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TC4431EOA by microchip technology
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DATA SHEET

TC4431EOA

Microchip Technology

Driver 1.5A 1-OUT High Side Inv Automotive 8-Pin SOIC N Tube .. see full description

RoHS Compliant
TUBE Packaging
Accessories
Accessories
This product is backed by Ecco Electronics' Certificate of Compliance Guarantee. Rest assured you will receive the Manufacturer's Certificate of Compliance with your order. Certificate of Compliance Guarantee
Product Attribute
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Products found: 0
Supplier:
Microchip Technology
Part No:
TC4431EOA
RoHS:
Yes
HTS:
8542390070
COO:
TH
ECCN:
EAR99
Supplier Standard Pack This information is provided for customers who prefer to buy in multiples of the Manufacturer’s Standard Package quantity. Minimum Order Quantities and Required Order Multiples are presented with our price and availability information.
100
Package Type:
TUBE
Dimension:
4.9 x 3.9 x 1.25(Min) mm
Driver Configuration:
Inverting
Absolute Propagation Delay Time:
110 ns
Driver Type:
High Side
Bridge Type:
N/A
The MICROCHIP TECH. part TC4431EOA is a high-performance driver designed for automotive applications. It features a 1.5A output current and 1 output for high-side switching. The device is housed in an 8-pin SOIC N package, making it suitable for use in automotive electronic systems. With its high side inverting functionality, this driver is well-suited for automotive applications that require efficient power management and control. The device is available in a tube packaging for convenient handling and storage.
Search Keywords:
TC4431EOA
IN STOCK: 0
On Order:
2,500   can ship 4/12/27 
Minimum Order Quantity:
100
Multiple:
100
Factory Lead-Time
34 Weeks
Price (USD)
Quantity
Unit Price
Ext. Price
100
$2.89
$289.00
300
$2.87
$861.00
500
$2.86
$1,430.00
1,000
$2.85
$2,850.00
2,500
$2.84
$7,100.00
5,000
$2.83
$14,150.00
7,500
$2.82
$21,150.00
10,000 +
$2.81
$28,100.00
Supplier's Standard Package
Product Guides
PDF Datasheet
Product Changes
PDF PCN - 15-Feb-2011 - Microchip is announcing the change in package and implementation of new shipping labels for all list
PDF PCN - 26-Jan-2009 - Microchip Technology is changing the shipping materials from moisture barrier bag to static shielded
PDF PCN - 30-Nov-2015 - QUALIFICATION OF NON-CONDUCTIVE DIE ATTACH EPOXY 8900NC FOR SELECTED PRODUCTS
PDF PCN - 22-Feb-2018 - QUALIFICATION OF PALLADIUM COATED COPPER WITH GOLD FLASH (CUPDAU) BOND WIRE IN SELECTED PRODUCTS
PDF PCN - 02-Dec-2009 - AMEND SHIPPING LABELS FOR CERAMIC PRODUCTS WITH SNPB LEAD/TERMINATION FINISH
PDF PCN - 09-Nov-2011 - Microchip is announcing the qualification of 8L, 14L, 16L, 20L PDIP, & 28L SPDIP with CRM-1064L die
PDF PCN - 01-Nov-2015 - INTEGRATION OF THE MICREL PCN SYSTEM WITH THE MICROCHIP PCN SYSTEM
PDF PCN - 02-Dec-2009 - AMEND SHIPPING LABELS FOR CERAMIC PRODUCTS WITH SNAGCU AND AU LEAD/TERMINATION FINISH
PDF PCN - 24-Aug-2011 - Microchip is announcing the qualification of 8L, 14L, 16L, 20L PDIP, & 28L SPDIP with CRM-1064L die
PDF PCN - 02-May-2014 - IMPLEMENT LABEL AND PACKING CHANGES FOR SMSC PRODUCTS
PDF PCN - 20-May-2015 - QUALIFICATION OF A NEW 13 INCH PLASTIC REEL WITH SMALLER WINDOW FOR SELECTED PACKAGES
PDF PCN - 15-Dec-2010 - QUALIFICATION OF 8 & 14L SOIC PACKAGES WITH SG-8300GM MOLD COMPOUND AT MTAI ASSEMBLY SITE
PDF PCN - 23-May-2003 -
PDF PCN - 24-Jan-2008 - Change in Inner Box Label Format MTAI to include additional Bar Code for total quantity of parts shi
PDF PCN - 06-Feb-2014 - Microchip is announcing the qualification of selected products available in the 8L SOIC package with
PDF PCN - 22-May-2015 - QUALIFICATION OF A NEW 13 INCH PLASTIC REEL WITH SMALLER WINDOW FOR SELECTED PACKAGES
PDF PCN - 04-Feb-2021 - CUSTOMERS TO IMMEDIATELY PLACE THEIR 12-MONTH NON-CANCELLABLE NON-RESCHEDULABLE BACKLOG ON MICROCHIP
PDF PCN - 19-Nov-2015 - CCB 1727 FINAL NOTICE: IMPLEMENT LABEL AND PACKING CHANGES FOR MICROCHIP PRODUCTS
PDF PCN - 01-Sep-2017 - IMPLEMENT MARKING CHANGES FOR VIRTUALLY ALL ATMEL PRODUCTS
PDF PCN - 11-Nov-2004 -
PDF PCN - 23-May-2003 -
PDF PCN - 01-Nov-2016 - IMPLEMENT PACKING CHANGES WITHOUT INNER BOX FOR MSL 1 MICROCHIP PRODUCTS SHIPPED FROM ALL LOCATIONS
PDF PCN - 03-Jun-2004 - Microchip is qualifying Amkor Shanghai, China (ATC) as an additional assembly capacity for 8L SOIC p
PDF PCN - 18-Oct-2013 - QUALIFICATION OF SELECTED PRODUCTS AVAILABLE IN THE 8L SOIC PACKAGE WITH PALLADIUM COATED COPPER
PDF PCN - 02-May-2014 - IMPLEMENT LABEL AND PACKING CHANGES FOR SMSC PRODUCTS
PDF PCN - 15-May-2015 - QUALIFICATION OF LPI ASSEMBLY SITE AS AN ADDITIONAL SITE FOR SELECTED PRODUCTS IN 8L SOIC PACKAGE
PDF PCN - 25-Sep-2007 - Change in shipping box dimensions and lables at MTAI for all Microchip catalog parts Packed in reels
PDF PCN - 05-Aug-2010 - Microchip is announcing the implementation of shipping label and package change for the listed produ
PDF PCN - 26-May-2005 -
PDF PCN - 18-Dec-2013 - Microchip is announcing the qualification of the listed products in the 8L SOIC package with palladi
PDF PCN - 29-Jan-2014 - Microchip is expanding its test facilities to Microchip Thailand (MMT) for all commercial products i
PDF PCN - 27-Dec-2015 - QUALIFICATION OF NON-CONDUCTIVE DIE ATTACH EPOXY 8900NC FOR SELECTED PRODUCTS
PDF PCN - 10-Sep-2009 - CHANGE INNER BOX AND OUTER CARTON FOR ALL PACKAGES PACKED IN TUBES AT MTAI ASSEMBLY SITE
PDF PCN - 04-Sep-2015 - QUALIFICATION OF LPI ASSEMBLY SITE AS AN ADDITIONAL SITE FOR SELECTED PRODUCTS IN 8L SOIC PACKAGE
PDF PCN - 04-Sep-2015 - QUALIFICATION OF LPI ASSEMBLY SITE AS AN ADDITIONAL SITE FOR SELECTED PRODUCTS IN 8L SOIC PACKAGE
PDF PCN - 01-Nov-2016 - IMPLEMENT PACKING CHANGES WITHOUT INNER BOX FOR MSL 1 MICROCHIP PRODUCTS SHIPPED FROM ALL LOCATIONS
PDF PCN - 31-Dec-2010 - QUALIFICATION OF 8 & 14L SOIC PACKAGES WITH SG-8300GM MOLD COMPOUND AT MTAI ASSEMBLY SITE.
PDF PCN - 23-Jul-2009 - Microchip is changing the inner box and outer carton for all packages packed in tubes at MTAI assemb
PDF PCN - 01-Jan-2005 - CHANGE FROM SNPB (TIN/LEAD) PLATING TO MATTE TIN (SN) PLATING ON THE DEVICE LEADS
PDF PCN - 30-Jul-2010 - QUALIFICATION OF 8L, 14L, & 16L PDIP AT GTK (GRTK) ASSEMBLY SITE.
PDF PCN - 26-Jun-2015 - QUALIFICATION OF GTK ASSEMBLY SITE AS AN ADDITIONAL SITE FOR SELECTED PRODUCTS IN 8L SOIC PACKAGE
PDF PCN - 03-Jun-2004 - QUALIFY AMKOR SHANGHAI, CHINA (ATC) FOR 8L SOIC PACKAGE
PDF PCN - 08-Aug-2013 - Microchip is implementing a convention change to the sales order (SO) number for the listed products
PDF PCN - 15-May-2015 - QUALIFICATION OF GTK ASSEMBLY SITE AS AN ADDITIONAL SITE FOR SELECTED PRODUCTS
PDF PCN - 01-Nov-2015 - INTEGRATION OF THE MICREL PCN SYSTEM WITH THE MICROCHIP PCN SYSTEM
PDF PCN - 30-Nov-2015 - QUALIFICATION OF NON-CONDUCTIVE DIE ATTACH EPOXY 8900NC FOR SELECTED PRODUCTS
PDF PCN - 22-Feb-2018 - QUALIFICATION OF PALLADIUM COATED COPPER WITH GOLD FLASH (CUPDAU) BOND WIRE IN SELECTED PRODUCTS
PDF PCN - 01-Nov-2005 - QUALIFICATION OF 8L SOIC AT NEW ASSEMBLY SITE VIGILANT,THAILAND
PDF PCN - 11-Jan-2010 - AMEND SHIPPING LABELS FOR CERAMIC PRODUCTS WITH SNAGCU AND AU LEAD/TERMINATION FINISH
PDF PCN - 08-Nov-2010 - Microchip is announcing the qualification of listed 8 & 14L SOIC package products with SG-8300GM mol
PDF PCN - 10-Nov-2010 - Microchip is announcing the amended of its previous notice CYER-05LNSD835 which announces the implem
PDF PCN - 11-Oct-2013 - IMPLEMENT A CONVENTION CHANGE TO THE SALES ORDER (SO) NUMBER
PDF PCN - 15-May-2015 - QUALIFICATION OF LPI ASSEMBLY SITE AS AN ADDITIONAL SITE FOR SELECTED PRODUCTS IN 8L SOIC PACKAGE
PDF PCN - 22-May-2015 - QUALIFICATION OF A NEW 13 INCH PLASTIC REEL WITH SMALLER WINDOW FOR SELECTED PACKAGES AT MTAI, MMT
PDF PCN - 01-Sep-2017 - IMPLEMENT MARKING CHANGES FOR VIRTUALLY ALL ATMEL PRODUCTS
PDF PCN - 19-Nov-2015 - CCB 1727 FINAL NOTICE IMPLEMENT LABEL AND PACKING CHANGES FOR MICROCHIP PRODUCTS
PDF PCN - 15-May-2015 - QUALIFICATION OF GTK ASSEMBLY SITE AS AN ADDITIONAL SITE FOR SELECTED PRODUCTS IN 8L SOIC PACKAGE
PDF PCN - 21-Oct-2008 - Microchip is changing the Format and adding quantity barcode to the standard die/wafer inner box lab
PDF PCN - 23-Sep-2010 - Microchip is announcing the qualification of listed 8 & 14L SOIC package products with SG-8300GM mol
PDF PCN - 26-Jun-2015 - QUALIFICATION OF GTK ASSEMBLY SITE AS AN ADDITIONAL SITE FOR SELECTED PRODUCTS IN 8L SOIC PACKAGE
PDF PCN - 11-Nov-2004 - Product Change Notice
PDF PCN - 23-May-2003 - Product Change Notice
PDF PCN - 26-May-2005 - Product Change Notice
PDF PCN - 23-May-2003 - Product Change Notice
PDF Product Change Notification

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