The 399-HT-114 is an AMP AUGAT HOLTITE solderless spring socket designed to form a zero-profile interconnect within a plated-through hole on a printed circuit board. Constructed from beryllium-copper with either gold or tin/lead plating, this socket is press-fit into the board, eliminating the need for soldering. The socket is designed for use in glass epoxy (FR-4, G-10) PC boards and is applied either manually or with automated machinery. This system creates a reliable, low-profile connection for a broad range of electronic parts and components. The solderless design provides a key advantage by allowing for easy component repair and replacement.