PIC18F4431-I/PT by microchip technology
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DATA SHEET

PIC18F4431-I/PT

Microchip Technology

PIC 18 microcontroller - MCU 8 bit - RISC architecture - 75 Instructions - 2 V to 5.5 V - Pins: 44 - Package type: TQFP 44 – Speed 40 MHz - Flash 16384 B – SRAM 768 Bytes – EEPROM 256 Bytes - I/O: 36 – A/D: 10 bit with 09 channels – 04 Timers – SSP – 02 x .. see full description

RoHS Compliant
TRAY Packaging
Accessories
Accessories
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This product may require extra documentation. Shipping may be delayed 1-2 days.
Product Attribute
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Products found: 0
Supplier:
Microchip Technology
Part No:
PIC18F4431-I/PT
RoHS:
Yes
HTS:
8542310015
COO:
TH
ECCN:
3A991.a.2
Supplier's Standard Package The item count, length, weight, or volume contained in the supplier’s original packaging for efficient storage, handling, and distribution.
160
Package Type:
TRAY
RAM Size:
768 B
Number of Programmable I/Os:
36
Program Memory Size:
16 KB
Program Memory Type:
Flash
Operating Temperature:
-40 to 85 °C
ADC Resolution:
10 bit
The MICROCHIP TECH PIC18F4431-I/PT is part of PIC18 family with a 8-Bit RISC microcontroller. It can sustain standard temperature ranges from -40°C to + 85 C, has 44 pin in TQFP-44 package and 40 MHz clock speed. This device has a Flash memory of 16384 B, a SRAM of 768 bytes, EEPROM of 256 bytes, four timers module and 09 channels of 10 bits ADC. This MCU includes SSP & EUSART communication modules (I2C & SPI modules) with 36 I/O pins. It can be used to achieve various tasks.
Search Keywords:
PIC18F4431IPT
IN STOCK: 165
Can Ship immediately
Minimum Order Quantity:
5
Factory Lead-Time
24 Weeks
Price (USD)
Quantity
Unit Price
Ext. Price
5
$8.09
$40.45
25
$7.32
$183.00
50
$7.13
$356.50
160
$6.86
$1,097.60
320
$6.69
$2,140.80
640
$6.67
$4,268.80
1,120 +
$6.61
$7,403.20
Supplier's Standard Package
Product Guides
PDF Datasheet
Product Changes
PDF PCN - 19-May-2009 - Microchip is releasing the MPLAB C Compiler for PIC18 MCUs v3.31 which will provide new part support
PDF PCN - 22-May-2013 - Microchip is announcing the qualification of the listed 44L TQFP package products with palladium coa
PDF PCN - 24-Feb-2008 - CHANGE IN INNER BOX LABEL FORMAT TO INCLUDE ADDITIONAL BAR CODE
PDF PCN - 06-Nov-2009 - QUALIFICATION OF TQFP PACKAGE WITH SG-8300ECM MOLD COMPOUND AT MTAI ASSEMBLY SITE.
PDF PCN - 15-Feb-2011 - Microchip is announcing the change in package and implementation of new shipping labels for all list
PDF PCN - 31-Oct-2007 - QUALIFICATION OF GE800 MOLD COMPOUND IN ASSORTED PDIP/SPDIP PACKAGES AT ALPH
PDF PCN - 05-Aug-2010 - Microchip is announcing the implementation of shipping label and package change for the listed produ
PDF PCN - 09-Mar-2010 - ERRATA-TIMER1 MODULE DATA SHEET ERRATA
PDF PCN - 24-Jan-2008 - Change in Inner Box Label Format MTAI to include additional Bar Code for total quantity of parts shi
PDF PCN - 14-Jul-2009 - MPLAB C COMPILER FOR PIC18 MCU'S VERSION 3.32 IS RELEASED
PDF PCN - 31-Mar-2008 - QUALIFICATION OF CRM1706DJ DIE ATTACH EPOXY AND G770HCD MOLD COMPOUND
PDF PCN - 23-Oct-2009 - Microchip is announcing the final qualification of the TQFP package with SG-8300ECM mold compound at
PDF PCN - 26-Jan-2009 - Microchip Technology is changing the shipping materials from moisture barrier bag to static shielded
PDF PCN - 19-May-2009 - MPLAB C COMPILER FOR PIC18 MCUS V3.31 RELEASED
PDF PCN - 16-Sep-2010 - Microchip Has Released A New Devicedoc For The Pic18F2331/2431/4331/4431 Data Sheet Of Devices.
PDF PCN - 01-Jan-2005 - CHANGE FROM SNPB (TIN/LEAD) PLATING TO MATTE TIN (SN) PLATING ON THE DEVICE LEADS
PDF PCN - 10-Nov-2010 - Microchip is announcing the amended of its previous notice CYER-05LNSD835 which announces the implem
PDF PCN - 24-Jan-2013 - QUALIFICATION OF SELECTED PRODUCTS AVAILABLE IN THE 44L TQFP PACKAGE WITH PALLADIUM COATED COPPER
PDF PCN - 28-Aug-2009 - MPLAB C for PIC18 MCU's v3.33 has been released to the web and is available for download.This releas
PDF PCN - 26-Oct-2007 - LABEL SIZE CHANGE FROM ALUMINUM BAGS & INNER BOXES 17X4 CM2 TO 14X4 CM2
PDF PCN - 21-Oct-2008 - Microchip is changing the Format and adding quantity barcode to the standard die/wafer inner box lab
PDF PCN - 22-Jul-2009 - Microchip is qualifying the TQFP package with SG-8300ECM mold compound at MTAI assembly site in orde
PDF PCN - 07-Jun-2013 - QUALIFICATION OF SELECTED PRODUCTS AVAILABLE IN THE 44L TQFP PACKAGE WITH PALLADIUM COATED COPPER
PDF PCN - 05-Mar-2010 - MPLAB C FOR PIC28 V3.35 RELEASED
PDF PCN - 16-Sep-2010 - Microchip Has Released A New Devicedoc For The Pic18F2331/2431/4331/4431 Data Sheet Of Devices.
PDF PCN - 01-Dec-2005 - QUALIFICATION OF 6700HA MOLD COMPOUND FOR 44L/64L TQFP PACKAGES AT MTHAI ASSEMBLY
PDF PCN - 12-Jul-2006 - QUALIFICATION OF 44L QFN PACKAGE AT NSEB
PDF PCN - 23-Oct-2009 - QUALIFICATION OF TQFP PACKAGE WITH SG-8300ECM MOLD COMPOUND AT MTAI ASSEMBLY SITE
PDF PCN - 30-Apr-2007 - QUALIFICATION OF NITTO GE800 MOLD COMPOUND FOR PDIP AND SPDIP PACKAGES ASSEMBLED AT MTAI
PDF Product Change Notification

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