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MCP23008-E/SS by microchip technology
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FICHA TÉCNICA

MCP23008-E/SS

Microchip Technology

I/O Expander - 8bit - 1.7 MHz - I2C - 1.8 to 5.5 V - SSOP 20-Pin. .. Ver descripción completa

Cumple con RoHS
TUBE embalaje
Accesorios
Accesorios
This product is backed by Ecco Electronics' Certificate of Compliance Guarantee. Rest assured you will receive the Manufacturer's Certificate of Compliance with your order. Certificate of Compliance Guarantee
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Proveedor:
Microchip Technology
Nº de pieza:
MCP23008-E/SS
RoHS:
Yes
HTS:
8542390090
COO:
PH
ECCN:
EAR99
Paquete estándar del proveedor Esta información se proporciona a los clientes que prefieren comprar en múltiplos de la cantidad del paquete estándar del fabricante. Las cantidades mínimas de pedido y los múltiplos de pedido requeridos se presentan con nuestra información de precios y d
67
Tipo de paquete:
TUBE
Dimension:
7.2 x 5.3 x 1.75 mm
Family:
MCP23008
I2C Bus Interface Mode:
Standard Mode,Fast Mode,Fast Mode Plus
Maximum Operating Supply Voltage:
5.5 V
Interface Type:
I²C
Interface Speed:
1700 kHz
Manual Reset:
Yes
Interrupt Output:
Yes
The MCP23008-E/SS is a 8-bit general purpose, parallel I/O Expansion for I²C bus applications. It consists of multiple 8-bit configuration registers for input, output and polarity selection. The system master can enable the I/Os as either inputs or outputs by writing the I/O configuration bits. The data for each input or output is kept in the corresponding input or output register. The polarity of the input port register can be inverted with the polarity inversion register. All registers can be read by the system master.
Palabras clave de búsqueda:
MCP23008ESS
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EN STOCK: 1.068
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Cantidad mínima de pedido:
67
Múltiple:
67
Plazo de entrega de fábrica
5 Semanas
Precio (USD)
Cantidad
Precio por unidad
Precio Ext.
67
$1.114
$74.638
268
$1.068
$286.224
536
$1.054
$564.944
1.005
$1.000
$1,005.000
2.546
$0.963
$2,451.798
5.025
$0.961
$4,829.025
7.504
$0.951
$7,136.304
10.050 +
$0.949
$9,537.450
Suppliers Standard Package
Guías de productos
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Product Changes
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PDF PCN - 15-Feb-2011 - Microchip is announcing the change in package and implementation of new shipping labels for all list
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PDF PCN - 08-Mar-2007 -
PDF PCN - 25-Sep-2007 - Change in shipping box dimensions and lables at MTAI for all Microchip catalog parts Packed in reels
PDF PCN - 24-Jan-2008 - Change in Inner Box Label Format MTAI to include additional Bar Code for total quantity of parts shi
PDF PCN - 15-Oct-2015 - QUALIFICATION OF AG RING PLATED LEAD-FRAME AND G700LS MOLD COMPOUND FOR 20L SSOP PACKAGE
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PDF PCN - 20-Jan-2012 - Microchip is announcing the qualification of 18L PDIP at ALPH (MMT) for the listed products in order
PDF PCN - 11-Nov-2004 -
PDF PCN - 11-Oct-2013 - IMPLEMENT A CONVENTION CHANGE TO THE SALES ORDER (SO) NUMBER
PDF PCN - 01-Nov-2016 - IMPLEMENT PACKING CHANGES WITHOUT INNER BOX FOR MSL 1 MICROCHIP PRODUCTS SHIPPED FROM ALL LOCATIONS
PDF PCN - 06-Jul-2022 - MCP23008/MCP23S08 8-BIT I/O EXPANDER WITH SERIAL INTERFACE REVISION
PDF PCN - 21-Oct-2008 - Microchip is changing the Format and adding quantity barcode to the standard die/wafer inner box lab
PDF PCN - 23-Jul-2009 - Microchip is changing the inner box and outer carton for all packages packed in tubes at MTAI assemb
PDF PCN - 15-Oct-2015 - QUALIFICATION OF AG RING PLATED LEAD-FRAME AND G700LS MOLD COMPOUND FOR 20L SSOP PACKAGE
PDF PCN - 04-Jan-2011 - QUALIFICATION OF 20 & 28L SSOP PACKAGES WITH SG-8300GM MOLD COMPOUND AT MTAI ASSEMBLY SITE
PDF PCN - 09-Jan-2015 - QUALIFICATION OF PALLADIUM COATED COPPER (PDCU) BOND WIRE IN SELECTED PRODUCTS
PDF PCN - 15-Oct-2015 - QUALIFICATION OF AG RING PLATED LEAD-FRAME AND G700LS MOLD COMPOUND FOR 20L SSOP PACKAGE
PDF PCN - 26-Jan-2009 - Microchip Technology is changing the shipping materials from moisture barrier bag to static shielded
PDF PCN - 19-Dec-2014 - QUALIFICATION OF PALLADIUM COATED COPPER (PDCU) BOND WIRE IN SELECTED PRODUCTS
PDF PCN - 22-May-2015 - QUALIFICATION OF A NEW 13 INCH PLASTIC REEL WITH SMALLER WINDOW FOR SELECTED PACKAGES AT MTAI, MMT
PDF PCN - 01-Sep-2017 - IMPLEMENT MARKING CHANGES FOR VIRTUALLY ALL ATMEL PRODUCTS
PDF PCN - 03-Nov-2011 - Microchip is announcing the qualification of 18 & 28L SOIC package with SG-8300GM mold compound at M
PDF PCN - 08-Aug-2013 - Microchip is implementing a convention change to the sales order (SO) number for the listed products
PDF PCN - 22-May-2015 - QUALIFICATION OF A NEW 13 INCH PLASTIC REEL WITH SMALLER WINDOW FOR SELECTED PACKAGES
PDF PCN - 01-Nov-2015 - INTEGRATION OF THE MICREL PCN SYSTEM WITH THE MICROCHIP PCN SYSTEM
PDF PCN - 12-Dec-2018 - QUALIFICATION OF 8390A DIE ATTACH MATERIAL FOR SELECTED PRODUCTS OF THE 120K, 150K, 160K AND 200K
PDF PCN - 14-Feb-2019 - QUALIFICATION OF 8390A DIE ATTACH MATERIAL FOR SELECTED PRODUCTS OF THE 120K, 150K, 160K AND 200K
PDF PCN - 29-Mar-2019 - DATA SHEET - MCP23008/MCP23S08 DATA SHEET
PDF PCN - 10-Sep-2009 - CHANGE INNER BOX AND OUTER CARTON FOR ALL PACKAGES PACKED IN TUBES AT MTAI ASSEMBLY SITE
PDF PCN - 22-Sep-2011 - Microchip is announcing the qualification of 18L PDIP at ALPH (MMT) assembly site for the listed pro
PDF PCN - 07-Apr-2011 - Microchip is announcing the qualification of the listed 20 & 28L SSOP packages products with SG-8300
PDF PCN - 09-Jan-2015 - QUALIFICATION OF PALLADIUM COATED COPPER (PDCU) BOND WIRE IN SELECTED PRODUCTS
PDF PCN - 23-Sep-2010 - Microchip is announcing the qualification of listed 28L SSOP package products with SG-8300GM mold co
PDF PCN - 19-Dec-2014 - QUALIFICATION OF PALLADIUM COATED COPPER (PDCU) BOND WIRE IN SELECTED PRODUCTS
PDF PCN - 20-May-2015 - QUALIFICATION OF A NEW 13 INCH PLASTIC REEL WITH SMALLER WINDOW FOR SELECTED PACKAGES
PDF PCN - 08-Jun-2018 - QUALIFICATION OF PALLADIUMCOATED COPPER WITH GOLD FLASH (CUPDAU) BOND WIRE IN SELECTED PRODUCTS
PDF PCN - 04-Feb-2021 - CUSTOMERS TO IMMEDIATELY PLACE THEIR 12-MONTH NON-CANCELLABLE NON-RESCHEDULABLE BACKLOG ON MICROCHIP

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