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MCP6004T-E/ST by microchip technology
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DATA SHEET

MCP6004T-E/ST

Microchip Technology

Quad Op Amp - Low Power - 1MHz GBP - 1.8 to 6.0 VDC - Rail to Rail I/O - 14-lead TSSOP - -40°C to +125°C

RoHS Compliant
REEL Packaging
Accessories
Accessories
This product is backed by Ecco Electronics' Certificate of Compliance Guarantee. Rest assured you will receive the Manufacturer's Certificate of Compliance with your order. Certificate of Compliance Guarantee
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Supplier:
Microchip Technology
Part No:
MCP6004T-E/ST
RoHS:
Yes
HTS:
8542330001
COO:
MY
ECCN:
EAR99
Supplier Standard Pack This information is provided for customers who prefer to buy in multiples of the Manufacturer’s Standard Package quantity. Minimum Order Quantities and Required Order Multiples are presented with our price and availability information.
2500
Package Type:
REEL
Maximum Input Offset Current:
0.000001(Typ)@5.5V uA
Family:
MCP6004
Manufacturer Type:
Low Power Amplifier
Maximum Input Offset Voltage:
4.5@5.5V mV
Maximum Dual Supply Voltage:
N/R
Maximum Input Bias Current:
N/A
Dimension:
5 x 4.4 x 1 mm
Maximum Operating Supply Voltage:
6 V
The MCP6004T-E/ST is a low power quad operational amplifier, designed for general-purpose applications. Extended temp. range -40°C-125°C. Package type is a Plastic TSSOP, (4.4 mm body), 14-lead.
Search Keywords:
MCP6004TEST
  Different packaging options available.  See Alternatives
  Possible Replacement options available.  See Alternatives
IN STOCK: 3,942
Can Ship immediately
Minimum Order Quantity:
500
Factory Lead-Time
4 Weeks
Price (USD)
Quantity
Unit Price
Ext. Price
500
$0.583
$291.500
1,000
$0.578
$578.000
2,500
$0.576
$1,440.000
5,000
$0.574
$2,870.000
7,500
$0.573
$4,297.500
10,000
$0.571
$5,710.000
15,000
$0.570
$8,550.000
25,000 +
$0.568
$14,200.000
Supplier's Standard Package
Product Guides
PDF Datasheet
Product Changes
PDF PCN - 24-Aug-2011 - Microchip is announcing the qualification of 8L, 14L, 16L, 20L PDIP, & 28L SPDIP with CRM-1064L die
PDF PCN - 19-Nov-2009 - Microchip has released a new DeviceDoc for the MCP6001/R/U/2/4, 1 MHz, Low-Power Op Amp of devices.
PDF PCN - 13-Jul-2006 - Product Change Notice
PDF PCN - 06-Sep-2012 - Microchip Is Announcing The Qualification Of Mmt (Alph) Assembly Site For The Listed 14L Tssop Packa
PDF PCN - 12-Apr-2012 - Microchip Is Announcing The Qualification Of Mmt (Alph) Assembly Site For The Listed 14L Tssop Packa
PDF PCN - 04-Apr-2008 - Cancelled Qualification Of 14L Pdip At New Assembly Site: Aic
PDF PCN - 22-Jan-2004 - Qualify Unisem For Assembly Of 14L Tssop Package
PDF PCN - 31-Jul-2007 - Qualification Of 14L Tssop Package Assembly At Vgt (Vigilant, Thailand)
PDF PCN - 31-May-2007 - Qualification At New Assembly Plant Nse2 (Ns Electronics, Bangkok)
PDF PCN - 01-Jun-2006 - Package Qualification For 14L Pdip .300'' At Unis
PDF PCN - 15-Feb-2011 - Microchip is announcing the change in package and implementation of new shipping labels for all list
PDF PCN - 30-Apr-2007 - Qualification Of 14L Pdip With Ge-800 ''Green'' Mold Compound At Vgt Assembly
PDF PCN - 01-Sep-2004 - ADD MICROCHIP THAILAND AS A QUALIFIED PROBE MANUFACTURING SITE
PDF PCN - 25-Oct-2004 - Change From Snpb Plating To Matte Tin Plating (Industry-Standard Pure Sn) Of The Device Leads
PDF PCN - 31-Mar-2007 - QUALIFICATION OF 14L TSSOP DIE ATTACH EPOXY AND STAMPED LEADFRAME AT UNIS
PDF PCN - 25-Sep-2007 - Change in shipping box dimensions and lables at MTAI for all Microchip catalog parts Packed in reels
PDF PCN - 27-Sep-2004 - All standard Microchip devices in the listed packages will change from SnPbplating (standard tin-lea
PDF PCN - 05-Aug-2010 - Microchip is announcing the implementation of shipping label and package change for the listed produ
PDF PCN - 20-Feb-2007 - Product Change Notice
PDF PCN - 30-Jul-2010 - QUALIFICATION OF THE 14L & 16L SOIC (.150) AT GTK (GRTK) ASSEMBLY SITE.
PDF PCN - 05-Oct-2007 - Qualification of G700 mold compound in TSSOP packages at ATP!
PDF PCN - 24-Jan-2008 - Change in Inner Box Label Format MTAI to include additional Bar Code for total quantity of parts shi
PDF PCN - 17-Sep-2006 - QUALIFICATION OF 14L TSSOP AT ATP
PDF PCN - 11-Nov-2004 - Product Change Notice
PDF PCN - 21-Oct-2008 - Microchip is changing the Format and adding quantity barcode to the standard die/wafer inner box lab
PDF PCN - 18-Aug-2012 - Qualification Of 14L Tssop Package At Mmt (Alph) Assembly Site
PDF PCN - 30-Jul-2010 - QUALIFICATION OF 8L, 14L, & 16L PDIP AT GTK (GRTK) ASSEMBLY SITE.
PDF PCN - 26-Jan-2009 - Microchip Technology is changing the shipping materials from moisture barrier bag to static shielded
PDF PCN - 30-Apr-2007 - Product Change Notice
PDF PCN - 09-Nov-2011 - Microchip is announcing the qualification of 8L, 14L, 16L, 20L PDIP, & 28L SPDIP with CRM-1064L die
PDF PCN - 19-Mar-2007 - Product Change Notice
PDF PCN - 01-Apr-2006 - Qualificaton Of 14L Pdip At New Assembly Site: Aic
PDF PCN - 10-Nov-2010 - Microchip is announcing the amended of its previous notice CYER-05LNSD835 which announces the implem
PDF Product Change Notification

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