The 4308R-101-331LF is an 8-pin thick film molded SIP (Single In-line Package) resistor network featuring a bussed electrical configuration with 330 ohm resistance elements. This low-profile component incorporates multiple thick-film resistors of equal value, each connected between a separate pin and a common bus line, providing a compact solution for applications requiring matched resistor networks. The device operates at a maximum voltage of 100 V with a temperature coefficient of resistance of ±100 ppm/°C and a package power rating of 1.00 watt at 70°C. The RoHS-compliant tin-plated termination (LF suffix) ensures lead solderability per MIL-STD-202 Method 208, while the low-profile design enables compatibility with DIPs and automatic insertion equipment. This resistor network is ideal for SCSI applications, DRAM termination, and other high-density circuit designs where space and precision are critical.