MCP1725-3302E/MC by microchip technology
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MCP1725-3302E/MC

Microchip Technology

LDO Regulator Pos 3.3V 0.5A Automotive 8-Pin DFN EP .. 查看完整描述

符合 RoHS
TUBE 包装
附件
附件
This product is backed by Ecco Electronics' Certificate of Compliance Guarantee. Rest assured you will receive the Manufacturer's Certificate of Compliance with your order. 合规证书保证
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供应商:
Microchip Technology
部件编号:
MCP1725-3302E/MC
RoHS:
Yes
HTS:
8542390090
COO:
TH
ECCN:
EAR99
供应商标准包装 供应商原始包装中所含物品的数量、长度、重量或体积，以便高效存储、搬运和配送。
150
封装类型:
TUBE
最大压差电压 @ 电流:
0.35@500mA V
结到外壳热阻:
N/A
精度:
±2 %
电源调整率:
0.05(Typ) %/V
结到环境热阻:
52(Typ) °C/W
尺寸:
2 x 3 x 0.95(Max) mm
功能:
LDO
负载调整率:
0.5(Typ) %
系列:
MCP1725
The MICROCHIP TECH. MCP1725-3302E/MC is a low-dropout (LDO) regulator with a positive voltage output of 3.3V and a maximum current rating of 0.5A. Designed specifically for automotive applications, this regulator offers reliable and stable power supply to various electronic systems in a vehicle. The 8-Pin DFN EP package ensures compactness and easy integration into space-constrained designs.
搜索关键词:
MCP17253302EMC
  提供不同的包装选项。  查看替代品
有存货: 900
发货 today, 输入设置值。
最小订购数量:
150
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150
工厂交货期
13 周
价格 (USD)
数量
单价
总价
150
$0.539
$80.850
600
$0.533
$319.800
1,050
$0.529
$555.450
2,550
$0.527
$1,343.850
5,100
$0.525
$2,677.500
7,500
$0.524
$3,930.000
10,050
$0.523
$5,256.150
15,000 +
$0.522
$7,830.000
供应商标准包装
产品指南
PDF 数据表
产品更改
PDF PCN - 26-Jan-2009 - Microchip Technology is changing the shipping materials from moisture barrier bag to static shielded
PDF PCN - 30-Nov-2011 - Microchip is announcing the qualification of 8L SOIC with SG-8300GM mold compound at ALPH (MMT) asse
PDF PCN - 24-Jan-2008 - Change in Inner Box Label Format MTAI to include additional Bar Code for total quantity of parts shi
PDF PCN - 21-Oct-2008 - Microchip is changing the Format and adding quantity barcode to the standard die/wafer inner box lab
PDF PCN - 22-Sep-2011 - Microchip is announcing the qualification of 8L SOIC with SG-8300GM MC at ALPH (MMT) assembly site f
PDF PCN - 15-May-2011 - QUALIFICATION OF GEAXX MASKS WITH THE CMP PROCESS
PDF PCN - 10-Jul-2009 - Qualification Of 8L Dfn Package With Crm1076Dj Epoxy And G770Hcd Mold Compound At Unisem Assembly
PDF PCN - 28-Feb-2009 - Qualification Of 8L Dfn Package With Crm1076Dj Epoxy And G770Hcd Mold Compound At Unisem Assembly
PDF PCN - 30-May-2011 - Qualification Of 8L Dfn (2X3) Packages With Eftec-64T Lead Frame At Nseb (Utl)
PDF PCN - 28-Mar-2011 - Microchip is announcing the qualification of listed GEAxx masks with the CMP process in order to imp
PDF PCN - 17-Dec-2008 - Microchip Is Qualifying The 8L Dfn Package With Crm1076Dj Epoxy And G770Hcd Mold Compound At Unisem
PDF PCN - 22-Feb-2011 - Microchip Is Announcing The Qualification Of 8L Dfn (2X3) Packages With Eftec-64T Leadframe At Nseb
PDF PCN - 24-Jun-2009 - Microchip Is Qualifying The 8L Dfn Package With Crm1076Dj Epoxy And G770Hcd Mold Compound At Unisem
PDF PCN - 19-May-2011 - Microchip is announcing the qualification of 8L DFN (2x3) packages with EFTEC-64T leadframe at NSEB
PDF PCN - 25-Sep-2007 - Change in shipping box dimensions and lables at MTAI for all Microchip catalog parts Packed in reels
PDF PCN - 15-Feb-2011 - Microchip is announcing the change in package and implementation of new shipping labels for all list

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