5-103639-9 is a single-row wire-to-board receptacle housing from the AMPMODU MTE interconnection system. It features a 0.100 inch (2.54 mm) centerline spacing and is designed for wire-to-board applications. The housing is compatible with wire sizes ranging from 22-30 AWG (0.05-0.3 mm²) and supports various contact plating options including gold and tin. This component is part of TE Connectivity's comprehensive AMPMODU product family, commonly used in electronic equipment requiring reliable wire-to-board connections.