCN - 13-Jul-2011 - ERRATA-PIC24FJ256GB110 FAMILY SILICON/DATA SHEET ERRATA
PDF PCN - 28-Nov-2011 - ERRATA-PIC24FJ256GB110 FAMILY SILICON/DATA SHEET ERRATA DOCUMENT REVISION
PDF PCN - 23-Oct-2009 - Microchip is announcing the final qualification of the TQFP package with SG-8300ECM mold compound at
PDF PCN - 03-Jan-2014 - QUALIFICATION OF MASKS UDAAX, UFACX, UGABX & YGAYX AT AN ADDITIONAL WAFER FABRICATION SITE
PDF PCN - 10-Mar-2011 - Microchip is announcing the qualification of YGANx, YGAYx, YGAWx, YGAUx, YGASx, YGARx, and YGAQx mas
PDF PCN - 22-Jul-2009 - Microchip is qualifying the TQFP package with SG-8300ECM mold compound at MTAI assembly site in orde
PDF PCN - 01-Nov-2016 - IMPLEMENT PACKING CHANGES WITHOUT INNER BOX FOR MSL 1 MICROCHIP PRODUCTS SHIPPED FROM ALL LOCATIONS
PDF PCN - 19-Nov-2015 - CCB 1727 FINAL NOTICE IMPLEMENT LABEL AND PACKING CHANGES FOR MICROCHIP PRODUCTS
PDF PCN - 04-Feb-2021 - CUSTOMERS TO IMMEDIATELY PLACE THEIR 12-MONTH NON-CANCELLABLE NON-RESCHEDULABLE BACKLOG ON MICROCHIP
PDF PCN - 03-Mar-2009 - MPLAB C COMPILER DSPIC DSCS V3.12 HAS BEEN RELEASED TO THE WEB
PDF PCN - 14-Jan-2011 - QUALIFICATION OF YGANX, YGAYX, YGAWX, YGAUX, YGASX, YGARX, AND YGAQX MASKS AT ADDITIONAL WAFER SITE
PDF PCN - 14-Jul-2011 - ERRATA-PIC24FJ256GA110 FAMILY SILICON/DATA SHEET ERRATA
PDF PCN - 04-Mar-2011 - Microchip is announcing the qualification of YGAN, YGAZ, YGAH, YGAQ, YGAR, YGAS, YGAU, YGAW, YGAY, U
PDF PCN - 09-Feb-2022 - PIC24FJ256GB110 FAMILY SILICON/DATA SHEET ERRATA DOCUMENT REVISION
PDF PCN - 01-Jun-2011 - QUALIFICATION OF YGAN/Z/H/Q/R/S/U/W/Y, UCAA, UFAC, AND UFAD MASKS WITHOUT POLYIMIDE PROCESS
PDF PCN - 05-Aug-2010 - Microchip is announcing the implementation of shipping label and package change for the listed produ
PDF PCN - 01-Aug-2014 - QUALIFICATION OF C194 LEAD-FRAME IN 64L AND 44L TQFP (10X10) PACKAGES AT ANAP (ATP) ASSEMBLY SITE
PDF PCN - 23-Oct-2009 - QUALIFICATION OF TQFP PACKAGE WITH SG-8300ECM MOLD COMPOUND AT MTAI ASSEMBLY SITE
PDF PCN - 19-Feb-2010 - ERRATA - PIC24FJ256GB110 FAMILY REV. A3 SILICON ERRATA
PDF PCN - 14-Jan-2011 - QUALIFICATION OF YGANX, YGAYX, YGAWX,YGAUX, YGASX, YGARX,YGAQX MASKS AT AN ADDITIONAL WAFER
PDF PCN - 15-Feb-2011 - Microchip is announcing the change in package and implementation of new shipping labels for all list
PDF PCN - 29-Jan-2014 - Microchip is expanding its test facilities to Microchip Thailand (MMT) for all commercial products i
PDF PCN - 22-Jan-2013 - ERRATA-PIC24FJ256GB110 FAMILY SILICON/DATA SHEET ERRATA
PDF PCN - 22-May-2015 - QUALIFICATION OF A NEW 13 INCH PLASTIC REEL WITH SMALLER WINDOW FOR SELECTED PACKAGES
PDF PCN - 17-Dec-2009 - MICROCHIP HAS RELEASED A NEW DEVICEDOC
PDF PCN - 10-Nov-2010 - Microchip is announcing the amended of its previous notice CYER-05LNSD835 which announces the implem
PDF PCN - 02-Jun-2011 - Microchip is announcing the qualification of 64L QFN (9x9) packages with EFTEC-64T leadframe at NSEB
PDF PCN - 08-Aug-2013 - Microchip is implementing a convention change to the sales order (SO) number for the listed products
PDF PCN - 03-Jan-2014 - QUALIFICATION OF MASKS UDAAX, UFACX, UGABX & YGAYX AT AN ADDITIONAL WAFER FABRICATION SITE
PDF PCN - 02-Sep-2011 - MPLAB C FOR PIC24 AND DSPIC V3.30 RELEASED.
PDF PCN - 11-Nov-2011 - QUALIFICATION OF YGAN/Z/H/Q/R/S/U/W/Y, UCAA, UFAC, AND UFAD MASKS WITHOUT POLYIMIDE PROCESS
PDF PCN - 02-Aug-2012 - Microchip is announcing the qualification of YGANx, YGAYx, YGAWx, YGAUx, YGASx, YGARx, and YGAQx mas
PDF PCN - 01-Sep-2014 - QUALIFICATION OF C194 LEAD-FRAME IN 64L AND 44L TQFP (10X10) PACKAGES AT ANAP (ATP) ASSEMBLY SITE
PDF PCN - 01-Sep-2014 - QUALIFICATION OF C194 LEAD-FRAME IN 64L AND 44L TQFP (10X10) PACKAGES AT ANAP (ATP) ASSEMBLY SITE
PDF PCN - 20-May-2015 - QUALIFICATION OF A NEW 13 INCH PLASTIC REEL WITH SMALLER WINDOW FOR SELECTED PACKAGES
PDF PCN - 27-Apr-2018 - QUALIFICATION OF CUPDAU BOND WIRE IN SELECTED PRODUCTS AVAILABLE IN 64L AND AND 44L TQFP PACKAGE
PDF PCN - 01-Sep-2017 - IMPLEMENT MARKING CHANGES FOR VIRTUALLY ALL ATMEL PRODUCTS
PDF PCN - 15-Nov-2013 - QUALIFICATION OF SELECTED PRODUCTS AVAILABLE IN THE 64L TQFP PACKAGE WITH PALLADIUM COATED COPPER
PDF PCN - 19-Nov-2015 - CCB 1727 FINAL NOTICE: IMPLEMENT LABEL AND PACKING CHANGES FOR MICROCHIP PRODUCTS
PDF PCN - 15-Sep-2010 - MICROCHIP HAS RELEASED A NEW DEVICEDOC FOR THE PIC24FJ256GB110
PDF PCN - 27-Sep-2011 - Microchip is announcing the qualification of YGAN, YGAZ, YGAH, YGAQ, YGAR, YGAS, YGAU, YGAW, YGAY, U
PDF PCN - 11-Oct-2013 - IMPLEMENT A CONVENTION CHANGE TO THE SALES ORDER (SO) NUMBER
PDF PCN - 01-Nov-2015 - INTEGRATION OF THE MICREL PCN SYSTEM WITH THE MICROCHIP PCN SYSTEM
PDF PCN - 01-Sep-2017 - IMPLEMENT MARKING CHANGES FOR VIRTUALLY ALL ATMEL PRODUCTS
PDF Product Change Notification

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