PIC12F629T-I/SN by microchip technology
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DATA SHEET

PIC12F629T-I/SN

Microchip Technology

MCU 8-bit PIC12 PIC RISC 1.75KB Flash 2.5V/3.3V/5V Automotive 8-Pin SOIC N T/R .. see full description

RoHS Compliant
REEL Packaging
Accessories
Accessories
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Product Attribute
Attribute Value Select Attribute
Products found: 0
Supplier:
Microchip Technology
Part No:
PIC12F629T-I/SN
RoHS:
Yes
HTS:
8542310015
COO:
TW
ECCN:
EAR99
Supplier's Standard Package The item count, length, weight, or volume contained in the supplier’s original packaging for efficient storage, handling, and distribution.
3300
Package Type:
REEL
ADC Resolution:
N/A
Operating Temperature:
-40 to 85 °C
Number of Programmable I/Os:
5
Program Memory Type:
Flash
RAM Size:
64 B
Program Memory Size:
1.75 KB
The PIC12F629T-I/SN is a highly reliable and versatile 8-bit microcontroller by Microchip Technology. It belongs to the PIC12 family and features a reduced instruction set computing (RISC) architecture. With a flash memory of 1.75KB, it offers excellent performance for automotive applications, supporting operating voltages of 2.5V, 3.3V, and 5V.Designed in an 8-pin small outline integrated circuit (SOIC) package, the PIC12F629T-I/SN provides a compact and space-saving solution for various automotive electronics. It enables advanced functionalities, including analog-to-digital conversion, PWM, and more, making it ideal for a wide range of automotive control systems.The microcontroller guarantees high reliability and long-term durability, ensuring optimal performance in harsh automotive environments. It also offers ease of implementation and programming flexibility, thanks to Microchip's comprehensive development tools and software libraries.Overall, the PIC12F629T-I/SN is an efficient and feature-rich microcontroller for automotive applications, combining advanced capabilities, versatility, and excellent performance in a compact form factor.
Search Keywords:
PIC12F629TISN
  Different packaging options available.  See Alternatives
IN STOCK: 0
On Order:
3,450   can ship 12/30/26 
Minimum Order Quantity:
250
Factory Lead-Time
19 Weeks
Price (USD)
Quantity
Unit Price
Ext. Price
250
$1.37
$342.50
500
$1.35
$675.00
1,000
$1.28
$1,280.00
3,300
$1.27
$4,191.00
6,600
$1.26
$8,316.00
9,900
$1.25
$12,375.00
13,200
$1.24
$16,368.00
16,500 +
$1.23
$20,295.00
Supplier's Standard Package
Product Changes
PDF PCN - 28-Jun-2005 - Product Change Notice
PDF PCN - 24-Aug-2011 - Microchip is announcing the qualification of 8L, 14L, 16L, 20L PDIP, & 28L SPDIP with CRM-1064L die
PDF PCN - 27-Oct-2009 - Microchip Has Released A New Devicedoc For The Pic12F629/675 Family Silicon Errata And Data Sheet Cl
PDF PCN - 30-Apr-2007 - QUALIFICATION OF NITTO GE800 MOLD COMPOUND FOR PDIP AND SPDIP PACKAGES ASSEMBLED AT MTAI
PDF PCN - 09-Nov-2011 - Microchip is announcing the qualification of 8L, 14L, 16L, 20L PDIP, & 28L SPDIP with CRM-1064L die
PDF PCN - 10-Nov-2010 - Microchip is announcing the amended of its previous notice CYER-05LNSD835 which announces the implem
PDF PCN - 28-May-2010 - QUALIFICATION OF 8L DFN (4X4) PACKAGE WITH CRM1076DJ DIE ATTACH AND G770HCD MOLD COMPOUND
PDF PCN - 08-Nov-2010 - Microchip is announcing the qualification of listed 8 & 14L SOIC package products with SG-8300GM mol
PDF PCN - 27-Oct-2009 - Released A New Devicedoc For The Pic12F629/675 Data Sheet Of Devices
PDF PCN - 30-Jul-2010 - QUALIFICATION OF 8L, 14L, & 16L PDIP AT GTK (GRTK) ASSEMBLY SITE.
PDF PCN - 26-May-2005 - Product Change Notice
PDF PCN - 31-Oct-2007 - QUALIFICATION OF GE800 MOLD COMPOUND IN ASSORTED PDIP/SPDIP PACKAGES AT ALPH
PDF PCN - 01-May-2010 - Data Sheet-Pic12F629/675 Data Sheet
PDF PCN - 15-Dec-2010 - QUALIFICATION OF 8 & 14L SOIC PACKAGES WITH SG-8300GM MOLD COMPOUND AT MTAI ASSEMBLY SITE
PDF PCN - 24-Feb-2008 - CHANGE IN INNER BOX LABEL FORMAT TO INCLUDE ADDITIONAL BAR CODE
PDF PCN - 25-Sep-2007 - Change in shipping box dimensions and lables at MTAI for all Microchip catalog parts Packed in reels
PDF PCN - 21-Sep-2011 - Microchip is releasing the v9.83 HI-Tech C for the listed PIC10/12/16 MCUs in order to provide new s
PDF PCN - 01-Jun-2013 - Qualification Of 8L Vdfn (4X4X0.9 Mm) At Lpi Assembly Site
PDF PCN - 22-Jan-2004 - Product Change Notice
PDF PCN - 01-Jan-2006 - 8L SOIJ 208'' PACKAGE QUALIFICATION AT NEW ASSEMBLY PLANT NSE2 (NS ELECTRONICS, BANGKOK)
PDF PCN - 27-Oct-2009 - Pic12F629/675 Family Silicon Errata And Data Sheet Clarification
PDF PCN - 15-Feb-2011 - Microchip is announcing the change in package and implementation of new shipping labels for all list
PDF PCN - 06-Mar-2006 - Product Change Notice
PDF PCN - 23-Dec-2011 - QUALIFICATION OF 8L SOIC WITH SG-8300GM MC AT ALPH (MMT) ASSEMBLY SITE
PDF PCN - 26-Jan-2009 - Microchip Technology is changing the shipping materials from moisture barrier bag to static shielded
PDF PCN - 18-Aug-2006 - Qualification Of 8L Dnf 4X4Mm At Unis
PDF PCN - 01-Aug-2005 - Qualification Of 8L Dfn At Carsem
PDF PCN - 03-Jun-2004 - Microchip is qualifying Amkor Shanghai, China (ATC) as an additional assembly capacity for 8L SOIC p
PDF PCN - 06-Nov-2003 - Product Change Notice
PDF PCN - 09-Mar-2010 - ERRATA-TIMER1 MODULE DATA SHEET ERRATA
PDF PCN - 31-Dec-2010 - QUALIFICATION OF 8 & 14L SOIC PACKAGES WITH SG-8300GM MOLD COMPOUND AT MTAI ASSEMBLY SITE.
PDF PCN - 08-Mar-2007 - Product Change Notice
PDF PCN - 24-Jan-2008 - Change in Inner Box Label Format MTAI to include additional Bar Code for total quantity of parts shi
PDF PCN - 23-Dec-2011 - QUALIFICATION OF 8L SOIC WITH SG-8300GM MC AT ALPH (MMT) ASSEMBLY SITE
PDF PCN - 30-Nov-2011 - Microchip is announcing the qualification of 8L SOIC with SG-8300GM mold compound at ALPH (MMT) asse
PDF PCN - 01-Jan-2005 - CHANGE FROM SNPB (TIN/LEAD) PLATING TO MATTE TIN (SN) PLATING ON THE DEVICE LEADS
PDF PCN - 05-Aug-2010 - Microchip is announcing the implementation of shipping label and package change for the listed produ
PDF PCN - 27-Oct-2009 - Microchip Has Released A New Devicedoc For The Pic12F629/675 Data Sheet Of Devices.
PDF PCN - 23-Sep-2010 - Microchip is announcing the qualification of listed 8 & 14L SOIC package products with SG-8300GM mol
PDF PCN - 18-Oct-2013 - QUALIFICATION OF SELECTED PRODUCTS AVAILABLE IN THE 8L SOIC PACKAGE WITH PALLADIUM COATED COPPER
PDF PCN - 26-Oct-2007 - LABEL SIZE CHANGE FROM ALUMINUM BAGS & INNER BOXES 17X4 CM2 TO 14X4 CM2
PDF PCN - 18-Oct-2013 - QUALIFICATION OF SELECTED PRODUCTS AVAILABLE IN THE 8L SOIC PACKAGE WITH PALLADIUM COATED COPPER
PDF PCN - 01-Nov-2005 - QUALIFICATION OF 8L SOIC AT NEW ASSEMBLY SITE VIGILANT,THAILAND
PDF PCN - 12-Mar-2003 - FIRMWARE CHANGE
PDF PCN - 16-Mar-2001 - MICROCHIP IS OPENING A NEW FAB LOCATED IN GRESHAM, OREGON
PDF PCN - 11-Nov-2004 - Product Change Notice
PDF PCN - 30-Jan-2006 - Product Change Notice
PDF PCN - 21-Oct-2008 - Microchip is changing the Format and adding quantity barcode to the standard die/wafer inner box lab
PDF PCN - 22-Sep-2011 - Microchip is announcing the qualification of 8L SOIC with SG-8300GM MC at ALPH (MMT) assembly site f
PDF PCN - 19-Apr-2010 - Microchip is announcing the Qualification of 8L DFN (4x4) package with CRM1076DJ die attach and G770
PDF Product Change Notification

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