1-1825094-4 is a standard DIP socket from the DIPLOMATE DL (Dual Leaf) series designed for through hole mounting of integrated circuits. It features 16 positions with a 2.54 mm centerline and 7.87 mm row-to-row spacing, utilizing beryllium copper contacts with gold plating on the mating area and tin-plated solder tails. The socket has a ladder frame style with straight legs, a thermoplastic housing with UL 94V-0 flammability rating, and offers excellent electrical performance with 10,000 MO insulation resistance and 30 mO contact resistance. This RoHS/ELV compliant component operates up to 125°C and is wave solder capable up to 265°C, making it suitable for production applications requiring reliable IC socketing solutions.