The 540-AG11D is a 40-position DIP socket designed for vertical thru-hole mounting on printed circuit boards. It features beryllium copper screw machine contacts with gold plating (25 µin) on the mating area, providing reliable electrical connections and corrosion resistance. The socket has a row-to-row spacing of 15.24 mm (0.600 in), a centerline of 2.54 mm (0.100 in), and a height above the PCB of 4.57 mm (0.180 in), with four-fingered mating contact design for secure component retention. It is wave solder capable up to 265°C and operates reliably at temperatures up to 125°C, making it suitable for industrial and commercial applications requiring robust IC socket solutions.