MCP1725-3302E/MC by microchip technology
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DATA SHEET

MCP1725-3302E/MC

Microchip Technology

LDO Regulator Pos 3.3V 0.5A Automotive 8-Pin DFN EP .. see full description

RoHS Compliant
TUBE Packaging
Accessories
Accessories
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Product Attribute
Attribute Value Select Attribute
Products found: 0
Supplier:
Microchip Technology
Part No:
MCP1725-3302E/MC
RoHS:
Yes
HTS:
8542390090
COO:
TH
ECCN:
EAR99
Supplier's Standard Package The item count, length, weight, or volume contained in the supplier’s original packaging for efficient storage, handling, and distribution.
150
Package Type:
TUBE
Maximum Dropout Voltage @ Current:
0.35@500mA V
Junction to Case:
N/A
Accuracy:
±2 %
Line Regulation:
0.05(Typ) %/V
Junction to Ambient:
52(Typ) °C/W
Dimension:
2 x 3 x 0.95(Max) mm
Function:
LDO
Load Regulation:
0.5(Typ) %
Family:
MCP1725
The MICROCHIP TECH. MCP1725-3302E/MC is a low-dropout (LDO) regulator with a positive voltage output of 3.3V and a maximum current rating of 0.5A. Designed specifically for automotive applications, this regulator offers reliable and stable power supply to various electronic systems in a vehicle. The 8-Pin DFN EP package ensures compactness and easy integration into space-constrained designs.
Search Keywords:
MCP17253302EMC
  Different packaging options available.  See Alternatives
IN STOCK: 900
Ships today, if you order in
Minimum Order Quantity:
150
Multiple:
150
Factory Lead-Time
13 Weeks
Price (USD)
Quantity
Unit Price
Ext. Price
150
$0.539
$80.850
600
$0.533
$319.800
1,050
$0.529
$555.450
2,550
$0.527
$1,343.850
5,100
$0.525
$2,677.500
7,500
$0.524
$3,930.000
10,050
$0.523
$5,256.150
15,000 +
$0.522
$7,830.000
Supplier's Standard Package
Product Guides
PDF Datasheet
Product Changes
PDF PCN - 26-Jan-2009 - Microchip Technology is changing the shipping materials from moisture barrier bag to static shielded
PDF PCN - 30-Nov-2011 - Microchip is announcing the qualification of 8L SOIC with SG-8300GM mold compound at ALPH (MMT) asse
PDF PCN - 24-Jan-2008 - Change in Inner Box Label Format MTAI to include additional Bar Code for total quantity of parts shi
PDF PCN - 21-Oct-2008 - Microchip is changing the Format and adding quantity barcode to the standard die/wafer inner box lab
PDF PCN - 22-Sep-2011 - Microchip is announcing the qualification of 8L SOIC with SG-8300GM MC at ALPH (MMT) assembly site f
PDF PCN - 15-May-2011 - QUALIFICATION OF GEAXX MASKS WITH THE CMP PROCESS
PDF PCN - 10-Jul-2009 - Qualification Of 8L Dfn Package With Crm1076Dj Epoxy And G770Hcd Mold Compound At Unisem Assembly
PDF PCN - 28-Feb-2009 - Qualification Of 8L Dfn Package With Crm1076Dj Epoxy And G770Hcd Mold Compound At Unisem Assembly
PDF PCN - 30-May-2011 - Qualification Of 8L Dfn (2X3) Packages With Eftec-64T Lead Frame At Nseb (Utl)
PDF PCN - 28-Mar-2011 - Microchip is announcing the qualification of listed GEAxx masks with the CMP process in order to imp
PDF PCN - 17-Dec-2008 - Microchip Is Qualifying The 8L Dfn Package With Crm1076Dj Epoxy And G770Hcd Mold Compound At Unisem
PDF PCN - 22-Feb-2011 - Microchip Is Announcing The Qualification Of 8L Dfn (2X3) Packages With Eftec-64T Leadframe At Nseb
PDF PCN - 24-Jun-2009 - Microchip Is Qualifying The 8L Dfn Package With Crm1076Dj Epoxy And G770Hcd Mold Compound At Unisem
PDF PCN - 19-May-2011 - Microchip is announcing the qualification of 8L DFN (2x3) packages with EFTEC-64T leadframe at NSEB
PDF PCN - 25-Sep-2007 - Change in shipping box dimensions and lables at MTAI for all Microchip catalog parts Packed in reels
PDF PCN - 15-Feb-2011 - Microchip is announcing the change in package and implementation of new shipping labels for all list

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