The 667-10ABSPE is a labor-saving, vertical mount heat sink from the 667 series, intended for cooling TO-220 style semiconductor packages. Standing 1.000 inch (25.4 mm) above the PC board, it features wave-solderable hex-shaped standoff pins for secure assembly. Constructed from black anodized aluminum, it achieves a thermal performance of 76°C temperature rise at 6W in natural convection and a thermal resistance of 5.8°C/W with 200 LFM forced air convection. This heat sink is designed for use with SpeedClips to reduce assembly time, offering an effective thermal solution for board-level applications with limited space.