UMK105BJ104KV-F by taiyo yuden

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UMK105BJ104KV-F

Multi Layer Ceramic Capacitor - SMD - 0.1uF ±10% - 50VDC - X5R - 0402 - Tape&Reel

RoHS Compliant

REEL Packaging

Accessories

Certificate of Compliance Guarantee

Product Attribute

Attribute Value Select Attribute

Products found: 0

Supplier:

Taiyo Yuden

Part No:

UMK105BJ104KV-F

RoHS:

Yes

HTS:

8532240020

COO:

MY

ECCN:

EAR99

Supplier Standard Pack This information is provided for customers who prefer to buy in multiples of the Manufacturer’s Standard Package quantity. Minimum Order Quantities and Required Order Multiples are presented with our price and availability information.

This information is provided for customers who prefer to buy in multiples of the Manufacturer’s Standard Package quantity. Minimum Order Quantities and Required Order Multiples are presented with our price and availability information.

10000

Package Type:

REEL

Capacitance Value:

0.12227uF

Voltage:

502253VDC

Package/Case:

04022239

Tolerance:

102252%

Multi Layer Ceramic Capacitor - SMD - 0.1uF ±10% - 50VDC - X5R - 0402 - Tape&Reel

Product Highlights:

Potential Applications:

Search Keywords:

UMK105BJ104KVF

IN STOCK: 100,000

Ships today, if you order in

BONDED Quantity:

0

Manufacturer Stock:

0

On Order:

Stock lot only:

Minimum Order Quantity:

10000

MOQ for out of Stock Qty:

Multiple:

10000

Factory Lead-Time

10 Weeks

This product is no longer being manufactured but there may be alternatives. We can help you, Contact Us.

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Min quantity should be greater than or equal () in order to activate the custom price. Otherwise you will get the normal price.

Price (USD)

Quantity

Unit Price

Ext. Price

10,000

$0.0107

$107.0000

30,000

$0.0106

$318.0000

50,000

$0.0105

$525.0000

100,000

$0.0102

$1,020.0000

150,000

$0.0099

$1,485.0000

250,000

$0.0096

$2,400.0000

500,000 +

$0.0096

$4,800.0000

Suppliers Standard Package

Please Note: Tariffs may apply for U.S. shipments

Product Guides

Product Changes

PCN - 01-Jul-2021 - CHANGE NOTIFICATION OF PLATING PROCESS LOCATION

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