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MCP1650S-E/MS by microchip technology
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产品说明书

MCP1650S-E/MS

Microchip Technology

DC/DC Cntrlr Single-OUT Step Up 850kHz Automotive 8-Pin MSOP Tube .. see full description

符合 RoHS 规定
TUBE 包装
附件
附件
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Product Attribute
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Products found: 0
供应商:
Microchip Technology
部件编号:
MCP1650S-E/MS
RoHS:
Yes
HTS:
8542390090
COO:
TH
ECCN:
EAR99
供应商标准包装 This information is provided for customers who prefer to buy in multiples of the Manufacturer’s Standard Package quantity. Minimum Order Quantities and Required Order Multiples are presented with our price and availability information.
100
Package Type:
TUBE
Maximum Supply Current:
N/A
Maximum Power Dissipation:
N/A
Maximum Input Voltage:
5.5 V
Dimension:
3 x 3 x 0.85 mm
Family:
MCP1650
Number of Outputs:
1
Mounting:
Surface Mount
Minimum Input Voltage:
2.7 V
Maximum Switching Frequency:
850 kHz
The MCP1650S-E/MS is a highly efficient DC/DC controller specifically designed for automotive applications. Its single-output step-up functionality allows for a compact and reliable voltage boost in an automotive power supply system. With a switching frequency of 850kHz, it enables high-speed operation while minimizing component size and cost. This 8-pin MSOP packaged device ensures easy integration into automotive designs, making it ideal for various automotive power management applications.
Search Keywords:
MCP1650SEMS
有存货: 500
Ships today, if you order in
Minimum Order Quantity:
100
Multiple:
100
工厂交货期
6 周
PRICE (USD)
Quantity
Unit Price
Ext. Price
100
$1.16
$116.00
300
$1.14
$342.00
500
$1.13
$565.00
1,000
$1.10
$1,100.00
2,500
$1.09
$2,725.00
5,000
$1.08
$5,400.00
7,500
$1.07
$8,025.00
10,000 +
$1.06
$10,600.00
Suppliers Standard Package
产品指南
PDF 产品说明书
Product Changes
PDF PCN - 10-Nov-2010 - Microchip is announcing the amended of its previous notice CYER-05LNSD835 which announces the implem
PDF PCN - 25-Jun-2010 - Microchip is announcing the qualification of larger paddle in 8L MSOP package with G600F mold compou
PDF PCN - 25-Sep-2007 - Change in shipping box dimensions and lables at MTAI for all Microchip catalog parts Packed in reels
PDF PCN - 12-Mar-2010 - Microchip is announcing the qualification of larger paddle in 8L MSOP package with G600F mold compou
PDF PCN - 23-Sep-2010 - Microchip is announcing the qualification of listed 8L MSOP package products with SG-8300GM mold com
PDF PCN - 11-Mar-2009 - Microchip is qualifying the Molding Compound and Epoxy in 8L MSOP & 10L MSOP Package with G600 moldi
PDF PCN - 15-Feb-2011 - Microchip is announcing the change in package and implementation of new shipping labels for all list
PDF PCN - 30-Jan-2006 - Product Change Notice
PDF PCN - 05-Aug-2010 - Microchip is announcing the implementation of shipping label and package change for the listed produ
PDF PCN - 05-Aug-2008 - Microchip is qualifying G700K old compound for 8L and 10L MSOP (3X3 MM) packaged at ATP assembly to
PDF PCN - 23-Jul-2009 - Microchip is changing the inner box and outer carton for all packages packed in tubes at MTAI assemb
PDF PCN - 08-Nov-2010 - Microchip is announcing the qualification of listed 8L MSOP package products with SG-8300GM mold com
PDF PCN - 09-Jun-2008 - Microchip is changing the material i.e mold compound from MP8000 to G700K for 8L and 10L MSOP packag
PDF PCN - 11-Nov-2004 - Product Change Notice
PDF PCN - 26-Jan-2009 - Microchip Technology is changing the shipping materials from moisture barrier bag to static shielded
PDF PCN - 21-Oct-2008 - Microchip is changing the Format and adding quantity barcode to the standard die/wafer inner box lab
PDF PCN - 24-Jan-2008 - Change in Inner Box Label Format MTAI to include additional Bar Code for total quantity of parts shi

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