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DSPIC33FJ128GP706-I/PT by microchip technology
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产品说明书

DSPIC33FJ128GP706-I/PT

Microchip Technology

MCU - 16-bit dsPIC - 128KB Flash - 16KB RAM - -40°C to +85°C - 3.3V - 64-Pin TQFP - Tray .. 查看完整描述

符合 RoHS
TRAY 包装
附件
附件
This product is backed by Ecco Electronics' Certificate of Compliance Guarantee. Rest assured you will receive the Manufacturer's Certificate of Compliance with your order. 合规证书保证
此产品可能需要额外文件。发货可能会延迟 1-2 天。
产品属性
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找到的产品: 0
供应商:
Microchip Technology
部件编号:
DSPIC33FJ128GP706-I/PT
RoHS:
Yes
HTS:
8542310020
COO:
TH
ECCN:
3A991.a.2
供应商标准包装 此信息提供给偏好按制造商标准包装数量的倍数购买的客户。最小订购数量和要求的订购倍数会与我们的价格和库存信息一起显示。
160
封装类型:
TRAY
工作温度:
-40 to 85 °C
程序存储器容量:
128 KB
ADC分辨率:
10/12 bit
可编程I/O数量:
53
程序存储器类型:
Flash
RAM容量:
16 KB
The MICROCHIP TECH. part DSPIC33FJ128GP706-I/PT is a powerful 16-bit microcontroller unit (MCU) that is designed for applications requiring high-performance digital signal processing capabilities. It features 128KB of Flash memory and 16KB of RAM, providing ample storage for program code and data. With a wide operating temperature range of -40°C to +85°C, this MCU is suitable for use in harsh environments. It operates at a voltage of 3.3V and is housed in a 64-pin TQFP package. The tray packaging ensures easy handling and storage.
搜索关键词:
DSPIC33FJ128GP706IPT
有存货: 160
可立即发货
库存数量的起订量:
5
缺货数量的起订量:
40
工厂交货期
31 周
价格 (USD)
数量
单价
总价
5
$12.43
$62.15
10
$12.40
$124.00
25
$12.37
$309.25
40
$12.34
$493.60
80
$9.26
$740.80
120
$8.64
$1,036.80
160 +
$8.47
$1,355.20
供应商标准包装
产品指南
PDF 数据表
产品更改
PDF PCN - 11-Jul-2017 - IMPLEMENT MARKING CHANGES FOR VIRTUALLY ALL ATMEL PRODUCTS
PDF PCN - 11-Jul-2017 - IMPLEMENT MARKING CHANGES FOR VIRTUALLY ALL ATMEL PRODUCTS
PDF PCN - 15-Feb-2011 - Microchip is announcing the change in package and implementation of new shipping labels for all list
PDF PCN - 08-Aug-2013 - IMPLEMENT A CONVENTION CHANGE TO THE SALES ORDER (SO) NUMBER
PDF PCN - 21-Sep-2015 - INTEGRATION OF THE MICREL PCN SYSTEM WITH THE MICROCHIP PCN SYSTEM
PDF PCN - 27-Mar-2018 - QUALIFICATION OF CUPDAU BOND WIRE IN SELECTED PRODUCTS AVAILABLE IN 64L AND AND 44L TQFP PACKAGE
PDF PCN - 07-Jan-2013 - ERRATA - DSPIC33FJXXXGPX06/X08/X10 FAMILY SILICON ERRATA AND DATA SHEET CLARIFICATION
PDF PCN - 03-Aug-2010 - Mcrochip is announcing the qualification of the listed YGAGx products at an additional wafer fabrica
PDF PCN - 04-Feb-2021 - CUSTOMERS TO IMMEDIATELY PLACE THEIR 12-MONTH NON-CANCELLABLE NON-RESCHEDULABLE BACKLOG ON MICROCHIP
PDF PCN - 22-Aug-2014 - QUALIFICATION OF C194 LEAD-FRAME IN 64L AND 44L TQFP (10X10) PACKAGES AT ANAP (ATP) ASSEMBLY SITE
PDF PCN - 22-Jul-2009 - QUALIFICATION OF TQFP PACKAGE WITH SG-8300ECM MOLD COMPOUND AT MTAI ASSEMBLY SITE
PDF PCN - 09-Jun-2010 - ERRATA-DSPIC33FJXXXGPX06/X08/X10 FAMILY SILICON ERRATA AND DATA SHEET CLARIFICATION
PDF PCN - 08-Aug-2013 - Microchip is implementing a convention change to the sales order (SO) number for the listed products
PDF PCN - 25-Jan-2012 - ERRATA-DSPIC33FJXXXGPX06/X08/X10 FAMILY SILICON ERRATA AND DATA SHEET CLARIFICATION
PDF PCN - 04-Mar-2011 - Microchip is announcing the qualification of YGAB, YGAG, YGAE, YGAK, YGAP, and UDAA masks without po
PDF PCN - 10-Oct-2016 - IMPLEMENT PACKING CHANGES WITHOUT INNER BOX FOR MSL 1 MICROCHIP PRODUCTS SHIPPED FROM ALL LOCATIONS
PDF PCN - 26-Jan-2009 - Microchip Technology is changing the shipping materials from moisture barrier bag to static shielded
PDF PCN - 25-Aug-2011 - Microchip is announcing the qualification of YGAB, YGAG, YGAE, YGAK, YGAP, and UDAA masks without po
PDF PCN - 24-Jan-2008 - Change in Inner Box Label Format MTAI to include additional Bar Code for total quantity of parts shi
PDF PCN - 07-May-2015 - QUALIFICATION OF A NEW 13 INCH PLASTIC REEL WITH SMALLER WINDOW FOR SELECTED PACKAGES AT MTAI, MMT
PDF PCN - 11-Nov-2004 -
PDF PCN - 11-Oct-2013 - Microchip is announcing the qualification of MTAI assembly site with palladium coated copper (PdCu)
PDF PCN - 29-Jan-2010 - ERRATA-DSPIC33FJXXXGPX06/X08/X10 FAMILY SILICON ERRATA AND DATA SHEET CLARIFICATION
PDF PCN - 11-Oct-2013 - QUALIFICATION OF SELECTED PRODUCTS AVAILABLE IN THE 64L TQFP PACKAGE WITH PALLADIUM COATED COPPER
PDF PCN - 21-Sep-2015 - INTEGRATION OF THE MICREL PCN SYSTEM WITH THE MICROCHIP PCN SYSTEM
PDF PCN - 03-Jun-2014 - QUALIFICATION OF C194 LEAD-FRAME IN 64L AND 44L TQFP (10X10) PACKAGES AT ANAP (ATP) ASSEMBLY SITE
PDF PCN - 23-Sep-2015 - CCB 1727 FINAL NOTICE IMPLEMENT LABEL AND PACKING CHANGES FOR MICROCHIP PRODUCTS
PDF PCN - 22-Jul-2009 - Microchip is qualifying the TQFP package with SG-8300ECM mold compound at MTAI assembly site in orde
PDF PCN - 23-Sep-2015 - CCB 1727 FINAL NOTICE: IMPLEMENT LABEL AND PACKING CHANGES FOR MICROCHIP PRODUCTS
PDF PCN - 21-Oct-2008 - Microchip is changing the Format and adding quantity barcode to the standard die/wafer inner box lab
PDF PCN - 04-Mar-2011 - QUALIFICATION OF YGAB, YGAG, YGAE, YGAK, YGAP, AND UDAA MASKS WITHOUT POLYIMIDE PROCESS.
PDF PCN - 20-May-2015 - QUALIFICATION OF A NEW 13 INCH PLASTIC REEL WITH SMALLER WINDOW FOR SELECTED PACKAGES
PDF PCN - 06-Feb-2008 - QUALIFICATION OF CRM1706DJ DIE ATTACH EPOXY AND G770HCD MOLD COMPOUND
PDF PCN - 11-Oct-2013 - QUALIFICATION OF SELECTED PRODUCTS AVAILABLE IN THE 64L TQFP PACKAGE WITH PALLADIUM COATED COPPER
PDF PCN - 12-May-2008 - Modifications have been made to the 16-bit MPLAB C libraries for the self-programming routines_write
PDF PCN - 01-Sep-2009 - MPLAB C for PIC24/dsPIC v3.20 has been released to the web and is available for download. Changes in
PDF PCN - 07-May-2015 - QUALIFICATION OF A NEW 13 INCH PLASTIC REEL WITH SMALLER WINDOW FOR SELECTED PACKAGES
PDF PCN - 10-Nov-2010 - Microchip is announcing the amended of its previous notice CYER-05LNSD835 which announces the implem
PDF PCN - 23-Oct-2009 - QUALIFICATION OF TQFP PACKAGE WITH SG-8300ECM MOLD COMPOUND AT MTAI ASSEMBLY SITE.
PDF PCN - 29-Jan-2014 - Microchip is expanding its test facilities to Microchip Thailand (MMT) for all commercial products i
PDF PCN - 05-Aug-2010 - Microchip is announcing the implementation of shipping label and package change for the listed produ
PDF PCN - 25-Jan-2012 - DSPIC33FJXXXGPX06/X08/X10 FAMILY SILICON ERRATA & DATA SHEET CLARIFICATION ERRATA DOCUMENT REVISION
PDF PCN - 10-Oct-2016 - IMPLEMENT PACKING CHANGES WITHOUT INNER BOX FOR MSL 1 MICROCHIP PRODUCTS SHIPPED FROM ALL LOCATIONS
PDF PCN - 22-Aug-2014 - QUALIFICATION OF C194 LEAD-FRAME IN 64L AND 44L TQFP (10X10) PACKAGES AT ANAP (ATP) ASSEMBLY SITE
PDF PCN - 23-Oct-2009 - Microchip is announcing the final qualification of the TQFP package with SG-8300ECM mold compound at

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