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MCP23S17-E/ML by microchip technology
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DATA SHEET

MCP23S17-E/ML

Microchip Technology

16-Bit I/O Expander - 10MHz - SPI - 5.5 V - QFN - 28-Pin. .. see full description

RoHS Compliant
TUBE Packaging
Accessories
Accessories
This product is backed by Ecco Electronics' Certificate of Compliance Guarantee. Rest assured you will receive the Manufacturer's Certificate of Compliance with your order. Certificate of Compliance Guarantee
Product Attribute
Attribute Value Select Attribute
Products found: 0
Supplier:
Microchip Technology
Part No:
MCP23S17-E/ML
RoHS:
Yes
HTS:
8542390090
COO:
MY
ECCN:
EAR99
Supplier Standard Pack This information is provided for customers who prefer to buy in multiples of the Manufacturer’s Standard Package quantity. Minimum Order Quantities and Required Order Multiples are presented with our price and availability information.
61
Package Type:
TUBE
Maximum Operating Supply Voltage:
5.5 V
Dimension:
6 x 6 x 0.88 mm
Family:
MCP23S17
Interrupt Output:
Yes
I2C Bus Interface Mode:
Standard Mode
Manual Reset:
Yes
Interface Speed:
10000 kHz
Interface Type:
SPI
The MCP23017/MCP23S17 (MCP23X17) device family provides 16-bit, general purpose parallel I/O expansion for I2C bus or SPI applications. The MCP23X17 consists of multiple 8-bit configuration registers for input, output and polarity selection. The system master can enable the I/Os as either inputs or outputs by writing the I/O configuration bits (IODIRA/B). The data for each input or output is kept in the corresponding input or output register. The polarity of the Input Port register can be inverted with the Polarity Inversion register. All registers can be read by the system master.
Search Keywords:
MCP23S17EML
  Different packaging options available.  See Alternatives
IN STOCK: 0
Minimum Order Quantity:
61
Multiple:
61
Factory Lead-Time
12 Weeks
Price (USD)
Quantity
Unit Price
Ext. Price
61
$1.45
$88.45
305
$1.36
$414.80
549
$1.34
$735.66
1,037
$1.28
$1,327.36
2,501
$1.27
$3,176.27
5,002
$1.26
$6,302.52
7,503
$1.25
$9,378.75
10,004 +
$1.24
$12,404.96
Supplier's Standard Package
Product Guides
PDF Datasheet
Product Changes
PDF PCN - 20-Jul-2015 - QUALIFICATION OF C194 LEAD-FRAME FOR SELECTED QFN AND UQFN PACKAGES AT NSEB ASSEMBLY SITE
PDF PCN - 11-Jul-2017 - IMPLEMENT MARKING CHANGES FOR VIRTUALLY ALL ATMEL PRODUCTS
PDF PCN - 27-Oct-2008 - QUALIFICATION OF 28L QFN PACKAGE (6X6X0.9MM) AT ATP ASSEMBLY
PDF PCN - 01-Jul-2022 - DOCUMENT CHANGE
PDF PCN - 20-Mar-2014 - IMPLEMENT LABEL AND PACKING CHANGES FOR SMSC PRODUCTS
PDF PCN - 24-Apr-2017 - QUALIFICATION OF CUPDAU BOND WIRE FOR SELECTED PRODUCTS OF 150K AND 160K WAFER TECHNOLOGY
PDF PCN - 20-Apr-2011 - QUALIFICATION OF 28L QFN (6X6) PACKAGE AT ASAC (UTAC) ASSEMBLY SITE
PDF PCN - 05-Feb-2014 - IMPLEMENT LABEL AND PACKING CHANGES FOR SMSC PRODUCTS
PDF PCN - 16-Feb-2015 - QUALIFICATION OF C194 LEAD-FRAME FOR SELECTED QFN AND UQFN PACKAGES AT NSEB ASSEMBLY SITE
PDF PCN - 24-Aug-2011 - Microchip is announcing the qualification of 8L, 14L, 16L, 20L PDIP, & 28L SPDIP with CRM-1064L die
PDF PCN - 25-Nov-2016 - QUALIFICATION OF CUPDAU WIRE IN SELECTED PRODUCTS OF THE 150K AND 160K WAFER TECHNOLOGIES AVAILABLE
PDF PCN - 27-Mar-2009 - PCN CCB#848 CANCELLED
PDF PCN - 27-Mar-2009 - Microchip is cancelling the previously announced CCB#848 as the current production demand for 28L QF
PDF PCN - 22-Jul-2008 - Microchip is announcing the qualification of UTAC THAI LIMITED (UTL) as a new test site for 28QFN (6
PDF PCN - 06-Feb-2008 - Qualification of CRM1706DJ die attach EPOXY and G770HCD mold compound for 20L QFN (4X4), 28L QFN (6X
PDF PCN - 08-Aug-2013 - IMPLEMENT A CONVENTION CHANGE TO THE SALES ORDER (SO) NUMBER
PDF PCN - 08-Nov-2010 - QUALIFICATION OF 28L QFN (6X6) PACKAGE AT ASAC (UTAC) ASSEMBLY SITE.
PDF PCN - 08-Mar-2007 -
PDF PCN - 16-Feb-2015 - QUALIFICATION OF C194 LEAD-FRAME FOR SELECTED QFN AND UQFN PACKAGES AT NSEB ASSEMBLY SITE
PDF PCN - 21-Oct-2016 - QUALIFICATION OF CUPDAU BOND WIRE IN 150K WAFER TECHNOLOGY AVAILABLE IN 28L QFN PACKAGE
PDF PCN - 03-Nov-2011 - Microchip is announcing the qualification of 18 & 28L SOIC package with SG-8300GM mold compound at M
PDF PCN - 04-Feb-2021 - CUSTOMERS TO IMMEDIATELY PLACE THEIR 12-MONTH NON-CANCELLABLE NON-RESCHEDULABLE BACKLOG ON MICROCHIP
PDF PCN - 09-Jan-2014 - Microchip is announcing the qualification the listed products with palladium coated copper (PdCu) bo
PDF PCN - 16-Aug-2017 - QUALIFICATION OF CUPDAU BOND WIRE IN 150K WAFER TECHNOLOGY AVAILABLE IN 28L QFN PACKAGE
PDF PCN - 11-Jul-2017 - IMPLEMENT MARKING CHANGES FOR VIRTUALLY ALL ATMEL PRODUCTS
PDF PCN - 26-Apr-2018 - QUALIFICATION OF MMT AS AN ADDITIONAL SITE FOR SELECTED PRODUCTS
PDF PCN - 23-Sep-2015 - CCB 1727 FINAL NOTICE IMPLEMENT LABEL AND PACKING CHANGES FOR MICROCHIP PRODUCTS
PDF PCN - 20-Jul-2015 - QUALIFICATION OF G700LTD MOLD COMPOUND AND 8600 DIE ATTACH IN VARIOUS QFN PACKAGES
PDF PCN - 25-Nov-2016 - QUALIFICATION OF CUPDAU WIRE IN SELECTED PRODUCTS OF THE 150K AND 160K WAFER TECHNOLOGIES AVAILABLE
PDF PCN - 15-Feb-2011 - Microchip is announcing the change in package and implementation of new shipping labels for all list
PDF PCN - 16-Aug-2017 - QUALIFICATION OF CUPDAU BOND WIRE IN 150K WAFER TECHNOLOGY AVAILABLE IN 28L QFN PACKAGE
PDF PCN - 26-Dec-2013 - QUALIFICATION OF 28L QFN, 20L QFN AND 16L QFN PACKAGES AT MTAI ASSEMBLY SITE
PDF PCN - 07-Jul-2016 - MCP23017/MCP23S17 DATA SHEET DOCUMENT REVISION
PDF PCN - 25-Jun-2015 - CANCELLATION NOTICE: QUALIFICATION OF SELECTED PRODUCTS WITH PDCU BOND WIRE AT MTAI SITE
PDF PCN - 22-Jul-2008 - QUALIFICATION OF UTAC THAI LIMITED (UTL) TO TEST 28QFN (6X6) PACKAGED PRODUCTS
PDF PCN - 07-May-2015 - QUALIFICATION OF A NEW 13 INCH PLASTIC REEL WITH SMALLER WINDOW FOR SELECTED PACKAGES
PDF PCN - 07-May-2015 - QUALIFICATION OF A NEW 13 INCH PLASTIC REEL WITH SMALLER WINDOW FOR SELECTED PACKAGES AT MTAI, MMT
PDF PCN - 27-Feb-2018 - QUALIFICATION OF CUPDAU BOND WIRE IN SELECTED PRODUCTS OF THE 150K AND 160K WAFER TECHNOLOGY
PDF PCN - 05-Aug-2010 - Microchip is announcing the implementation of shipping label and package change for the listed produ
PDF PCN - 01-Feb-2018 - QUALIFICATION OF MMT AS AN ADDITIONAL ASSEMBLY SITE FOR SELECTED PRODUCTS
PDF PCN - 08-Aug-2013 - Microchip is implementing a convention change to the sales order (SO) number for the listed products
PDF PCN - 10-Sep-2008 - NEW ASSEMBLY SITE
PDF PCN - 21-Oct-2008 - Microchip is changing the Format and adding quantity barcode to the standard die/wafer inner box lab
PDF PCN - 24-Jan-2008 - Change in Inner Box Label Format MTAI to include additional Bar Code for total quantity of parts shi
PDF PCN - 10-Oct-2016 - IMPLEMENT PACKING CHANGES WITHOUT INNER BOX FOR MSL 1 MICROCHIP PRODUCTS SHIPPED FROM ALL LOCATIONS
PDF PCN - 16-Jan-2018 - QUALIFICATION OF MMT AS AN ADDITIONAL ASSEMBLY SITE FOR SELECTED PRODUCTS OF 150K AND 160 TECHNOLOGY
PDF PCN - 10-Sep-2008 - QUALIFICATION OF 28L QFN (6X6X0.9MM) PACKAGE AT ASAT LIMITED, CHINA (ASAC) ASSEMBLY
PDF PCN - 24-Apr-2017 - QUALIFICATION OF CUPDAU BOND WIRE FOR SELECTED PRODUCTS OF 150K AND 160K WAFER TECHNOLOGY
PDF PCN - 21-Oct-2016 - QUALIFICATION OF CUPDAU BOND WIRE IN 150K WAFER TECHNOLOGY AVAILABLE IN 28L QFN PACKAGE
PDF PCN - 23-Sep-2015 - CCB 1727 FINAL NOTICE: IMPLEMENT LABEL AND PACKING CHANGES FOR MICROCHIP PRODUCTS
PDF PCN - 08-Nov-2010 - Microchip is announcing the qualification of 28L QFN (6x6) package at ASAC (UTAC) assembly site in o
PDF PCN - 26-Jan-2009 - Microchip Technology is changing the shipping materials from moisture barrier bag to static shielded
PDF PCN - 25-Sep-2007 - Change in shipping box dimensions and lables at MTAI for all Microchip catalog parts Packed in reels
PDF PCN - 28-Jun-2010 - QUALIFICATION OF DIFFERENT PADDLE SIZES IN 18L & 28L SOIC PACKAGES AT MMS (ATES).
PDF PCN - 21-Jul-2008 - Microchip is announcing the qualification of 28L QFN package (6X6X0.9mm) at ATP Assembly in order to
PDF PCN - 10-Nov-2010 - Microchip is announcing the amended of its previous notice CYER-05LNSD835 which announces the implem
PDF PCN - 20-May-2015 - QUALIFICATION OF A NEW 13 INCH PLASTIC REEL WITH SMALLER WINDOW FOR SELECTED PACKAGES
PDF PCN - 28-Jan-2014 - QUALIFICATION OF 28L QFN, 20L QFN AND 16L QFN PACKAGES AT MTAI ASSEMBLY SITE
PDF PCN - 26-Dec-2013 - Microchip is announcing the qualification of the listed 28L QFN (6x6x0.9mm and 5x5x0.9mm), 20L QFN (
PDF PCN - 09-Nov-2011 - Microchip is announcing the qualification of 8L, 14L, 16L, 20L PDIP, & 28L SPDIP with CRM-1064L die
PDF PCN - 01-Apr-2014 - QUALIFICATION OF SELECTED PRODUCTS IN 28L QFN, 20L QFN & 16L QFN WITH PDCU BOND WIRE AT MTAI SITE
PDF PCN - 10-Sep-2008 - Microchip is announcing the qualification of new assembly site for 28L QFN (6X6X0.9MM) package dsPIC
PDF PCN - 01-Apr-2014 - QUALIFICATION OF SELECTED PRODUCTS IN 28L QFN, 20L QFN & 16L QFN WITH PDCU BOND WIRE AT MTAI SITE
PDF PCN - 06-Feb-2008 - QUALIFICATION OF CRM1706DJ DIE ATTACH EPOXY AND G770HCD MOLD COMPOUND
PDF PCN - 10-Oct-2016 - IMPLEMENT PACKING CHANGES WITHOUT INNER BOX FOR MSL 1 MICROCHIP PRODUCTS SHIPPED FROM ALL LOCATIONS
PDF PCN - 25-Jun-2015 - CANCELLATION NOTICE: QUALIFICATION OF SELECTED PRODUCTS WITH PDCU BOND WIRE AT MTAI SITE
PDF PCN - 12-Feb-2018 - QUALIFICATION OF MMT AS AN ADDITIONAL ASSEMBLY SITE FOR SELECTED PRODUCTS
PDF PCN - 21-Sep-2015 - INTEGRATION OF THE MICREL PCN SYSTEM WITH THE MICROCHIP PCN SYSTEM
PDF PCN - 11-Nov-2004 -
PDF PCN - 21-Sep-2015 - INTEGRATION OF THE MICREL PCN SYSTEM WITH THE MICROCHIP PCN SYSTEM
PDF PCN - 20-Jul-2015 - QUALIFICATION OF C194 LEAD-FRAME FOR SELECTED QFN AND UQFN PACKAGES AT NSEB ASSEMBLY SITE
PDF PCN - 24-May-2018 - QUALIFICATION OF MMT AS AN ADDITIONAL ASSEMBLY SITE FOR SELECTED PRODUCTS
PDF PCN - 21-Jul-2008 - QUALIFICATION OF 28L QFN PACKAGE (6X6X0.9 MM) AT ATP ASSEMBLY
PDF PCN - 28-Jan-2014 - Microchip is announcing the qualification of 28L QFN (6x6x0.9mm and 5x5x0.9mm), 20L QFN (5x5x0.9mm a
PDF PCN - 12-Feb-2018 - QUALIFICATION OF MMT AS AN ADDITIONAL ASSEMBLY SITE FOR SELECTED PRODUCTS
PDF PCN - 29-Jan-2014 - Microchip is expanding its test facilities to Microchip Thailand (MMT) for all commercial products i
PDF PCN - 01-Feb-2018 - QUALIFICATION OF MMT AS AN ADDITIONAL ASSEMBLY SITE FOR SELECTED PRODUCTS
PDF PCN - 01-Sep-2008 - Qualification Of 28L Qfn Package (6X6X0.9 Mm) At Atp Assembly
PDF PCN - 08-Mar-2007 - Product Change Notice
PDF PCN - 30-Jan-2011 - Qualification Of 28L Qfn (6X6) Package At Asac (Utac) Assembly Site.
PDF PCN - 31-Oct-2008 - Qualification Of 28L Qfn (6X6X0.9Mm) Package At Asat Limited, China (Asac) Assembly
PDF PCN - 30-Sep-2008 - Qualification Of Utac Thai Limited (Utl) To Test 28Qfn (6X6) Packaged Products
PDF PCN - 21-Feb-2014 - Qualification Of 28L Qfn, 20L Qfn And 16L Qfn Packages At Mtai Assembly Site
PDF PCN - 11-Nov-2004 - Product Change Notice
PDF PCN - 24-Nov-2008 - Qualification Of 28L Qfn Package (6X6X0.9Mm) At Atp Assembly
PDF PCN - 21-Feb-2014 - Qualification Of 28L Qfn, 20L Qfn And 16L Qfn Packages At Mtai Assembly Site
PDF PCN - 30-Jul-2010 - QUALIFICATION OF DIFFERENT PADDLE SIZES IN 18L & 28L SOIC PACKAGES AT MMS (ATES).
PDF PCN - 31-Mar-2008 - QUALIFICATION OF CRM1706DJ DIE ATTACH EPOXY AND G770HCD MOLD COMPOUND

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