642-25AB
WakefieldHeat Sink Passive BGA Pin Array Adhesive Aluminum Black Anodized .. see full description
Product Attribute
Attribute Value
Select Attribute
Products found: 0
Supplier:
Wakefield
Part No:
642-25AB
RoHS:
Yes
HTS:
7616995090
COO:
CN
ECCN:
EAR99
Supplier Standard Pack
800
Device Cooled:
BGA
Attachment Method:
Adhesive
Dimension:
35 x 35 x 6.4 mm
Thermal Resistance:
N/A
Finish:
Black Anodized
The WAKEFIELD part 642-25AB is a high-quality heat sink designed for optimal cooling performance. With its passive BGA pin array design, it efficiently dissipates heat from electronic components, ensuring their longevity and reliability. The heat sink is made from adhesive aluminum with a sleek black anodized finish, providing excellent thermal conductivity and a visually appealing aesthetic. Ideal for a wide range of applications, this heat sink is a reliable choice for keeping your electronic systems running cool and efficient.
Search Keywords:
64225AB
Possible Replacement options available. See Alternatives
IN STOCK:
29
Ships today, if you order in
Minimum Order Quantity:
10
Factory Lead-Time
16 Weeks
Price (USD)
Quantity
Unit Price
Ext. Price
10
$2.67
$26.70
50
$2.43
$121.50
250
$2.33
$582.50
800
$2.24
$1,792.00
1,600
$2.21
$3,536.00
3,200
$2.18
$6,976.00
5,600
+
$2.17
$12,152.00
Please Note:
Tariffs may apply for U.S. shipments
Product Guides
English
Chinese
Spanish
