375324B00035G
Boyd Laconia LLCHeat Sink Passive BGA/FPGA Extruded Adhesive Aluminum 71.4A°C/W Black Anodized .. 查看完整描述
产品属性
属性值
选择属性
找到的产品: 0
供应商:
Boyd Laconia LLC
部件编号:
375324B00035G
别名/又称:
035731
RoHS:
Yes
HTS:
8542900000
COO:
CN
ECCN:
EAR99
供应商标准包装
1
封装类型:
Bulk
器件冷却方式:
BGA6707,FPGA6707
安装方式:
Tape6706
尺寸:
10.2 x 10.2 x 10.26714mm
热阻:
71.46717°C/W
表面处理:
Black Anodized6710
The AAVID THERMALLOY part 375324B00035G is a high-quality, passive heat sink designed to effectively dissipate heat from BGA and FPGA components. It features an extruded adhesive aluminum construction which ensures excellent thermal conductivity and durability. With a thermal resistance of 71.4°C/W, this heat sink efficiently prevents overheating and enables optimal performance of electronic devices. Its black anodized finish not only enhances aesthetics but also provides enhanced corrosion resistance. Invest in this reliable and efficient heat sink for improved thermal management and prolonged component lifespan.
搜索关键词:
375324B00035G
有存货:
3,316
可立即发货
库存数量的起订量:
5
缺货数量的起订量:
480
工厂交货期
9 周
价格 (USD)
数量
单价
总价
5
$7.401
$37.005
100
$4.615
$461.500
250
$4.365
$1,091.250
480
$4.175
$2,004.000
960
$4.067
$3,904.320
1,440
$3.988
$5,742.720
1,920
+
$3.960
$7,603.200
产品指南
English
中文 / 汉语
Español
