25AA1024T-I/SM by microchip technology
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DATA SHEET

25AA1024T-I/SM

Microchip Technology

EEPROM Memory - 1Mbit - 128K x 8 Memory Organization - SPI Memory Interface - 20 MHz - 6ms - 1.8V to 5.5V Supply - 8-SOIJ Package - Surface Mount. .. see full description

RoHS Compliant
REEL Packaging
Accessories
Accessories
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This product may require extra documentation. Shipping may be delayed 1-2 days.
Product Attribute
Attribute Value Select Attribute
Products found: 0
Supplier:
Microchip Technology
Part No:
25AA1024T-I/SM
RoHS:
Yes
HTS:
8542320051
COO:
TH
ECCN:
3A991.b.1.b.2
Supplier's Standard Package The item count, length, weight, or volume contained in the supplier’s original packaging for efficient storage, handling, and distribution.
2100
Package Type:
REEL
Data Retention:
200(Min) Year
The 25AA1024T-I/SM from Microchip Technology is surface mount EEPROM memory with 1Mbit memory size, 128K x 8 memory organization, 20 MHz clock frequency and 6ms write cycle time. This EEPROM memory has SPI memory interface and comes in 8-pin SOIJ package. The 25AA1024T-I/SM has wide supply voltage range from 1.8V to 5.5V. Operating temperature range is from -40°C to 85°C.
Search Keywords:
25AA1024TISM
  Different packaging options available.  See Alternatives
IN STOCK: 7,808
Ships today, if you order in
Minimum Order Quantity:
100
Factory Lead-Time
26 Weeks
Price (USD)
Quantity
Unit Price
Ext. Price
100
$3.30
$330.00
250
$3.28
$820.00
500
$3.20
$1,600.00
2,100
$3.19
$6,699.00
4,200
$3.17
$13,314.00
6,300
$3.16
$19,908.00
8,400 +
$3.15
$26,460.00
Supplier's Standard Package
Product Guides
PDF Datasheet
Product Changes
PDF PCN - 10-Oct-2016 - IMPLEMENT PACKING CHANGES WITHOUT INNER BOX FOR MSL 1 MICROCHIP PRODUCTS SHIPPED FROM ALL LOCATIONS
PDF PCN - 07-May-2015 - QUALIFICATION OF A NEW 13 INCH PLASTIC REEL WITH SMALLER WINDOW FOR SELECTED PACKAGES
PDF PCN - 13-Jan-2011 - QUALIFICATION OF MEMORY PRODUCTS WITH PALLADIUM COATED COPPER (CUPD) WIRE AT MTAI ASSEMBLY SITE
PDF PCN - 08-Oct-2007 - QUALIFICATION OF GE800 MOLD COMPOUND IN ASSORTED PDIP/SPDIP PACKAGES AT ALPH
PDF PCN - 23-Sep-2015 - CCB 1727 FINAL NOTICE IMPLEMENT LABEL AND PACKING CHANGES FOR MICROCHIP PRODUCTS
PDF PCN - 28-Apr-2011 - QUALIFICATION OF MEMORY PRODUCTS WITH PALLADIUM COATED COPPER (CUPD) WIRE AT MTAI ASSEMBLY SITE
PDF PCN - 23-Sep-2015 - CCB 1727 FINAL NOTICE: IMPLEMENT LABEL AND PACKING CHANGES FOR MICROCHIP PRODUCTS
PDF PCN - 10-Oct-2016 - IMPLEMENT PACKING CHANGES WITHOUT INNER BOX FOR MSL 1 MICROCHIP PRODUCTS SHIPPED FROM ALL LOCATIONS
PDF PCN - 20-May-2015 - QUALIFICATION OF A NEW 13 INCH PLASTIC REEL WITH SMALLER WINDOW FOR SELECTED PACKAGES
PDF PCN - 21-Oct-2008 - Microchip is changing the Format and adding quantity barcode to the standard die/wafer inner box lab
PDF PCN - 19-Apr-2010 - QUALIFICATION OF 8L, 14L, & 16L PDIP AT GTK (GRTK) ASSEMBLY SITE.
PDF PCN - 19-Mar-2013 - Microchip is qualifying the listed 8L SOIJ package products without silver plating on the paddle and
PDF PCN - 21-Sep-2015 - INTEGRATION OF THE MICREL PCN SYSTEM WITH THE MICROCHIP PCN SYSTEM
PDF PCN - 02-Sep-2011 - Microchip is announcing the qualification of the listed memory products in 8L SOIC, 8L SOIJ, 8L PDIP
PDF PCN - 07-Oct-2005 - 8L SOIJ 208'' PACKAGE QUALIFICATION AT NEW ASSEMBLY PLANT NSE2 (NS ELECTRONICS, BANGKOK)
PDF PCN - 07-May-2015 - QUALIFICATION OF A NEW 13 INCH PLASTIC REEL WITH SMALLER WINDOW FOR SELECTED PACKAGES AT MTAI, MMT
PDF PCN - 06-Mar-2006 -
PDF PCN - 24-May-2010 - Microchip has released a new DeviceDoc for the 25AA1024 Device Data Sheet of devices.
PDF PCN - 24-May-2010 - DATA SHEET-25AA1024 DEVICE DATA SHEET
PDF PCN - 29-Jan-2014 - Microchip is expanding its test facilities to Microchip Thailand (MMT) for all commercial products i
PDF PCN - 08-Aug-2013 - Microchip is implementing a convention change to the sales order (SO) number for the listed products
PDF PCN - 03-Jun-2004 - Microchip is qualifying Amkor Shanghai, China (ATC) as an additional assembly capacity for 8L SOIC p
PDF PCN - 28-Feb-2013 - QUALIFICATION OF 8L SOIJ PACKAGE WITHOUT SILVER PLATING ON THE PADDLE
PDF PCN - 04-Feb-2021 - CUSTOMERS TO IMMEDIATELY PLACE THEIR 12-MONTH NON-CANCELLABLE NON-RESCHEDULABLE BACKLOG ON MICROCHIP
PDF PCN - 20-May-2015 - QUALIFICATION OF A NEW 13 INCH PLASTIC REEL WITH SMALLER WINDOW FOR SELECTED PACKAGES AT MTAI, MMT
PDF PCN - 24-Jan-2008 - Change in Inner Box Label Format MTAI to include additional Bar Code for total quantity of parts shi
PDF PCN - 26-Jan-2009 - Microchip Technology is changing the shipping materials from moisture barrier bag to static shielded
PDF PCN - 24-Jan-2008 - CHANGE IN INNER BOX LABEL FORMAT TO INCLUDE ADDITIONAL BAR CODE
PDF PCN - 21-Sep-2015 - INTEGRATION OF THE MICREL PCN SYSTEM WITH THE MICROCHIP PCN SYSTEM
PDF PCN - 08-Aug-2013 - IMPLEMENT A CONVENTION CHANGE TO THE SALES ORDER (SO) NUMBER
PDF PCN - 10-Nov-2010 - Microchip is announcing the amended of its previous notice CYER-05LNSD835 which announces the implem
PDF PCN - 23-Sep-2010 - Microchip is announcing the qualification of listed 8L SOIJ package products with SG-8300GM mold com
PDF PCN - 08-Nov-2010 - QUALIFICATION OF 8L SOIJ PACKAGE WITH SG-8300GM MOLD COMPOUND AT MTAI ASSEMBLY SITE
PDF PCN - 18-Oct-2016 - QUALIFICATION OF PALLADIUM COATED COPPER WITH GOLD FLASH (CUPDAU) BOND WIRE IN SELECTED PRODUCTS
PDF PCN - 13-Jan-2011 - Microchip is announcing the qualification of listed memory products in 8L SOIC, 8L SOIJ, 8L PDIP, 8L
PDF PCN - 31-Jul-2013 - Microchip is announcing the qualification of the listed 8L SOIJ package products without silver plat
PDF PCN - 18-Oct-2016 - QUALIFICATION OF PALLADIUM COATED COPPER WITH GOLD FLASH (CUPDAU) BOND WIRE IN SELECTED PRODUCTS
PDF PCN - 25-Sep-2007 - Change in shipping box dimensions and lables at MTAI for all Microchip catalog parts Packed in reels
PDF PCN - 11-Nov-2004 - CHANGE FROM SNPB (TIN/LEAD) PLATING TO MATTE TIN (SN) PLATING ON THE DEVICE LEADS
PDF PCN - 28-Feb-2013 - QUALIFICATION OF 8L SOIJ PACKAGE WITHOUT SILVER PLATING ON THE PADDLE AND LEAD LOCK FEATURE ON LEAD
PDF PCN - 02-Nov-2007 - CHANGE IN BOM
PDF PCN - 19-Mar-2013 - QUALIFICATION OF 8L SOIJ PACKAGE WITHOUT SILVER PLATING ON THE PADDLE
PDF PCN - 11-Jul-2017 - IMPLEMENT MARKING CHANGES FOR VIRTUALLY ALL ATMEL PRODUCTS
PDF PCN - 14-Sep-2005 - QUALIFICATION OF 8L SOIC AT NEW ASSEMBLY SITE VIGILANT,THAILAND
PDF PCN - 22-Oct-2013 - PCN REVISED: REMOVED DEVICES FROM THE FINAL NOTIFICATION
PDF PCN - 25-Sep-2007 - LABEL SIZE CHANGE FROM ALUMINUM BAGS & INNER BOXES 17X4 CM2 TO 14X4 CM2
PDF PCN - 14-Oct-2021 - DATA SHEET - 25AA1024 1 MBIT SPI BUS SERIAL EEPROM DEVICE DATA SHEET DOCUMENT REVISION
PDF PCN - 06-Mar-2006 - QUALIFICATION OF NEW PLATING SITE FOR SNPB & MATTE TIN PLATING
PDF PCN - 11-Nov-2004 -
PDF PCN - 05-Aug-2010 - Microchip is announcing the implementation of shipping label and package change for the listed produ
PDF PCN - 31-Jul-2013 - QUALIFICATION OF 8L SOIJ PACKAGE WITHOUT SILVER PLATING ON THE PADDLE
PDF PCN - 06-Feb-2010 - DATA SHEET-25AA1024 DEVICE DATA SHEET
PDF PCN - 07-Oct-2005 -
PDF PCN - 28-Feb-2013 - Microchip is announcing the qualification of 8L SOIJ package without silver plating on the paddle an
PDF PCN - 15-Feb-2011 - Microchip is announcing the change in package and implementation of new shipping labels for all list
PDF PCN - 28-Apr-2011 - Microchip is announcing the qualification of listed memory products in 8L SOIC, 8L SOIJ, 8L PDIP, 8L
PDF PCN - 11-Jul-2017 - IMPLEMENT MARKING CHANGES FOR VIRTUALLY ALL ATMEL PRODUCTS
PDF PCN - 13-Jun-2016 - QUALIFICATION OF PALLADIUM COATED COPPER WITH GOLD FLASH (CUPDAU) BOND WIRE IN SELECTED PRODUCTS
PDF PCN - 31-Jul-2013 - QUALIFICATION OF 8L SOIJ PACKAGE WITHOUT SILVER PLATING ON THE PADDLE
PDF PCN - 13-Jun-2016 - QUALIFICATION OF PALLADIUM COATED COPPER WITH GOLD FLASH (CUPDAU) BOND WIRE IN SELECTED PRODUCTS
PDF PCN - 08-Nov-2010 - Microchip is announcing the qualification of listed 8L SOIJ package products with SG-8300GM mold com
PDF PCN - 06-Mar-2006 - Product Change Notice
PDF PCN - 11-Nov-2004 - Product Change Notice
PDF PCN - 07-Oct-2005 - Product Change Notice

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