The 103639-8 is a vertical through-hole IDC (Insulation Displacement Contact) header connector from the TE Connectivity AMPMODU MTE interconnect system, featuring matte tin plating for standard applications. This connector supports 2–25 position configurations with a 100 mil centerline spacing and accommodates wire gauges in the #22–#30 AWG range for IDC configurations. The product is designed for wire-to-board applications and operates reliably across a temperature range of -65°C to +105°C, with a current rating of 3 amps per contact in free air and 267 V operating voltage. The connector implements latching and polarization features through coupling shrouds and guide ribs, making it suitable for use in computers, copiers, commercial printers, appliances, medical equipment, and automotive controls where reliable interconnection is essential.