The WAKEFIELD part 260-4TH5E is a passive heat sink designed to efficiently dissipate heat from TO-5 packages. Constructed with high-quality beryllium copper, this heat sink offers excellent thermal conductivity and heat dissipation capabilities. Its low thermal resistance of 14°C/W ensures effective cooling, promoting optimal performance and longevity of sensitive electronic components. The black Ebonol coating not only enhances its sleek aesthetic appeal but also provides improved thermal performance. Upgrade your heat management system today with the WAKEFIELD part 260-4TH5E heat sink for reliable and efficient temperature control in TO-5 applications.