The 294139 is part of the dual-row MicroCon connector series, featuring a 0.8 mm pitch for high-density board-to-board applications. It supports data rates up to 3 Gbit/s and a current rating of up to 2.3 A per contact, utilizing Surface Mount Technology (SMT) for assembly. The design incorporates reliable double-sided spring contacts and allows for significant mating tolerances, including ±0.7 mm for misalignment and ±4 degrees for angular inclination. These features make it ideal for various demanding applications in the industrial, medical, automotive, and consumer markets, especially for mezzanine configurations with board-to-board distances from 5 mm to 19 mm.